公开(公告)号：US20080176419A1

公开(公告)日：2008-07-24

申请号：US11865436

申请日：2007-10-01

Applicant: Gareth G. Hougham ,  Brian S. Beaman ,  Evan G. Colgan ,  Paul W. Coteus ,  Stefano S. Oggioni ,  Enrique Vargas

Inventor： Gareth G. Hougham ,  Brian S. Beaman ,  Evan G. Colgan ,  Paul W. Coteus ,  Stefano S. Oggioni ,  Enrique Vargas

IPC: H01R12/00

CPC classification number: H01R12/714 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01R12/52 ,  H05K3/326 ,  H05K3/4007 ,  H05K7/1061 ,  H05K2201/0133 ,  H05K2201/0367 ,  H05K2201/09481 ,  H05K2201/09745 ,  H05K2201/10378 ,  H05K2201/10734 ,  Y10T29/49002 ,  Y10T29/49121 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49151 ,  Y10T29/49155 ,  Y10T29/49158 ,  Y10T29/49165 ,  Y10T29/49204 ,  Y10T29/49208 ,  Y10T29/49213 ,  Y10T29/49218 ,  Y10T29/49222 ,  H01L2924/00

Abstract: A land grid array (LGA) interposer structure, including an electrically insulating carrier plane, and at least one interposer mounted on a first surface of said carrier plane. The interposer possesses a hemi-toroidal configuration in transverse cross-section and is constituted of a dielectric elastomeric material. A plurality of electrically-conductive elements are arranged about the surface of the at least one hemi-toroidal interposer and extend radically inwardly and downwardly from an uppermost end thereof into electrical contact with at least one component located on an opposite side of the electrically insulating carrier plane. Provided is also a method of producing the land grid array interposer structure.

公开(公告)号：US20080163487A1

公开(公告)日：2008-07-10

申请号：US12047622

申请日：2008-03-13

Applicant: Gareth G. Hougham ,  Brian S. Beaman ,  Evan G. Colgan ,  Paul W. Coteus ,  Stefano S. Oggioni ,  Enrique Vargas

Inventor： Gareth G. Hougham ,  Brian S. Beaman ,  Evan G. Colgan ,  Paul W. Coteus ,  Stefano S. Oggioni ,  Enrique Vargas

IPC: H05K3/00 ,  H01R9/00

CPC classification number: H01R12/714 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01R12/52 ,  H05K3/326 ,  H05K3/4007 ,  H05K7/1061 ,  H05K2201/0133 ,  H05K2201/0367 ,  H05K2201/09481 ,  H05K2201/09745 ,  H05K2201/10378 ,  H05K2201/10734 ,  Y10T29/49002 ,  Y10T29/49121 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49151 ,  Y10T29/49155 ,  Y10T29/49158 ,  Y10T29/49165 ,  Y10T29/49204 ,  Y10T29/49208 ,  Y10T29/49213 ,  Y10T29/49218 ,  Y10T29/49222 ,  H01L2924/00

Abstract: A method of producing a land grid array (LGA) interposer structure, including an electrically insulating carrier plane, and at least one interposer mounted on a first surface of said carrier plane. The interposer possesses a hemi-toroidal configuration in transverse cross-section and is constituted of a dielectric elastomeric material. A plurality of electrically-conductive elements are arranged about the surface of the at least one hemi-toroidal interposer and extend radically inwardly and downwardly from an uppermost end thereof into electrical contact with at least one component located on an opposite side of the electrically insulating carrier plane.

公开(公告)号：US20080156523A1

公开(公告)日：2008-07-03

申请号：US11964525

申请日：2007-12-26

Applicant: Shinichiro SAITO

Inventor： Shinichiro SAITO

IPC: H05K1/11 ,  H01R12/04

CPC classification number: H05K1/0253 ,  H01P3/003 ,  H01P3/081 ,  H01P3/085 ,  H05K1/0224 ,  H05K2201/09681 ,  H05K2201/09736 ,  H05K2201/09745

Abstract: A printed-wiring board includes: a board made of insulator; a wiring pattern to transfer an electric signal which is made of patterned metallic conductor and formed on at least one of a main surface and a rear surface of the board; and an electric power layer formed on the rear surface of the board and/or in the board. The electric power layer includes a mechanism to increase and decrease a capacitance and an inductance thereof.

