公开(公告)号：US5404637A

公开(公告)日：1995-04-11

申请号：US54960

申请日：1993-04-30

Applicant: Shin Kawakami

Inventor： Shin Kawakami

IPC: H05K3/34 ,  H05K3/40 ,  H05K3/46 ,  H01R9/06

CPC classification number: H05K3/4046 ,  H01R12/523 ,  H05K3/3447 ,  H05K2201/0305 ,  H05K2201/0355 ,  H05K2201/0373 ,  H05K2201/09845 ,  H05K2201/10287 ,  H05K2203/063 ,  H05K3/3468 ,  H05K3/4038 ,  H05K3/4602 ,  Y10T29/49126 ,  Y10T29/49149

Abstract: A method of manufacturing a printed wiring board. A printed wiring board having a substrate and a circuit pattern formed thereon is provided. At least one through-hole is formed in the substrate. A plurality of fine wires are inserted into the through-hole, and a molten solder is filled into the through-hole by a capillary action due to small gaps formed between the fine wires. A multilayer printed wiring board may be provided comprising a plurality of wiring board layers each having a substrate and a respective circuit pattern formed thereon. The molten solder filled in the through-hole electrically connects at lest two of the respective circuit patterns. The plurality of fine wires may be disposed in a conductive hollow tubular body which is inserted along with the fine wires into the through-hole. Also, the plurality of fine wires may be arranged as a mesh sheet that is formed into a tubular body and inserted into the through-hole. If an electronic component is to be connected with the printed wiring board through the through-hole, the leads of the electronic component may comprise the plurality of fine wires.

Abstract translation: 一种制造印刷电路板的方法。 提供了具有基板和形成在其上的电路图案的印刷线路板。 在基板中形成至少一个通孔。 多根细线被插入到通孔中，并且由于在细线之间形成的间隙小的毛细作用，熔融的焊料被填充到通孔中。 可以提供多层印刷电路板，其包括多个布线基板层，各层具有基板和形成在其上的各自的电路图案。 填充在通孔中的熔融焊料在至少两个相应的电路图案中电连接。 多个细线可以设置在与细线一起插入通孔的导电中空管状体中。 此外，多根细线可以布置成形成为管状体并插入通孔中的网片。 如果通过通孔将电子部件与印刷电路板连接，则电子部件的引线可以包括多根细线。

公开(公告)号：US5229550A

公开(公告)日：1993-07-20

申请号：US847122

申请日：1992-03-31

Applicant: Perminder S. Bindra ,  Dennis A. Canfield ,  Voya Rista Markovich ,  Jeffrey McKeveny ,  Robert E. Ruane ,  Edwin L. Thomas

Inventor： Perminder S. Bindra ,  Dennis A. Canfield ,  Voya Rista Markovich ,  Jeffrey McKeveny ,  Robert E. Ruane ,  Edwin L. Thomas

IPC: H05K3/00 ,  H05K3/28 ,  H05K3/36 ,  H05K3/40 ,  H05K3/42 ,  H05K3/44 ,  H05K3/46

CPC classification number: H05K3/462 ,  H05K3/445 ,  H05K1/0272 ,  H05K2201/0305 ,  H05K2201/0373 ,  H05K2201/09536 ,  H05K2201/09563 ,  H05K2201/09572 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2203/0307 ,  H05K2203/054 ,  H05K3/0023 ,  H05K3/28 ,  H05K3/36 ,  H05K3/4038 ,  H05K3/4069 ,  H05K3/4076 ,  H05K3/423 ,  H05K3/428

Abstract: A structure and method are disclosed for making high density circuit board. Using photosensitive or other dielectric materials over a circuitized power core, vias and lands are opened up, filled with joining metal and aligned with the next level, eliminating a major registration problem in building up a high density composite and reducing the number of steps in the manufacturing process.

Abstract translation: 公开了一种用于制造高密度电路板的结构和方法。 在电路化电源核心上使用光敏或其他电介质材料，通孔和焊盘被打开，填充有接合金属并与下一级对齐，从而消除了建立高密度复合材料的主要配准问题，并减少了 制造工艺。

公开(公告)号：US5105537A

公开(公告)日：1992-04-21

申请号：US596432

申请日：1990-10-12

Applicant: Madhav Datta ,  David E. King ,  Alan D. Knight ,  Carlos J. Sambucetti

Inventor： Madhav Datta ,  David E. King ,  Alan D. Knight ,  Carlos J. Sambucetti

IPC: H01H1/06 ,  H01L21/60 ,  H01R12/04 ,  H01R12/32 ,  H01R13/03 ,  H01R13/22 ,  H01R43/16 ,  H05K1/11 ,  H05K3/06 ,  H05K3/07 ,  H05K3/24 ,  H05K3/38 ,  H05K3/40

CPC classification number: H05K3/07 ,  H01R13/22 ,  H05K3/4007 ,  H01L2924/0002 ,  H01R13/03 ,  H01R43/16 ,  H05K2201/0367 ,  H05K2201/0373 ,  H05K2203/0369 ,  H05K3/064 ,  H05K3/383 ,  Y10T29/49222

