公开(公告)号：US06638592B1

公开(公告)日：2003-10-28

申请号：US09589149

申请日：2000-06-08

Applicant: Jurgen Schulz-Harder

Inventor： Jurgen Schulz-Harder

IPC: B65D6528

CPC classification number: H01L21/481 ,  B23K26/0006 ,  B23K26/359 ,  B23K26/361 ,  B23K26/40 ,  B23K2103/16 ,  B23K2103/172 ,  B23K2103/50 ,  B23K2103/52 ,  C04B37/021 ,  C04B2237/343 ,  C04B2237/366 ,  C04B2237/40 ,  C04B2237/86 ,  H01L23/3735 ,  H01L23/49838 ,  H01L24/97 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2924/01322 ,  H05K1/0271 ,  H05K1/0306 ,  H05K3/0052 ,  H05K2201/0355 ,  H05K2201/09036 ,  H05K2201/0909 ,  H05K2201/0969 ,  H05K2201/09745 ,  H05K2201/09845 ,  H05K2203/302 ,  Y10T428/15 ,  Y10T428/24479 ,  H01L2924/00

Abstract: The invention relates to a novel ceramic/metal substrate, especially to a multiple substrate with a ceramic plate or ceramic layer.

Abstract translation: 本发明涉及一种新颖的陶瓷/金属基材，特别涉及具有陶瓷板或陶瓷层的多基板。

公开(公告)号：US20030178725A1

公开(公告)日：2003-09-25

申请号：US10297926

申请日：2002-12-19

Inventor： Makoto Yanase ,  Katsumi Sagisaka ,  Isao Shimada ,  Tatsuya Okunishi

IPC: H01L023/48

CPC classification number: H05K3/0052 ,  H05K3/0097 ,  H05K3/225 ,  H05K2201/09063 ,  H05K2201/0909 ,  H05K2203/0165 ,  H05K2203/0169 ,  H05K2203/1327

Abstract: It is intended to provide multi-piece circuit boards capable of preventing lowering of strength of joint sections between piece sections after cutoff and other sections, and determining material of flame sections regardless of material of a piece section, and board manufacturing method of such multi-piece circuit boards. For a mixed board including a defective piece section and a good piece section in a state in which an outermost layer is not formed yet, cut lines are made around bridges and are joined together by adhesive, and an upper layer is provided thereon, whereby a multi-piece circuit board mounted on good piece sections only is formed. A frame section may be formed by arranging respective piece sections manufactured in advance at positions at which the piece sections are to be present and injecting fluid matter to surround the respective piece sections arranged to form the frame section. Furthermore, joints between respective piece sections and frame section may be provided on the frame section to surround roots of respective bridges. Furthermore, an adhesive sheet may cover each joint.

Abstract translation: 本发明提供能够防止切断后的片段与其他部分之间的接合部分的强度降低的多片电路板，并且确定火焰部分的材料，而不管片段的材料如何，以及这种多层电路板的制造方法， 电路板。 在没有形成最外层的状态下，包括缺陷片段和良好片段的混合板，在桥周围形成切割线，并通过粘合剂接合在一起，并且在其上设置上层， 仅形成安装在好片段上的多片电路板。 框架部分可以通过将预先制造的片段部分布置在将要存在片段的位置处并且喷射流体物质以包围布置成形成框架部分的相应片段来形成。 此外，各个片段和框架部分之间的接合部可以设置在框架部分上以围绕各个桥的根部。 此外，粘合片可以覆盖每个接头。

公开(公告)号：US20030173105A1

公开(公告)日：2003-09-18

申请号：US10383227

申请日：2003-03-07

Inventor： Koji Kondo ,  Satoshi Takeuchi ,  Tomohiro Yokochi ,  Katsumi Yamazaki ,  Masakazu Terada

