公开(公告)号：US20130255997A1

公开(公告)日：2013-10-03

申请号：US13881150

申请日：2011-10-26

Applicant: Adriano Zecchina ,  Fabrizio Bardelli ,  Serena Bertarione ,  Giuseppe Caputo ,  Paolo Castelli ,  Federico Cesano ,  Pierluigi Civera ,  Danilo Demarchi ,  Roberta Galli ,  Gianfranco Innocenti ,  Domenica Scarano ,  Antonino Veca ,  Marco Zanetti

Inventor： Adriano Zecchina ,  Fabrizio Bardelli ,  Serena Bertarione ,  Giuseppe Caputo ,  Paolo Castelli ,  Federico Cesano ,  Pierluigi Civera ,  Danilo Demarchi ,  Roberta Galli ,  Gianfranco Innocenti ,  Domenica Scarano ,  Antonino Veca ,  Marco Zanetti

IPC: H05K3/10 ,  H05K1/02

CPC classification number: H05K3/105 ,  H05K1/02 ,  H05K1/0373 ,  H05K2201/026 ,  H05K2201/0323 ,  H05K2203/107 ,  H05K2203/1136 ,  Y10T29/49155

Abstract: Process for producing conductive and/or piezoresistive traces in a non-conductive polymeric substrate through laser irradiation, characterised in that said substrate is a composite polymeric material, comprising the matrix of a polymer not susceptible to carbonisation through laser irradiation and a dispersed phase comprising carbon nano fibres and/or nanotubes.

Abstract translation: 用于通过激光照射在非导电聚合物基底中产生导电和/或压阻迹线的方法，其特征在于，所述基底是复合聚合物材料，其包含通过激光照射不易于碳化的聚合物基体和包含碳的分散相 纳米纤维和/或纳米管。

公开(公告)号：US20130199826A1

公开(公告)日：2013-08-08

申请号：US13822754

申请日：2011-09-13

Applicant: David Thomas Britton ,  Margit Harting

Inventor： David Thomas Britton ,  Margit Harting

IPC: H05K1/16

CPC classification number: H05K1/16 ,  H01C1/02 ,  H01C7/008 ,  H01G2/10 ,  H01G11/28 ,  H01G11/48 ,  H01G11/82 ,  H05K1/0306 ,  H05K1/0326 ,  H05K1/0386 ,  H05K1/092 ,  H05K1/162 ,  H05K1/167 ,  H05K3/12 ,  H05K3/281 ,  H05K3/4015 ,  H05K2201/0323 ,  H05K2201/10287 ,  H05K2203/0278 ,  Y02E60/13

Abstract: An electronic component assembly comprises a printed component structure comprising at least one of a semiconducting ink, an insulating ink and a conducting ink deposited onto a substrate. The component structure defining at least one contact area, with a connecting lead disposed against or adjacent to the contact area. At least one layer of electrically insulating material encloses the component structure. At least one of the substrate and the layer of electrically insulating material comprises packaging material. The component structure can be printed on a substrate such as paper or another soft material, which is secured to a layer of insulating packaging material such as polyethylene. Instead, the substrate can be the insulating packaging material itself. Variations using hard and soft substrates are possible, and various examples of electronic component assembly are disclosed.

Abstract translation: 电子部件组件包括印刷部件结构，其包括沉积到基板上的半导体油墨，绝缘油墨和导电油墨中的至少一种。 所述部件结构限定至少一个接触区域，其中连接引线设置成抵靠或邻近所述接触区域。 至少一层电绝缘材料包围组件结构。 衬底和电绝缘材料层中的至少一个包括包装材料。 组件结构可以印刷在诸如纸或其他软材料的基板上，该材料固定到诸如聚乙烯的绝缘包装材料层上。 相反，衬底可以是绝缘包装材料本身。 使用硬质和软性衬底的变型是可能的，并且公开了电子部件组装的各种示例。

公开(公告)号：US20130168841A1

公开(公告)日：2013-07-04

申请号：US13340430

申请日：2011-12-29

Applicant: Sam Ziqun Zhao ,  Kevin Kunzhong Hu ,  Sampath K.V. Karikalan ,  Rezaur Rahman Khan ,  Pieter Vorenkamp ,  Xiangdong Chen

Inventor： Sam Ziqun Zhao ,  Kevin Kunzhong Hu ,  Sampath K.V. Karikalan ,  Rezaur Rahman Khan ,  Pieter Vorenkamp ,  Xiangdong Chen

