公开(公告)号：US20030186169A1

公开(公告)日：2003-10-02

申请号：US10394342

申请日：2003-03-22

Applicant: Shipley Company, L.L.C.

Inventor： Michael K. Gallagher ,  Yujian You

IPC: G03F007/16 ,  G21K005/00 ,  B32B003/10 ,  G03F007/20 ,  G03F007/40 ,  G21G005/00 ,  H01L021/44

CPC classification number: H01L21/02137 ,  B29C67/202 ,  H01L21/02203 ,  H01L21/02282 ,  H01L21/3122 ,  H01L21/31695 ,  H01L21/481 ,  H01L21/7682 ,  H01L2221/1047 ,  H05K1/024 ,  H05K2201/0116 ,  Y10T428/24331

Abstract: Disclosed are methods of manufacturing electronic devices, particularly integrated circuits. Such methods include the use of low dielectric constant material prepared by using a removable porogen material.

公开(公告)号：US06613413B1

公开(公告)日：2003-09-02

申请号：US09300762

申请日：1999-04-26

Applicant: Robert M. Japp ,  Mark D. Poliks

Inventor： Robert M. Japp ,  Mark D. Poliks

IPC: B32B310

CPC classification number: H05K3/38 ,  H05K3/429 ,  H05K3/4641 ,  H05K2201/0116 ,  H05K2201/0281 ,  H05K2201/029 ,  H05K2201/0769 ,  H05K2201/09309 ,  H05K2201/09681 ,  H05K2203/1131 ,  Y10S428/901 ,  Y10T29/49002 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T156/1052 ,  Y10T428/24273 ,  Y10T428/24917

Abstract: Power and ground planes used in Printed Circuit Boards (PCBs) having porous, conductive materials allow liquids (e.g., water and/or other solvents) to pass through the power and ground planes, thus decreasing failures in PCBs (or PCBs used as laminate chip carriers) caused by cathodic/anodic filament growth and delamination of insulators. Porous conductive materials suitable for use in PCBs may be formed by using metal-coated organic cloths (such as polyester or liquid crystal polymers) or fabrics (such as those made from carbon/graphite or glass fibers), using metal wire mesh instead of metal sheets, using sintered metal, or making metal sheets porous by forming an array of holes in the metal sheets. Fabrics and mesh may be woven or random. If an array of holes is formed in a metal sheet, such an array may be formed with no additional processing steps than are performed using conventional PCB assembly methods.

Abstract translation: 在具有多孔导电材料的印刷电路板（PCB）中使用的电源和接地层允许液体（例如水和/或其他溶剂）通过电源和接地层，从而减少PCB（或用作层压芯片的PCB）故障 载体）由绝缘体的阴极/阳极丝生长和分层引起。 适用于PCB的多孔导电材料可以通过使用金属涂布的有机布（例如聚酯或液晶聚合物）或织物（例如由碳/石墨或玻璃纤维制成的那些）形成，使用金属丝网代替金属 使用烧结金属，或者通过在金属板中形成孔阵列来制造多孔的金属片。 织物和网可以编织或随机。 如果在金属板中形成孔阵列，则可以形成这样的阵列，而不需要使用常规PCB组装方法执行的附加处理步骤。

公开(公告)号：US06598292B1

公开(公告)日：2003-07-29

申请号：US09554395

申请日：2000-07-13

Applicant: Shigetoshi Segawa ,  Yasuyuki Baba ,  Katsuyoshi Ishikawa ,  Kazuhiko Ihara

Inventor： Shigetoshi Segawa ,  Yasuyuki Baba ,  Katsuyoshi Ishikawa ,  Kazuhiko Ihara

IPC: H01K310

CPC classification number: H05K3/4061 ,  B41F15/20 ,  B41P2215/134 ,  H05K3/1216 ,  H05K3/4053 ,  H05K2201/0116 ,  H05K2201/0284 ,  H05K2203/0152 ,  H05K2203/0156 ,  H05K2203/082 ,  Y10T29/49117 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: A manufacturing method of a circuit board comprises the steps of: (a) feeding a printing stage having a porous member comprising a porous plate and a porous sheet, the porous sheet is composed of 90 wt % to 98 wt % of cellulose; (b) placing a plate for the circuit board having a pierced hole above the porous member; and (c) filling a conductive material in the pierced hole from an upper side of the plate for circuit board by sucking the porous member at a prescribed vacuum pressure from a back of the porous member.