Abstract translation: 印刷电路板包括：由绝缘体制成的板; 用于传送由图案化的金属导体制成并形成在板的主表面和后表面中的至少一个上的电信号的布线图案; 以及形成在板的背面和/或板中的电力层。 电力层包括增加和减小电容及其电感的机构。

公开(公告)号：US20080155821A1

公开(公告)日：2008-07-03

申请号：US12047552

申请日：2008-03-13

Applicant: Gareth G. Hougham ,  Brian S. Beaman ,  Evan G. Colgan ,  Paul W. Coteus ,  Stefano S. Oggioni ,  Enrique Vargas

Inventor： Gareth G. Hougham ,  Brian S. Beaman ,  Evan G. Colgan ,  Paul W. Coteus ,  Stefano S. Oggioni ,  Enrique Vargas

IPC: H05K3/36

CPC classification number: H01R12/714 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01R12/52 ,  H05K3/326 ,  H05K3/4007 ,  H05K7/1061 ,  H05K2201/0133 ,  H05K2201/0367 ,  H05K2201/09481 ,  H05K2201/09745 ,  H05K2201/10378 ,  H05K2201/10734 ,  Y10T29/49002 ,  Y10T29/49121 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49151 ,  Y10T29/49155 ,  Y10T29/49158 ,  Y10T29/49165 ,  Y10T29/49204 ,  Y10T29/49208 ,  Y10T29/49213 ,  Y10T29/49218 ,  Y10T29/49222 ,  H01L2924/00

Abstract: A method of producing a land grid array (LGA) interposer structure, including an electrically insulating carrier plane, and at least one interposer mounted on a first surface of said carrier plane. The interposer possesses a hemi-toroidal configuration in transverse cross-section and is constituted of a dielectric elastomeric material. A plurality of electrically-conductive elements are arranged about the surface of the at least one hemi-toroidal interposer and extend radically inwardly and downwardly from an uppermost end thereof into electrical contact with at least one component located on an opposite side of the electrically insulating carrier plane.

Abstract translation: 一种制造包括电绝缘载体平面的平面栅格阵列（LGA）插入器结构以及安装在所述载体平面的第一表面上的至少一个插入件的方法。 插入件在横截面中具有半环形结构，并由介电弹性体材料构成。 多个导电元件围绕至少一个半环形插入器的表面布置并且从其最上端向内和向下自由地延伸至与位于电绝缘载体的相对侧上的至少一个部件的电接触 飞机

公开(公告)号：US20080128920A1

公开(公告)日：2008-06-05

申请号：US11945807

申请日：2007-11-27

Applicant: Mitsuyasu Enomoto ,  Haruo Kawakita ,  Takashi Ohno

Inventor： Mitsuyasu Enomoto ,  Haruo Kawakita ,  Takashi Ohno

IPC: H01L23/14 ,  H01L21/56

CPC classification number: H01L21/565 ,  H01L23/3135 ,  H01L23/49503 ,  H01L23/49531 ,  H01L23/49562 ,  H01L23/49575 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05553 ,  H01L2224/48091 ,  H01L2224/4813 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48472 ,  H01L2224/49171 ,  H01L2224/8592 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/014 ,  H01L2924/10161 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/351 ,  H05K3/0061 ,  H05K3/284 ,  H05K3/386 ,  H05K2201/09745 ,  H05K2203/1316 ,  H05K2203/1322 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

Abstract: A resin-sealed semiconductor device includes a metal frame, an electronic substrate, an adhesive agent, a molded resin, and a bonding agent. The electronic substrate includes a first surface having a circuit element wiring part, a second surface facing the metal frame, and a side surface arranged approximately perpendicularly to the first surface and the second surface. The adhesive agent is disposed between the metal frame and the second surface to cover the second surface and a portion of the side surface adjacent to the second surface. The molded resin covers the metal frame and the electronic substrate, and holds the other portion of the side surface adjacent to the first surface. The bonding agent is disposed between the circuit element wiring part and the molded resin so that the molded resin holds the circuit element wiring part through the bonding agent.

