公开(公告)号：US20190235015A1

公开(公告)日：2019-08-01

申请号：US16321869

申请日：2017-07-03

Applicant: Endress+Hauser Flowtec AG

Inventor： Thomas Böhler ,  Matthias Brudermann ,  Christoph Werle ,  Markus Wucher ,  Daniel Kollmer ,  Ludovic Adam

IPC: G01R31/28 ,  G01R31/04 ,  H05K1/02

CPC classification number: G01R31/2818 ,  G01R31/043 ,  G01R31/048 ,  H05K1/0268 ,  H05K2201/09927 ,  H05K2203/162

Abstract: A circuit board comprising a contacting arrangement, including three metal contacting regions, which are connected with one or more data links of the circuit board and in the case of contact with a communication interface of a test system enable a data exchange with a data memory of a circuit board.

公开(公告)号：US20160198596A1

公开(公告)日：2016-07-07

申请号：US14916393

申请日：2013-09-24

Applicant: FUJI MACHINE MFG. CO., LTD.

Inventor： Hidetoshi KAWAI

IPC: H05K13/04 ,  H05K13/00 ,  H05K13/08

CPC classification number: H05K13/0404 ,  H05K13/0061 ,  H05K13/0069 ,  H05K13/08 ,  H05K13/0857 ,  H05K13/087 ,  H05K2201/09927 ,  H05K2203/0165 ,  H05K2203/163 ,  Y10T29/4913 ,  Y10T29/53174

Abstract: A mounting machine acquires identification information arranged in a back-up plate, from the back-up plate. The mounting machine controls a conveyance unit so as to change a conveyance lane based on mounting conditions when the acquired identification information is identification information which is included in the mounting conditions of a printed circuit board. Meanwhile, in the mounting machine, when the acquired identification information is not the identification information which is included in the mounting conditions of the printed circuit board, the conveyance lane is stopped from being changed. In this manner, a conveyance width of the conveyance lane is not changed when the back-up plate which is ready to be subjected to mounting processing and matches the mounting conditions is not mounted.

Abstract translation: 安装机从备用板取得配置在后备板上的识别信息。 当所获取的识别信息是包含在印刷电路板的安装条件中的识别信息时，安装机器基于安装条件控制输送单元，以便改变输送车道。 同时，在安装机中，当获取的识别信息不是包括在印刷电路板的安装条件中的识别信息时，停止输送车道的改变。 以这种方式，当没有安装准备进行安装处理并与安装条件匹配的后备板时，输送车道的输送宽度不变。

公开(公告)号：US09179542B2

公开(公告)日：2015-11-03

申请号：US14256840

申请日：2014-04-18

Applicant: LOCKHEED MARTIN CORPORATION

Inventor： Michael S. Beck ,  Hilary S. Lackritz ,  Jonathan W. Ward

IPC: G01N21/64 ,  H05K1/02 ,  G01N21/65 ,  B82Y30/00

CPC classification number: H05K1/0275 ,  B82Y30/00 ,  G01N21/643 ,  G01N21/65 ,  G01N2021/6417 ,  G01N2021/6439 ,  H05K1/0266 ,  H05K2201/026 ,  H05K2201/09927 ,  Y10S977/932 ,  Y10T428/24851 ,  Y10T428/24893

Abstract: Identifying marks are often used for authentication and tracking purposes with various types of articles, but they can sometimes be subject to replication or removal by an outside entity, such as a person or group having malicious intent. Carbon nanotubes and other carbon nanomaterials can be used to form identifying marks that are not visible to the naked eye, thereby making the marks more difficult for an outside entity to tamper with. Various articles can include an identifying mark that is not visible to the naked eye, the identifying mark containing a nanomaterial that includes a plurality of carbon nanotubes with a registered distribution of chiralities. The registered distribution of chiralities can be further tailored to increase the level of security provided by the mark.

Abstract translation: 识别标记通常用于与各种类型的文章的认证和跟踪目的，但是它们有时可能被外部实体（例如具有恶意意图的人或组）的复制或删除。 碳纳米管和其他碳纳米材料可以用于形成肉眼不可见的识别标记，从而使得外部实体篡改的标记更加困难。 各种物品可以包括肉眼不可见的识别标记，识别标记包含纳米材料，其包括具有登记的手性分布的多个碳纳米管。 可以进一步量身定制手写登记的分发，以提高商标的安全性。

公开(公告)号：US20140261961A1

公开(公告)日：2014-09-18

申请号：US13839444

申请日：2013-03-15

Applicant: ILLINOIS TOOL WORKS INC.

Inventor： John H. Schneider ,  William A. Herring

IPC: H05K3/30 ,  B32B37/00

CPC classification number: H05K3/305 ,  B32B33/00 ,  B32B2037/268 ,  B32B2367/00 ,  H05K1/0269 ,  H05K2201/09927 ,  H05K2201/09936 ,  Y02P70/613 ,  Y10T156/10 ,  Y10T428/24843 ,  Y10T428/24851 ,  Y10T428/2486

Abstract: A transferable film includes a carrier layer and an intermediate film portion. The carrier layer is configured to receive one or more additional layers and to be releasable from the one or more additional layers temporally proximate to an application of the transferable film to an object. The intermediate film portion includes a readable conductive image portion and is configured for application thereto of an adhesive layer. The intermediate film portion is configured to be interposed between the carrier layer and the adhesive layer, and the adhesive layer configured to adhere to the object for the application of the transferable film to the object.