IPC: H01L23/495 ,  H01L21/326 ,  H05K1/11 ,  B82Y99/00

CPC classification number: H01L23/49827 ,  B82Y10/00 ,  H01L21/485 ,  H01L21/486 ,  H01L23/49822 ,  H01L2224/16225 ,  H05K1/029 ,  H05K3/4038 ,  H05K2201/0248 ,  H05K2201/026 ,  H05K2201/0323 ,  H05K2201/10378 ,  H05K2203/104 ,  H05K2203/105

Abstract: An exemplary implementation of the present disclosure includes a programmable interposer having top and bottom interface electrodes and conductive particles interspersed within the programmable interposer. The conductive particles are capable of forming an aligned configuration between the top and bottom interface electrodes in response to application of an energy field to the programmable interposer so as to electrically connect the top and bottom interface electrodes. The conductive particles can have a conductive outer surface. Also, the conductive particles can be spherical. The conductive particles can be within a bulk material in an interface layer in the programmable interposer, and the bulk material can be cured to secure programmed paths between the top and bottom interface electrodes.

Abstract translation: 本公开的示例性实现包括具有顶部和底部接口电极和散布在可编程插值器内的导电粒子的可编程插值器。 响应于将能量场施加到可编程内插器，导电颗粒能够在顶部和底部界面电极之间形成对准的构造，以便电连接顶部和底部界面电极。 导电颗粒可具有导电外表面。 此外，导电粒子可以是球形的。 导电颗粒可以在可编程插入器中的界面层中的体积材料内，并且可以固化块状材料以确保顶部和底部界面电极之间的编程路径。

公开(公告)号：US20130092881A1

公开(公告)日：2013-04-18

申请号：US13272527

申请日：2011-10-13

Applicant: Kenneth Burnham ,  Richard Skov

Inventor： Kenneth Burnham ,  Richard Skov

IPC: H01B1/24 ,  C25D15/00 ,  H01B1/20 ,  B82B3/00 ,  B82Y30/00

CPC classification number: H01B1/24 ,  B82Y30/00 ,  C09J9/02 ,  H05K1/095 ,  H05K2201/0245 ,  H05K2201/026 ,  H05K2201/0323 ,  H05K2203/105 ,  H05K2203/1136

Abstract: A method of forming an electrically conductive composite is disclosed that includes the steps of providing a first dielectric material and a second conductive material that is substantially dispersed within the first dielectric material; and applying an electric field through at least a portion of the combined first dielectric material and second conductive material such that the second conductive material undergoes electrophoresis and forms at least one electrically conductive path through the electrically conductive composite along the direction of the applied electric field.

Abstract translation: 公开了一种形成导电复合材料的方法，其包括提供基本上分散在第一介电材料内的第一介电材料和第二导电材料的步骤; 以及通过所述组合的第一介电材料和第二导电材料的至少一部分施加电场，使得所述第二导电材料经历电泳并且沿着所施加的电场的方向形成通过所述导电复合材料的至少一个导电路径。

公开(公告)号：US20130048346A1

公开(公告)日：2013-02-28

申请号：US13552526

申请日：2012-07-18

Applicant: William S. MCKINLEY ,  Steve T. Nicholas ,  Jeffery A. Dean

Inventor： William S. MCKINLEY ,  Steve T. Nicholas ,  Jeffery A. Dean

IPC: H05K7/20 ,  H05K1/11

CPC classification number: H05K1/0353 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/01322 ,  H01L2924/14 ,  H05K1/0207 ,  H05K1/021 ,  H05K1/024 ,  H05K1/0243 ,  H05K1/183 ,  H05K3/429 ,  H05K3/445 ,  H05K3/4641 ,  H05K3/4688 ,  H05K3/4697 ,  H05K2201/0323 ,  H05K2201/068 ,  H05K2201/09309 ,  H05K2203/049 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/00

Abstract: The present invention relates to a method of manufacturing a printed wiring board (PWB) of the type depicted in FIG. 1, and to the resulting PWB. Such a PWB comprises a first substrate and alternating layers of a second substrate and a metal layer. The layer 2 metallization of the PWB is a thick layer of a composite engineered metal material having a configurable coefficient of thermal expansion (CTE) to provide CTE matching with respect to radio frequency (RF) components mounted on the PWB, and having substantial heat dissipation properties to dissipate heat generated by the RF components. This composite metal layer also provides a ground plane for the RF components.