Abstract translation: 树脂密封半导体器件包括金属框架，电子基板，粘合剂，模制树脂和粘合剂。 电子基板包括具有电路元件布线部分的第一表面，与金属框架相对的第二表面以及大致垂直于第一表面和第二表面布置的侧表面。 粘合剂设置在金属框架和第二表面之间以覆盖第二表面和与第二表面相邻的侧表面的一部分。 模制树脂覆盖金属框架和电子基板，并且保持侧表面的另一部分与第一表面相邻。 接合剂配置在电路元件布线部和模制树脂之间，使得模制树脂通过粘合剂保持电路元件布线部分。

公开(公告)号：US07371970B2

公开(公告)日：2008-05-13

申请号：US10731390

申请日：2003-12-08

Applicant: Jeffrey D. Flammer ,  Robert Forcier

Inventor： Jeffrey D. Flammer ,  Robert Forcier

IPC: H05K1/03

CPC classification number: H05K3/4691 ,  H05K1/0278 ,  H05K1/118 ,  H05K1/16 ,  H05K3/0032 ,  H05K3/0044 ,  H05K3/0061 ,  H05K3/429 ,  H05K2201/09036 ,  H05K2201/09081 ,  H05K2201/0909 ,  H05K2201/09109 ,  H05K2201/09536 ,  H05K2201/09745 ,  H05K2203/1572 ,  H05K2203/302 ,  Y10T29/49126

Abstract: A rigid-flex circuit board system that can be manufactured using less expensive and more reliable rigid circuit board methods and equipment, and can maintain rigidity and dimensional stability until the time when it is first desired to flex.

Abstract translation: 可以使用更便宜和更可靠的刚性电路板方法和设备制造的刚性 - 柔性电路板系统，并且可以保持刚性和尺寸稳定性，直到首次需要弯曲时为止。

公开(公告)号：US20080026605A1

公开(公告)日：2008-01-31

申请号：US11865217

申请日：2007-10-01

Applicant: Gareth Hougham ,  Brian Beaman ,  Evan Colgan ,  Paul Coteus ,  Stefano Oggioni ,  Enrique Vargas

Inventor： Gareth Hougham ,  Brian Beaman ,  Evan Colgan ,  Paul Coteus ,  Stefano Oggioni ,  Enrique Vargas

IPC: H01R12/04

CPC classification number: H01R12/714 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01R12/52 ,  H05K3/326 ,  H05K3/4007 ,  H05K7/1061 ,  H05K2201/0133 ,  H05K2201/0367 ,  H05K2201/09481 ,  H05K2201/09745 ,  H05K2201/10378 ,  H05K2201/10734 ,  Y10T29/49002 ,  Y10T29/49121 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49151 ,  Y10T29/49155 ,  Y10T29/49158 ,  Y10T29/49165 ,  Y10T29/49204 ,  Y10T29/49208 ,  Y10T29/49213 ,  Y10T29/49218 ,  Y10T29/49222 ,  H01L2924/00

Abstract: A land grid array (LGA) interposer structure, including an electrically insulating carrier plane, and at least one interposer mounted on a first surface of said carrier plane. The interposer possesses a hemi-toroidal configuration in transverse cross-section and is constituted of a dielectric elastomeric material. A plurality of electrically-conductive elements are arranged about the surface of the at least one hemi-toroidal interposer and extend radically inwardly and downwardly from an uppermost end thereof into electrical contact with at least one component located on an opposite side of the electrically insulating carrier plane. Provided is also a method of producing the land grid array interposer structure.

公开(公告)号：US20070273045A1

公开(公告)日：2007-11-29

申请号：US11752843

申请日：2007-05-23

Applicant: Tomofumi Kitada ,  Hiroki Maruo ,  Ryo Takami

Inventor： Tomofumi Kitada ,  Hiroki Maruo ,  Ryo Takami

IPC: H01L23/48 ,  H01L21/00

CPC classification number: H05K3/363 ,  H01L2924/0002 ,  H05K2201/09745 ,  H05K2201/098 ,  H05K2201/09845 ,  H01L2924/00

Abstract: A board interconnection structure having a first printed wiring board in which a first conductive circuit is arranged on a first insulating layer, the first conductive circuit having, on an end portion thereof, a first connection terminal in which an upper surface width is narrower than a bottom surface width; a second printed wiring board in which a second conductive layer having a second connection terminal is arranged on a second insulating layer; and a connection layer that forms fillets along longitudinal side surfaces of the first connection terminal, and interconnects the first connection terminal and the second connection terminal. The first connection terminal may have a projection portion.