Abstract translation: 电路板的制造方法包括以下步骤：（a）馈送具有包括多孔板和多孔片的多孔构件的印刷台，所述多孔片由90重量％至98重量％的纤维素组成; （b）在所述多孔构件上方设置具有穿孔的所述电路板的板; 以及（c）从所述多孔构件的背面以规定的真空压力吸取所述多孔构件，从所述电路板用板的上侧填充所述穿孔孔内的导电性材料。

公开(公告)号：US20030129863A1

公开(公告)日：2003-07-10

申请号：US10044204

申请日：2002-01-10

Applicant: International Business Machines Corporation

Inventor： David J. Alcoe ,  Varaprasad Venkata Calmidi ,  Krishna Darbha ,  Sanjeev Balwant Sathe

IPC: H05K001/00 ,  H01R012/00

CPC classification number: H05K7/1061 ,  H01L23/3737 ,  H01L23/4006 ,  H01L23/42 ,  H01L2924/0002 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/16195 ,  H05K1/0203 ,  H05K3/303 ,  H05K3/3436 ,  H05K2201/0116 ,  H05K2201/10348 ,  H05K2201/10393 ,  H05K2201/10734 ,  H05K2201/2036 ,  Y02P70/613 ,  H01L2924/00

Abstract: A heat dissipating flexible or resilient standoff is mechanically clamped between an electronic module and substrate, such as, PCB. The clamping arrangement comprises a heat sink compressing a thermally conductive flexible interface pad over the upper surface of the electronic module by way of mechanical linkage to the PCB. The heat dissipating flexible standoff provides a force opposing the compression force to thereby reduce stress on solder ball connections between electronic module and PCB. Thermally conductive flexible standoffs in the form of spring arrangements, such as a wire mesh, act to provide heat dissipation by both thermal conduction and thermal convection. A thermally conductive flexible polymer pad and a layer of porous metal foam may also act as thermally conductive standoffs.

Abstract translation: 散热的柔性或弹性支座被机械夹紧在电子模块和基板（例如PCB）之间。 夹紧装置包括通过机械连接到PCB来在电子模块的上表面上压缩导热柔性界面垫的散热器。 散热柔性支座提供与压缩力相反的力，从而减少电子模块和PCB之间焊球连接的应力。 弹性布置形式的导热弹性支座，如丝网，用于通过热传导和热对流来提供散热。 导热柔性聚合物垫和多孔金属泡沫层也可以用作导热支座。

公开(公告)号：US06565954B2

公开(公告)日：2003-05-20

申请号：US09728286

申请日：2000-12-01

Applicant: Daizou Andou ,  Toshio Sugawa ,  Tadashi Nakamura ,  Hideki Higashitani ,  Masahide Tsukamoto

Inventor： Daizou Andou ,  Toshio Sugawa ,  Tadashi Nakamura ,  Hideki Higashitani ,  Masahide Tsukamoto

IPC: B32B300

CPC classification number: H05K3/20 ,  H05K3/007 ,  H05K3/205 ,  H05K3/386 ,  H05K3/4069 ,  H05K3/4614 ,  H05K3/4617 ,  H05K3/462 ,  H05K3/4623 ,  H05K3/4658 ,  H05K3/4688 ,  H05K2201/0116 ,  H05K2201/0195 ,  H05K2201/10378 ,  H05K2203/0152 ,  H05K2203/0384 ,  H05K2203/061 ,  H05K2203/1461 ,  Y10S428/901 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T428/24917 ,  Y10T428/2804

Abstract: Through holes formed in an electrical insulating substrate having adhesive layers on its both surfaces are filled with a conductor. Then, supporting bases having wiring layers with a predetermined pattern are laminated on both the surfaces of the electrical insulating substrate, which are then heated and pressurized. After that, the supporting bases are removed, thus obtaining a circuit board in which the wiring layers have been embedded in the adhesive layers. The conductor within the through holes are compressed sufficiently, thus forming minute via holes with high reliability.

Abstract translation: 形成在其两面具有粘合层的电绝缘基板中的通孔填充有导体。 然后，将具有预定图案的布线层的支撑基板层压在电绝缘基板的两个表面上，然后被加热和加压。 之后，除去支撑基底，从而获得其中布线层已经嵌入粘合剂层中的电路板。 通孔内的导体被充分压缩，从而形成具有高可靠性的微通孔。

公开(公告)号：US20020197834A1

公开(公告)日：2002-12-26

申请号：US10161707

申请日：2002-06-05

Inventor： Koji Asakawa ,  Yasuyuki Hotta ,  Shigeru Matake ,  Toshiro Hiraoka

IPC: H01L021/20

CPC classification number: H05K3/10 ,  H05K1/034 ,  H05K3/0002 ,  H05K3/0082 ,  H05K3/107 ,  H05K3/185 ,  H05K3/422 ,  H05K2201/0116 ,  H05K2201/015 ,  H05K2203/056 ,  H05K2203/107 ,  H05K2203/1147 ,  Y10T29/49155 ,  Y10T29/49215

Abstract: Disclosed is a method for manufacturing a composite member comprising a porous substrate, a via, and a wiring. The method comprises exposing a first region and a second region in the porous substrate to a exposure beam through a mask, the second region exposed by the exposure beam not more than 50% of the exposure of the first region, the exposure beam having the wavelength that an average size of voids of the porous substrate is, as expressed by a radius of gyration, {fraction (1/20)} to 10 times, and forming the via and the wiring by infiltrating a conductive material into the first region and the second region respectively.