Abstract translation: 本发明涉及图1所示类型的印刷电路板（PWB）的制造方法。 1和所得的PWB。 这样的PWB包括第一衬底和第二衬底和金属层的交替层。 PWB的层2金属化是具有可配置的热膨胀系数（CTE）的复合工程金属材料的厚层，以提供相对于安装在PWB上的射频（RF）部件的CTE匹配，并且具有显着的散热 性能消散由RF组件产生的热量。 该复合金属层还为RF部件提供接地平面。

公开(公告)号：US20130009825A1

公开(公告)日：2013-01-10

申请号：US13619696

申请日：2012-09-14

Applicant: Ilsoon LEE ,  Lawrence T. DRZAL ,  Jue LU ,  Troy R. HENDRICKS

Inventor： Ilsoon LEE ,  Lawrence T. DRZAL ,  Jue LU ,  Troy R. HENDRICKS

IPC: H01Q1/38 ,  H05K3/00 ,  H05K1/09 ,  B82Y40/00

CPC classification number: G03F7/0002 ,  B82Y10/00 ,  B82Y40/00 ,  C01B32/20 ,  H05K1/0259 ,  H05K3/1275 ,  H05K2201/0323 ,  H05K2203/0108 ,  H05K2203/09 ,  H05K2203/105 ,  Y10T428/30

Abstract: Methods involve a combination of polyelectrolyte multilayer (PEM) coating or silane self assembly on a substrate; microcontact printing; and conductive graphite particles, especially size controlled highly conductive exfoliated graphite nanoplatelets. The conductive graphite particles are coated with a charged polymer such as sulfonated polystyrene. The graphite particles are patterned using microcontact printing and intact pattern transfer on a substrate that has an oppositely-charged surface. The method allows for conductive organic patterning on both flat and curved surfaces and can be used in microelectronic device fabrication.

Abstract translation: 方法涉及在基底上组合聚电解质多层（PEM）涂层或硅烷自组装; 微接触印刷; 和导电石墨颗粒，特别是尺寸控制的高导电性剥离石墨纳米片。 导电石墨颗粒用带电聚合物如磺化聚苯乙烯涂覆。 使用微接触印刷和在具有相反电荷的表面的基底上的完整图案转印来对石墨颗粒进行图案化。 该方法允许在平坦和弯曲表面上的导电有机图案化，并且可以用于微电子器件制造。

公开(公告)号：US08337949B2

公开(公告)日：2012-12-25

申请号：US12122293

申请日：2008-05-16

Applicant: Jae-Young Choi ,  Hyeon-Jin Shin ,  Seon-mi Yoon

Inventor： Jae-Young Choi ,  Hyeon-Jin Shin ,  Seon-mi Yoon

IPC: B05D3/02

CPC classification number: C30B19/08 ,  B81B2207/056 ,  B81C1/00031 ,  B82Y30/00 ,  B82Y40/00 ,  C01B32/188 ,  C30B19/12 ,  C30B25/10 ,  C30B25/18 ,  C30B29/02 ,  C30B29/64 ,  H01L29/1606 ,  H01L29/43 ,  H05K3/105 ,  H05K2201/0323 ,  Y10S977/734 ,  Y10S977/842 ,  Y10S977/843 ,  Y10T428/24802 ,  Y10T428/24851 ,  Y10T428/24917

Abstract: Provided are a graphene pattern and a process of preparing the same. Graphene is patterned in a predetermined shape on a substrate to form the graphene pattern. The graphene pattern can be formed by forming a graphitizing catalyst pattern on a substrate, contacting a carbonaceous material with the graphitizing catalyst and heat-treating the resultant.

Abstract translation: 提供了石墨烯图案及其制备方法。 石墨烯在基板上以预定形状图案化以形成石墨烯图案。 石墨烯图案可以通过在基板上形成石墨化催化剂图案，使碳质材料与石墨化催化剂接触并对所得物进行热处理而形成。

公开(公告)号：US20120312587A1

公开(公告)日：2012-12-13

申请号：US13339696

申请日：2011-12-29

Applicant: JIA-SHYONG CHENG ,  PO-SHAN HUANG ,  PO-SHENG SHIH ,  CHUN-YI HU ,  CHIH-HAN CHAO ,  JEAH-SHENG WU

Inventor： JIA-SHYONG CHENG ,  PO-SHAN HUANG ,  PO-SHENG SHIH ,  CHUN-YI HU ,  CHIH-HAN CHAO ,  JEAH-SHENG WU

IPC: H05K1/03 ,  H05K1/09 ,  B82Y99/00

CPC classification number: B82Y30/00 ,  H05K1/0287 ,  H05K1/097 ,  H05K3/386 ,  H05K2201/0108 ,  H05K2201/026 ,  H05K2201/0323

Abstract: A patterned conductive element includes a substrate having a surface, an adhesive layer located on the surface, and a patterned carbon nanotube layer located on the adhesive layer. Part of the patterned carbon nanotube layer is embedded in the adhesive layer, and the other part of the patterned carbon nanotube layer is exposed from the adhesive layer.