IPC: H05K001/03

CPC classification number: H05K3/4691 ,  H05K1/118 ,  H05K3/4069 ,  H05K3/4614 ,  H05K3/4632 ,  H05K2201/0129 ,  H05K2201/0909 ,  H05K2201/09109 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: In a manufacturing method of a rigid-flexible printed circuit board, slits for defining two sides of a removing portion are formed in a part of plural resin films, and the plural resin films are stacked and bonded to form a circuit board. Then, a product portion is cut from the circuit board. Before the bonding, a separation sheet is disposed between predetermined adjacent layers of the plural resin films to separate the removing portion from a residual portion of the product portion. Accordingly, while the product portion is cut from the circuit board, the removing portion is separated from the product portion, because the removing portion are defined by the separation sheet, the slits, and a cutting outline of the product portion.

Abstract translation: 在刚性柔性印刷电路板的制造方法中，在多个树脂膜的一部分中形成用于限定除去部分的两侧的狭缝，并且将多个树脂膜堆叠并结合以形成电路板。 然后，从电路板切割产品部分。 在接合之前，将分离片设置在多个树脂膜的预定相邻层之间，以将去除部分与产品部分的残留部分分离。 因此，当从电路板切割产品部分时，由于去除部分由分离片，狭缝和产品部分的切割轮廓限定，所以移除部分与产品部分分离。

公开(公告)号：US20030167629A1

公开(公告)日：2003-09-11

申请号：US10348024

申请日：2003-01-22

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Norio Sakai ,  Kazuhiro Iida

IPC: H05K001/03 ,  H05K003/36

CPC classification number: H01L23/585 ,  H01L21/481 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K3/0052 ,  H05K2201/09036 ,  H05K2201/0909 ,  H05K2201/09781 ,  H05K2203/302 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49163 ,  Y10T29/49165 ,  Y10T29/49789 ,  Y10T29/4979 ,  H01L2924/00

Abstract: A multilayer integrated substrate includes breaking grooves arranged in a grid pattern so as to section the main surface of the substrate into a plurality of blocks, and also includes fracture-preventing conductor films arranged so as to cross the breaking grooves. The fracture-preventing conductor films contain a metal component that prevents undesirable fracturing of the multilayer integrated substrate along the breaking grooves.

公开(公告)号：US20030076660A1

公开(公告)日：2003-04-24

申请号：US10257207

申请日：2002-10-09

Inventor： Kenichi Horie

IPC: H05K007/06

CPC classification number: H05K3/0052 ,  H01L2224/48227 ,  H01L2924/19105 ,  H01Q23/00 ,  H05K1/0237 ,  H05K1/0306 ,  H05K1/141 ,  H05K3/3442 ,  H05K3/368 ,  H05K3/403 ,  H05K2201/0909 ,  H05K2201/09181

Abstract: The electronic device of the invention is such constructed that the antenna part (3) and the RF circuit part (4) can show their respective functions even after the antenna part (3) and the RF circuit part (4) have been separated. Besides a scribe line 6 is formed on anullpreferably ceramicnullsubstrate for separating the antenna part (3) from the RF circuit part (4). Both parts may be separated after a change in any environmental condition, such as a change in the circuit configuration of the board on which the device (10) is to be mounted.

Abstract translation: 本发明的电子设备的结构是，即使在天线部分（3）和RF电路部分（4）已经分离之后，天线部分（3）和RF电路部分（4）也可以显示它们各自的功能。 除了划线6形成在优选陶瓷基板上，用于将天线部分（3）与RF电路部分（4）分开。 在任何环境条件的改变之后，例如装置（10）将安装在其上的板的电路配置的变化，两个部分可以分离。

公开(公告)号：US06549419B1

公开(公告)日：2003-04-15

申请号：US09684175

申请日：2000-10-06

Applicant: Toshifumi Nakano ,  Kuniko Morisaki

Inventor： Toshifumi Nakano ,  Kuniko Morisaki

IPC: H05K100

CPC classification number: H05K1/00 ,  H05K1/189 ,  H05K3/0008 ,  H05K3/30 ,  H05K2201/09063 ,  H05K2201/0909 ,  H05K2201/09781 ,  H05K2203/167