Abstract translation: 一种电路板互连结构，具有第一印刷线路板，其中第一导电电路布置在第一绝缘层上，所述第一导电电路在其端部上具有第一连接端子，其中上表面宽度窄于 底面宽度; 第二印刷线路板，其中具有第二连接端子的第二导电层布置在第二绝缘层上; 以及连接层，其沿着所述第一连接端子的纵向侧表面形成圆角，并且将所述第一连接端子和所述第二连接端子互连。 第一连接端子可以具有突出部分。

公开(公告)号：US07285429B2

公开(公告)日：2007-10-23

申请号：US10930350

申请日：2004-08-27

Applicant: Masafumi Shigaki ,  Isao Nakazawa ,  Kazunori Yamanaka

Inventor： Masafumi Shigaki ,  Isao Nakazawa ,  Kazunori Yamanaka

IPC: H01L21/66 ,  H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC classification number: H05K1/021 ,  H01L23/66 ,  H01L25/165 ,  H01L2223/6627 ,  H01L2924/1423 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/1616 ,  H01L2924/16195 ,  H01L2924/16315 ,  H01L2924/166 ,  H01L2924/19032 ,  H05K1/0203 ,  H05K1/0243 ,  H05K1/142 ,  H05K1/182 ,  H05K3/0061 ,  H05K2201/0323 ,  H05K2201/09745 ,  H05K2201/10166 ,  H05K2201/10409

Abstract: In a package mounting structure for mounting a package on a case, wherein the package internally incorporates at least one of a high-frequency transistor, MIC and MMIC used in the microwave to millimeter-wave band, and a base thereof is formed of metal and serves as ground, an electrically conductive sheet having excellent thermal conductivity and exhibiting restorability and having a size identical with that of the base of the package is laid on the case at a package-bearing location, the package and sheet are fastened together by two or more screws, and the sheet is mounted on the case while it is pressed by a pressing force of 10 N/cm2 or greater owing to fastening.

Abstract translation: 在用于将封装安装在外壳上的封装安装结构中，其中封装内部包含微波至毫米波段使用的高频晶体管，MIC和MMIC中的至少一个，其基极由金属和 作为地面，具有优异的导热性并具有恢复性并且具有与包装的基座的尺寸相同的尺寸的导电片被放置在封装承载位置的壳体上，封装和片材通过两个或 更多的螺钉，并且当由于紧固而被按压10N / cm 2以上的压力时，该片被安装在外壳上。

公开(公告)号：US20070144769A1

公开(公告)日：2007-06-28

申请号：US11320922

申请日：2005-12-28

Applicant: Islam Salama

Inventor： Islam Salama

IPC: H05K1/16

CPC classification number: H05K3/4661 ,  H01L21/486 ,  H01L23/49822 ,  H01L23/49827 ,  H01L2924/0002 ,  H05K3/027 ,  H05K3/185 ,  H05K3/4007 ,  H05K3/421 ,  H05K3/423 ,  H05K2201/0367 ,  H05K2201/0394 ,  H05K2201/09563 ,  H05K2201/09745 ,  H05K2203/0369 ,  H05K2203/0733 ,  H05K2203/107 ,  H05K2203/1476 ,  Y10T29/49155 ,  Y10T29/49156 ,  H01L2924/00

Abstract: A printed circuit is made by laser projection patterning a metal panel of a substrate, laminating a dielectric layer on the metal panel, laser irradiating the substrate to form vias in the substrate, laser activating a seed coat on the substrate, washing the seed coat from an unpatterned portion of the substrate, forming a patterned build-up layer on the substrate, and etching away a metal plating forming metal protrusions.

Abstract translation: 通过激光投影图案化衬底的金属面板，在金属面板上层叠电介质层，激光照射衬底以在衬底中形成通孔，激光激活衬底上的种皮，将种皮从 基板的未图案化部分，在基板上形成图案化的积层，并蚀刻形成金属电镀的金属突起。