Abstract translation: 图案化导电元件包括​​具有表面的基板，位于表面上的粘合剂层和位于粘合剂层上的图案化碳纳米管层。 图案化碳纳米管层的一部分嵌入粘合剂层中，并且图案化的碳纳米管层的另一部分从粘合剂层露出。

公开(公告)号：US08304473B2

公开(公告)日：2012-11-06

申请号：US12509983

申请日：2009-07-27

Applicant: Yoo-Seong Yang ,  Eun-Sung Lee ,  Sang-Soo Jee ,  Soon-Jae Kwon

Inventor： Yoo-Seong Yang ,  Eun-Sung Lee ,  Sang-Soo Jee ,  Soon-Jae Kwon

IPC: C08G59/20 ,  C08G59/40 ,  C08G59/22 ,  C08G59/18 ,  C08G59/50 ,  C08G65/14 ,  C08G59/42 ,  C08G59/56 ,  C08G59/58 ,  C08L63/02

CPC classification number: H05K1/162 ,  C08G59/4215 ,  C08G59/686 ,  C08K3/04 ,  C08L63/00 ,  H01G4/206 ,  H01L23/295 ,  H01L2924/0002 ,  H05K2201/0323 ,  H01L2924/00

Abstract: A carbon/epoxy resin composition and a method of producing a carbon-epoxy dielectric using the same. The carbon/epoxy resin composition includes about 45 volume percent (volume %) to about 50 volume % of an epoxy composition, the epoxy composition including a bisphenol-based epoxy compound and an alicyclic epoxy compound, based on a total volume of the carbon/epoxy resin composition, about 2.0 volume % to about 3.1 volume % of carbon black, based on a total volume of the carbon/epoxy resin composition, about 80 parts by volume to about 104 parts by volume of an acid anhydride-based curing agent, based on 100 parts by volume of the epoxy composition, and about 1 part by volume to about 3 parts by volume of a tertiary alkylamine-based curing catalyst, based on 100 parts by volume of the epoxy composition.

Abstract translation: 碳/环氧树脂组合物和使用其制备碳 - 环氧电介质的方法。 碳/环氧树脂组合物包含基于碳/环氧树脂的总体积的约45体积％（体积％）至约50体积％的环氧组合物，所述环氧组合物包含双酚基环氧化合物和脂环族环氧化合物， 环氧树脂组合物，约2.0体积％至约3.1体积％的炭黑，基于碳/环氧树脂组合物的总体积，约80体积份至约104体积份的酸酐类固化剂， 基于100体积份的环氧组合物，基于100体积份的环氧组合物，约1体积份至约3体积份的叔烷基胺类固化催化剂。

公开(公告)号：US20120273260A1

公开(公告)日：2012-11-01

申请号：US13539677

申请日：2012-07-02

Applicant: Thomas A. Olden ,  Walter Wrigglesworth

Inventor： Thomas A. Olden ,  Walter Wrigglesworth

IPC: H05K1/11 ,  H05K1/03 ,  H05K1/09

CPC classification number: H05K1/0366 ,  H05K1/0284 ,  H05K1/05 ,  H05K3/0014 ,  H05K3/4632 ,  H05K3/465 ,  H05K2201/0323 ,  H05K2201/09018 ,  H05K2201/09063 ,  H05K2201/092 ,  H05K2203/302 ,  Y10T29/49124

Abstract: A composite interconnect assembly includes a body structure formed from a composite material (e.g., a carbon graphite material) with one or more conductive traces embedded therein (e.g., a copper or copper alloy). One or more contact regions are provided such that the conductive traces are exposed and are configured to mechanically and electrically connect to one or more electronic components. The body structure may have a variety of shapes, including planar, cylindrical, conical, and the like.

Abstract translation: 复合互连组件包括由其中嵌入有一个或多个导电迹线（例如铜或铜合金）的复合材料（例如，碳石墨材料）形成的主体结构。 提供一个或多个接触区域，使得导电迹线被暴露并且被配置为机械地和电连接到一个或多个电子部件。 身体结构可以具有各种形状，包括平面，圆柱形，圆锥形等。