Abstract: To keep a flexible printed substrate planar when the substrate is set in a mounter for mounting parts and to miniaturize the substrate, the present invention proposes an electric substrate, for example, a flexible printed substrate on which electronic parts are mounted, the electric substrate having a first area (30: a part mounting area) formed therein, a second area (40: part mounting area) formed therein, and a third area (10: a separable area) that joins the first and second areas like a “bridge” and that can be removed when the substrate is assembled into predetermined equipment, the third area having a positioning hole 11 (one of a set of positioning holes) for use in mounting electric parts on the substrate.

Abstract translation: 为了将基板设置在用于安装部件的安装器中并使基板小型化的同时，将柔性印刷基板平面化，本发明提出了一种电气基板，例如安装电子部件的柔性印刷基板，电气基板具有 在其中形成的第一区域（30：部分安装区域），形成在其中的第二区域（40：部分安装区域）和连接第一和第二区域的第三区域（10分离区域），如“桥” 并且当基板组装成预定的设备时可以将其移除，第三区域具有用于将电气部件安装在基板上的定位孔11（一组定位孔中的一个）。

公开(公告)号：US06548766B2

公开(公告)日：2003-04-15

申请号：US09921202

申请日：2001-08-01

Applicant: Yukiko Daido

Inventor： Yukiko Daido

IPC: H05K111

CPC classification number: H05K3/242 ,  H05K1/117 ,  H05K3/0052 ,  H05K3/403 ,  H05K2201/09036 ,  H05K2201/0909 ,  H05K2201/0919 ,  H05K2201/09509 ,  H05K2201/09781

Abstract: A printed wiring board comprises an insulating layer having a plurality of recesses formed along a predetermined edge portion of the insulating layer to extend through a side surface of the insulating layer, tabs for establishing electrical connection with an external electronic apparatus and which are formed on a surface of the insulating layer along the predetermined edge portion in correspondence with the plurality of recesses, and extensions connected electrically to the respective tabs and extending into the respective recesses. The printed wiring board may further comprise a plurality of dummy pads which are buried under the insulating layer in correspondence with the tabs and the extensions and which are electrically insulated from each other. The extensions are joined to the dummy pads through the recesses. The resulting board comprises a structure in which tabs are not easily peeled from an insulating layer.

Abstract translation: 印刷电路板包括绝缘层，绝缘层具有沿着绝缘层的预定边缘部分形成的多个凹槽，以延伸穿过绝缘层的侧表面，用于与外部电子设备建立电连接的接片，并形成在 所述绝缘层的表面沿着与所述多个凹部对应的所述预定边缘部分，以及延伸部，其电连接到相应的突片并延伸到相应的凹部中。 印刷电路板还可以包括多个虚拟焊盘，这些虚拟焊盘相对于突出部和延伸部被掩埋在绝缘层的下方并且彼此电绝缘。 延伸部分通过凹槽连接到虚拟焊盘。 所得到的板包括其中突片不容易从绝缘层剥离的结构。

公开(公告)号：US20030062111A1

公开(公告)日：2003-04-03

申请号：US10259512

申请日：2002-09-30

Inventor： Yoichi Moriya

IPC: C03B029/00

CPC classification number: B32B18/00 ,  C04B2235/6562 ,  C04B2235/6565 ,  C04B2235/6567 ,  C04B2237/343 ,  C04B2237/348 ,  C04B2237/52 ,  C04B2237/562 ,  C04B2237/565 ,  C04B2237/64 ,  C04B2237/66 ,  C04B2237/702 ,  C04B2237/704 ,  H01L21/481 ,  H01L21/4867 ,  H05K1/0306 ,  H05K3/0052 ,  H05K3/4626 ,  H05K3/4629 ,  H05K3/4688 ,  H05K2201/09036 ,  H05K2201/0909

Abstract: A green laminate for obtaining a multilayer substrate includes base material layer green sheets held between constraint layer green sheets. The green laminate includes constraint layer green sheets laminated on the outside of a laminate of base material layer green sheets, and cutting grooves are formed in the constraint layer green sheets. By burning the green laminate to obtain a sintered laminate, the difference between expansion and shrinkage behaviors due to the difference between the thermal expansion coefficients of the glass ceramic sintered layer and the ceramic powder fixed layer occurs in each of the regions divided by the cutting grooves, thereby relieving stress due to the difference between expansion and shrinkage behaviors.