Abstract: An electrical interconnection, which includes a method for fabricating the device, is disclosed. The interconnection comprises two contact surfaces, on at least one of which is disposed at least one solid metal conical projection in predetermined dimension and location. Rather than necessarily being permanently cojoined, the contact surfaces are attachable and detachable when desired. The conical projections on one contact surface make ohmic contact, either by wiping with an intermeshing like structure on a second contact surface or by contacting a second contact surface which is a substantially flat contact pad. An interconnection, in this invention, is the combination of at least one contact having individual conical projections and another contact, optionally having individual conical projections. The conical projections are formed in metal by electrochemical machining in neutral salt solution, optionally in a continuous foil. The conical projections are also optionally formed on the head of a contact pin.

公开(公告)号：US5017738A

公开(公告)日：1991-05-21

申请号：US483170

申请日：1990-02-22

Applicant: Hiroki Tsuji ,  Kyoichiro Kawano ,  Teruo Murase

Inventor： Hiroki Tsuji ,  Kyoichiro Kawano ,  Teruo Murase

IPC: H01R4/02 ,  H05K3/24 ,  H05K3/34 ,  H05K3/36 ,  H05K3/40

CPC classification number: H05K3/244 ,  H01R4/02 ,  H05K3/3463 ,  H05K2201/0116 ,  H05K2201/0373 ,  H05K2201/2036 ,  H05K2203/0723 ,  H05K3/3431 ,  H05K3/36 ,  H05K3/4007 ,  Y10T428/12681

Abstract: A connecting apparatus wherein a porous silver plating layers are provided on surface pads of a printed circuit board and on a surface of a contact provided on the pads of a mother board. The plating layers are respectively impregnated with tin-zinc alloy and gallium. The electrical connection is established between the pads of the printed circuit board and the pads of the mother board through a liquid alloy by placing the plating layers in contact with each other. For the first printed circuit board having the pads and spacer, the gallium particles are adhered to the pads, while solder is temporarily adhered to the spacer. For the second printed circuit board having the pads and the connecting pads, tin or indium layer is provided on the surface of the pads, then the spacer of the first printed circuit board is positioned and fixed to the connecting pad of the second printed circuit board. Thus, electrical connection can be formed by way of the contact of gallium-tin or gallium-indium liquid alloy between the pads of both the printed circuit boards.

Abstract translation: 一种连接装置，其中在印刷电路板的表面焊盘上和设置在母板的焊盘上的触点的表面上提供多孔银镀层。 镀层分别浸渍有锡 - 锌合金和镓。 通过使电镀层彼此接触，通过液体合金在印刷电路板的焊盘和母板的焊盘之间建立电连接。 对于具有焊盘和间隔物的第一印刷电路板，镓颗粒粘附到焊盘，而焊料暂时粘附到间隔件上。 对于具有焊盘和连接焊盘的第二印刷电路板，在焊盘的表面上设置锡或铟层，然后将第一印刷电路板的间隔件定位并固定到第二印刷电路板的连接焊盘 。 因此，可以通过在两个印刷电路板的焊盘之间接合镓锡或镓铟液体合金来形成电连接。

公开(公告)号：US4552607A

公开(公告)日：1985-11-12

申请号：US616630

申请日：1984-06-04

Applicant: Gregg W. Frey

Inventor： Gregg W. Frey

IPC: H01R4/04 ,  B32B7/02 ,  B32B7/12 ,  B32B9/00 ,  B32B15/08 ,  B32B27/18 ,  C08J5/12 ,  C08K7/18 ,  C09J5/02 ,  H01B1/22 ,  H01B5/16 ,  H05K3/24 ,  H05K3/32 ,  H05K3/38 ,  H05K3/40 ,  C09J3/02

CPC classification number: H05K3/4007 ,  C08K7/18 ,  C09J5/02 ,  H01B1/22 ,  H05K3/323 ,  H05K2201/0317 ,  H05K2201/0367 ,  H05K2201/0373 ,  H05K2201/09754 ,  H05K2201/10234 ,  H05K2201/10977 ,  H05K3/244 ,  H05K3/388

Abstract: The present invention is a method and structure which produces extremely thin, electrically conductive epoxy bonds between two substrates. Copper microspheres, having an average diameter of about 2 microns are bound in an epoxy layer which bonds two substrates together. The microspheres make electrical contact between the substrates while providing intersphere gaps which are filled with the epoxy which actually bonds the substrates together.