Abstract translation: 公开了一种用于制造包括多孔基底，通孔和布线的复合构件的方法。 该方法包括将多孔基底中的第一区域和第二区域暴露于通过掩模的曝光光束，由曝光光束曝光的第二区域不大于第一区域的曝光的50％，曝光光束具有波长 由旋转半径表示的多孔基材的空隙的平均尺寸为1/20至10倍，并且分别通过将导电材料渗透到第一区域和第二区域中而形成通孔和布线。

公开(公告)号：US06494174B1

公开(公告)日：2002-12-17

申请号：US09695478

申请日：2000-10-24

Applicant: Paul D. Daly

Inventor： Paul D. Daly

IPC: F02M35104

CPC classification number: F02M35/10321 ,  B60R16/0207 ,  F02B75/22 ,  F02D41/3005 ,  F02D2400/18 ,  F02D2400/22 ,  F02M35/10216 ,  F02M35/10249 ,  F02M35/10268 ,  F02M35/10288 ,  F02M35/10301 ,  F02M35/10334 ,  F02M35/1165 ,  F02M35/161 ,  F05C2225/08 ,  H05K1/028 ,  H05K3/0064 ,  H05K3/281 ,  H05K2201/0116

Abstract: A wiring assembly for a plastic intake manifold mounted to an internal combustion engine of a motor vehicle includes a flexible circuit assembly disposed within foam covering the intake manifold. The flexible circuit assembly provides for electrical communication between a controller and a plurality of electrical devices. In one embodiment the electrical devices are integral to the flexible circuit assembly to create a flexible circuit/electrical device assembly forming a single replaceable unit. In another embodiment, multiple flexible circuits are sandwiched between layers of foam, with each flexible circuit separated from the others by layers of foam. Each of the multiple flexible circuits attaches to different types electrical devices or sensors. The invention also provides for a decorative skin disposed over the layers of foam that may include a printed design to eliminate the need for an additional decorative engine cover.

Abstract translation: 安装到机动车辆的内燃机的塑料进气歧管的接线组件包括设置在覆盖进气歧管的泡沫内的柔性电路组件。 柔性电路组件提供控制器和多个电气设备之间的电气通信。 在一个实施例中，电气装置与柔性电路组件成一体，以形成形成单个可更换单元的柔性电路/电气装置组件。 在另一个实施例中，多个柔性电路夹在泡沫层之间，每个柔性电路通过泡沫层与其它柔性电路隔开。 多个柔性电路中的每一个连接到不同类型的电气设备或传感器。 本发明还提供了设置在泡沫层之上的装饰性皮肤，其可以包括印刷设计，以消除对另外的装饰性发动机罩的需要。

公开(公告)号：US20020164467A1

公开(公告)日：2002-11-07

申请号：US10136053

申请日：2002-04-30

Inventor： Toshiyuki Kawashima ,  Nobuharu Tahara ,  Kenichi Ikeda

IPC: B32B003/00 ,  H05K001/00

CPC classification number: H05K3/4069 ,  H05K3/4652 ,  H05K2201/0116 ,  H05K2201/0154 ,  H05K2203/0191 ,  H05K2203/0425 ,  H05K2203/1461 ,  Y10S156/922 ,  Y10T156/11 ,  Y10T428/24917

Abstract: The present invention provides a method of manufacturing a wiring board, including the steps of forming a through hole on a prepreg having a releasing resin film on at least one of its surfaces, the prepreg being obtained by impregnating a porous film having a thickness of 5 to 90 nullm and a porosity of 30 to 98% with a half cured thermosetting resin, filling the through hole with a conductive paste containing a conductive filler, peeling the resin film, laminating a metal foil on a surface from which the resin film is peeled, and heating and pressurizing the laminated product. Moreover, the present invention provides a wiring board including an insulating layer obtained by impregnating a porous film having a thickness of 5 to 90 nullm and a porosity of 30 to 98% with a thermosetting resin and curing them, and a conductive connection structure between wiring layers in which a through hole provided on the insulating layer is filled with a conductive paste, wherein the conductive connection structure has the conductive filler at only a boundary surface with the porous film and in an inner part thereof.