Abstract translation: 用于获得多层基板的绿色层压板包括保持在约束层生片之间的基材层生坯。 绿色层叠体包括层叠在基材层生片的层叠体的外侧的约束层生片，并且在约束层生片中形成切割槽。 通过燃烧生坯层压体以获得烧结层压体，由玻璃陶瓷烧结层和陶瓷粉末固定层的热膨胀系数之间的差异引起的膨胀和收缩行为之间的差异发生在由切割槽分开的每个区域中 从而减轻由于膨胀和收缩行为之间的差异引起的应力。

公开(公告)号：US06531660B2

公开(公告)日：2003-03-11

申请号：US09754659

申请日：2001-01-04

Applicant: Atsushi Ono

Inventor： Atsushi Ono

IPC: H05K102

CPC classification number: H05K3/0052 ,  H05K2201/09063 ,  H05K2201/0909 ,  H05K2203/1545 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T428/15 ,  Y10T428/24314

Abstract: A printed substrate board constructed, from a substantially unitary body includes at least one edge part along a side mountable into an external mounting device. The printed board includes individual board bodies having a shape that is out of parallel with the edge part. The individual board bodies have at least one portion of an opposing side joined to the edge parts through a secondary part. The secondary parts, combined with the individual board bodies, are substantially parallel with the edge parts and allow simple separation of each board body from the printed board along cutting boundary portions while enabling simplified orientation for later assembly.

Abstract translation: 从基本上整体的主体构造的印刷基板包括沿着可安装到外部安装装置的一侧的至少一个边缘部分。 印刷板包括具有与边缘部分不平行的形状的单独的板主体。 单独的板体具有通过次级部分连接到边缘部分的相对侧的至少一部分。 与单独的板体结合的次要部件基本上与边缘部分平行，并且允许每个板主体与切割边界部分沿着印刷电路板简单分离，同时能够简化定向以便稍后组装。

公开(公告)号：US20030014864A1

公开(公告)日：2003-01-23

申请号：US10177494

申请日：2002-06-20

Inventor： Yves Gazelot ,  Thierry Robin

IPC: H05K003/30 ,  H05K003/02

CPC classification number: H05K3/306 ,  H05K3/0052 ,  H05K2201/0909 ,  H05K2201/10424 ,  H05K2203/0228 ,  Y10T29/4913 ,  Y10T29/49156 ,  Y10T29/49165

Abstract: In order to mass produce plates for holding connection pins of an electronic component in a predefined configuration, used to facilitate the mounting of the component on a printed circuit board, this process consists of introducing a board (11) of large dimensions into a numerically-controlled machine tool, operating the machine tool in order to create in board (11) perforations (12) whose diameter corresponds to that of the pins of the component, and to operate the machine tool in order to make precutting lines (13, 14) in board (11), so as to precut a plurality of plates (21) in the board, the precutting lines being distributed over the board so that each plate has perforations (12) having the predefined configuration.

Abstract translation: 为了大量生产用于保持预定构型的电子部件的连接销的板，用于便于将部件安装在印刷电路板上，该过程包括将大尺寸的板（11）引入数字 - 控制机床，操作机床以在板（11）上形成直径相当于部件销的穿孔（12），并操作机床以制作预切割线（13,14） 在板（11）中，为了防止板中的多个板（21），预切割线分布在板上，使得每个板具有具有预定构造的穿孔（12）。