Abstract translation: 本发明是在两个基板之间产生极薄的导电环氧树脂结合体的方法和结构。 平均直径约2微米的铜微球体结合在环氧树脂层中，将环氧树脂层结合在一起。 微球体在基板之间进行电接触，同时提供填充有实际将基板粘合在一起的环氧树脂的间隙。

公开(公告)号：US3639978A

公开(公告)日：1972-02-08

申请号：US3639978D

申请日：1969-11-03

Applicant: ATOMIC ENERGY COMMISSION

Inventor： SCHURMAN WALTER R

IPC: H01R4/48 ,  H05K3/40 ,  H01R43/00

CPC classification number: H05K3/4046 ,  H01R4/4863 ,  H01R12/55 ,  H05K2201/0133 ,  H05K2201/0373 ,  H05K2201/10295 ,  Y10T29/49139

Abstract: An apparatus and method for making electrical connection to an electrically conductive lead of a printed circuit board including a connector assembly of an elastomeric cylinder having a plurality of conductors woven thereabout with about 72 picks per inch and with each conductor oriented at an angle of at least about 30* from the axis of the cylinder, connection to the printed circuit board lead being effected by first stretching the elastomeric cylinder and associated mesh, inserting the stretched cylinder into a hole in the printed circuit board and lead, and releasing the cylinder to allow it to expand into and about the hole to press the plurality of conductors into electrical contact with the lead.

Abstract translation: 一种用于与印刷电路板的导电引线电连接的装置和方法，包括具有多个导体的弹性体圆柱体的连接器组件，每个导体以每英寸约72个拾取点编织，并且每个导体至少以至少一个角度 从圆柱体的轴线约30°，通过首先拉伸弹性体圆筒和相关的网状物来连接到印刷电路板引线，将拉伸的圆柱体插入印刷电路板和引线的孔中，释放圆筒以允许 它扩展到孔中并围绕该孔围绕以将多个导体按压与导线电接触。

公开(公告)号：US3541225A

公开(公告)日：1970-11-17

申请号：US3541225D

申请日：1968-12-20

Applicant: GEN ELECTRIC

Inventor： RACITI JOSEPH A

IPC: H01R12/51 ,  H05K3/34 ,  H01C1/14 ,  H02G15/02 ,  H05K3/30

CPC classification number: H05K3/3447 ,  H01R12/58 ,  H05K3/3468 ,  H05K2201/0373 ,  H05K2201/1081 ,  Y10T29/49169

公开(公告)号：US3530231A

公开(公告)日：1970-09-22

申请号：US3530231D

申请日：1969-01-15

Applicant: IBM

Inventor： PENOYER RALPH F

IPC: H01R12/00 ,  H01R12/55 ,  H05K1/14 ,  H05K3/34 ,  H05K3/36 ,  H05K3/32

CPC classification number: H05K3/36 ,  H05K1/142 ,  H05K1/148 ,  H05K3/3405 ,  H05K3/3421 ,  H05K2201/0373 ,  H05K2201/1028

公开(公告)号：US11997901B2

公开(公告)日：2024-05-28

申请号：US18162136

申请日：2023-01-31

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： Byoungyong Kim ,  Seunghwa Ha ,  Seungsoo Ryu ,  Sanghyeon Song ,  Jeongdo Yang ,  Jungyun Jo ,  Jeongho Hwang

IPC: H10K59/13 ,  G02F1/13 ,  G02F1/1345 ,  H05K1/11 ,  H05K3/32 ,  H10K50/844 ,  H10K59/131 ,  H10K71/00

CPC classification number: H10K59/131 ,  G02F1/13458 ,  H05K1/111 ,  H05K1/112 ,  H05K3/32 ,  H05K3/328 ,  H10K50/844 ,  H10K71/00 ,  H05K2201/0373 ,  H05K2201/09845 ,  H05K2203/0285 ,  Y02P70/50

Abstract: A display apparatus includes a display panel having a display substrate on which a plurality of pad terminals is disposed, and a driving unit having a plurality of driving terminals electrically connected to the plurality of pad terminals. Each of the plurality of pad terminals includes a stepped groove that faces a corresponding driving terminal of the plurality of driving terminals or each of the plurality of pad terminals includes an opening hole that faces the corresponding driving terminal of the plurality of driving terminals.

公开(公告)号：US11678440B2

公开(公告)日：2023-06-13

申请号：US16874847

申请日：2020-05-15

Applicant: IBIDEN CO., LTD.

Inventor： Yoji Sawada ,  Nobuhisa Kuroda ,  Kazuyuki Ueda ,  Shota Tachibana

IPC: H05K1/11 ,  H05K3/40 ,  H05K1/18

CPC classification number: H05K3/4092 ,  H05K1/115 ,  H05K3/4061 ,  H05K1/111 ,  H05K1/18 ,  H05K2201/0373

Abstract: A printed wiring board includes a resin insulating layer, a metal post formed in the insulating layer and protruding from first surface of the insulating layer, a conductor layer formed on second surface of the insulating layer, and a via conductor penetrating through the insulating layer and connecting the metal post and conductor layer. The metal post has a protruding portion protruding from the first surface of the insulating layer and an embedded portion connected to the protruding portion and embedded in the insulating layer such that the protruding portion does not extend onto the insulating layer, and the metal post has upper and side surfaces such that the side surface has unevenness including a first unevenness on side surface of the protruding portion and a second unevenness formed on side surface of the embedded portion and having a size that is larger than a size of the first unevenness.