Abstract translation: 本发明提供一种制造布线板的方法，包括以下步骤：在至少一个表面上具有释放树脂膜的预浸料坯上形成通孔，将预浸料通过浸渍厚度为5μm的多孔膜 用半固化的热固性树脂填充至90μm和30至98％的孔隙率，用含有导电填料的导电膏填充通孔，剥离树脂膜，在剥离树脂膜的表面上层压金属箔 ，并对层压制品进行加热和加压。 此外，本发明提供一种布线基板，其包括通过用热固性树脂浸渍厚度为5-90μm，孔隙率为30-98％的多孔膜并固化而获得的绝缘层，以及布线之间的导电连接结构 其中设置在绝缘层上的通孔填充有导电膏的层，其中导电连接结构仅在与多孔膜的边界面及其内部具有导电填料。

公开(公告)号：US06475555B2

公开(公告)日：2002-11-05

申请号：US09429256

申请日：1999-10-29

Applicant: Jon A. Casey ,  Dinesh Gupta ,  Lester Wynn Herron ,  John U. Knickerbocker ,  David C. Long ,  Jawahar P. Nayak ,  Brenda L. Peterson ,  Robert A. Rita

Inventor： Jon A. Casey ,  Dinesh Gupta ,  Lester Wynn Herron ,  John U. Knickerbocker ,  David C. Long ,  Jawahar P. Nayak ,  Brenda L. Peterson ,  Robert A. Rita

IPC: B05D132

CPC classification number: H05K3/1233 ,  H01L21/4867 ,  H01L23/49883 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/092 ,  H05K3/227 ,  H05K2201/0116 ,  H05K2203/0783 ,  H01L2924/00

Abstract: A process wherein a low viscosity, metal-containing paste is screened onto a ceramic greensheet and then sets up to increase its viscosity. In one method, the low viscosity is caused by excess solvent which is then blotted or otherwise removed so that the viscosity of the paste is increased. In an alternative method, the low viscosity paste contains a cross-linking agent which causes the paste to increase its viscosity after screening.

Abstract translation: 一种方法，其中将低粘度的含金属浆料筛选到陶瓷毛坯上，然后设置以增加其粘度。 在一种方法中，低粘度是由过量的溶剂引起的，然后将其印迹或以其它方式除去，使得糊料的粘度增加。 在另一种方法中，低粘度糊剂含有交联剂，其使糊剂在筛选后增加其粘度。

公开(公告)号：US20020158110A1

公开(公告)日：2002-10-31

申请号：US09845448

申请日：2001-04-30

Applicant: International Business Machines Corporation

Inventor： David Vincent Caletka ,  Krishna Darbha ,  Donald W. Henderson ,  Lawrence P. Lehman ,  George Henry Thiel

IPC: B23K031/00 ,  B23K031/02

CPC classification number: H01L23/49811 ,  B23K3/0623 ,  B23K2101/40 ,  H01L21/563 ,  H01L23/13 ,  H01L23/49838 ,  H01L23/49894 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/05017 ,  H01L2224/05026 ,  H01L2224/05078 ,  H01L2224/05551 ,  H01L2224/05568 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/8121 ,  H01L2224/81385 ,  H01L2224/81815 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2924/00013 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/15787 ,  H05K1/113 ,  H05K3/284 ,  H05K3/3436 ,  H05K2201/0116 ,  H05K2201/0133 ,  H05K2201/0382 ,  H05K2201/068 ,  H05K2201/09036 ,  H05K2201/09509 ,  H05K2201/0969 ,  H05K2201/10674 ,  H05K2201/10977 ,  Y02P70/613 ,  Y10T29/49144 ,  Y10T29/49146 ,  Y10T29/49149 ,  Y10T29/49171 ,  H01L2924/00011 ,  H01L2924/00 ,  H01L2224/29099 ,  H01L2224/05552

Abstract: Solder balls, such as, low melt C4 solder balls undergo volume expansion during reflow. Where the solder balls are encapsulated, expansion pressure can cause damage to device integrity. A volume expansion region in the semiconductor chip substrate beneath each of the solder balls accommodates volume expansion. Air-cushioned diaphgrams, deformable materials and non-wettable surfaces may be used to permit return of the solder during cooling to its original site. A porous medium with voids sufficient to accommodate expansion may also be used.

Abstract translation: 诸如低熔点C4焊球的焊球在回流期间经历体积膨胀。 当焊球被封装时，膨胀压力可能会损坏器件的完整性。 每个焊球下方的半导体芯片基板中的体积扩展区容纳体积膨胀。 可以使用气垫缓冲图，可变形材料和不可润湿的表面，以允许在冷却期间焊料返回到其原始位置。 也可以使用具有足以适应膨胀的空隙的多孔介质。