Abstract translation: 可转印膜包括载体层和中间膜部分。 载体层被配置为接收一个或多个附加层并且可从时间上接近可转移膜施加到物体的一个或多个附加层释放。 中间膜部分包括可读导电图像部分，并且被配置为向其施加粘合剂层。 中间膜部被配置为插入在载体层和粘合剂层之间，并且粘合剂层被构造成粘附到物体上以将可转移膜施加到物体。

公开(公告)号：US08552867B2

公开(公告)日：2013-10-08

申请号：US13233872

申请日：2011-09-15

Applicant: Rony Shachar ,  Srivats Ramaswami ,  David Anderson

Inventor： Rony Shachar ,  Srivats Ramaswami ,  David Anderson

IPC: G08B13/14

CPC classification number: G05B19/128 ,  G05B19/4183 ,  G05B2219/33199 ,  G05B2219/45031 ,  H05K1/0266 ,  H05K3/0052 ,  H05K3/0097 ,  H05K2201/09927 ,  H05K2201/10098 ,  H05K2203/163 ,  Y02P90/10

Abstract: A radio frequency identification (RFID) tag is coupled to a circuit board to track the specific operating and environmental conditions of each stage as the circuit board passes through one or more manufacturing and/or post-manufacturing stages. An RFID reader and data collector are used at each stage to read the RFID tag and store its identifying information along with processing information, operating conditions, and results for each stage. This permits to quickly and accurately collect manufacturing and post-manufacturing information for each circuit board at various stages as well as the operating conditions for each stage at a particular time. Such manufacturing and/or post-manufacturing metrics can then be retrieved on a stage-by-stage basis for a particular circuit board by an identifier associated with the circuit board.

Abstract translation: 当电路板通过一个或多个制造和/或后期制造阶段时，射频识别（RFID）标签被耦合到电路板以跟踪每个级的特定操作和环境条件。 在每个阶段都使用RFID阅读器和数据采集器来读取RFID标签，并将其识别信息与每个阶段的处理信息，操作条件和结果一起存储。 这允许在各个阶段快速且准确地收集每个电路板的制造和后期制造信息以及在特定时间的每个阶段的操作条件。 然后可以通过与电路板相关联的标识符在逐个基础上为特定电路板检索这样的制造和/或后制造度量。

公开(公告)号：US08431827B2

公开(公告)日：2013-04-30

申请号：US13155463

申请日：2011-06-08

Applicant: Hiroshi Nishikawa ,  Taro Hirai

Inventor： Hiroshi Nishikawa ,  Taro Hirai

IPC: H05K1/00

CPC classification number: H05K1/0266 ,  H05K2201/09927 ,  Y10T29/49108 ,  Y10T29/49115 ,  Y10T29/49121 ,  Y10T29/49155

Abstract: Circuit modules including identification codes and a method of managing them are provided. A module substrate includes signal input output terminals and outer ground terminals provided at the peripheral portions of a surface which becomes a mounting surface when the circuit module is completed. An inner-ground-terminal formation area surrounded by the signal input output terminals and the outer ground terminals includes a plurality of inner ground terminals arranged in a matrix of rows and columns. One of the edge portions is a direction identification area. The inner ground terminal is not provided in the direction identification area, and a first identification code having information about the position of the module substrate is provided in the direction identification area.

Abstract translation: 提供了包括识别码的电路模块及其管理方法。 模块基板包括设置在电路模块完成时成为安装表面的表面的周边部分处的信号输入端子和外部接地端子。 由信号输入输出端子和外部接地端子包围的内部 - 地面端子形成区域包括以行和列为矩阵排列的多个内部接地端子。 边缘部分之一是方向识别区域。 内部接地端子不设置在方向识别区域，并且具有关于模块基板的位置的信息的第一识别码被提供在方向识别区域。

公开(公告)号：US20120146794A1

公开(公告)日：2012-06-14

申请号：US13233872

申请日：2011-09-15

Applicant: Rony Shachar ,  Srivats Ramaswami ,  David Anderson

Inventor： Rony Shachar ,  Srivats Ramaswami ,  David Anderson

IPC: G08B13/14

CPC classification number: G05B19/128 ,  G05B19/4183 ,  G05B2219/33199 ,  G05B2219/45031 ,  H05K1/0266 ,  H05K3/0052 ,  H05K3/0097 ,  H05K2201/09927 ,  H05K2201/10098 ,  H05K2203/163 ,  Y02P90/10

Abstract: A radio frequency identification (RFID) tag is coupled to a circuit board to track the specific operating and environmental conditions of each stage as the circuit board passes through one or more manufacturing and/or post-manufacturing stages. An RFID reader and data collector are used at each stage to read the RFID tag and store its identifying information along with processing information, operating conditions, and results for each stage. This permits to quickly and accurately collect manufacturing and post-manufacturing information for each circuit board at various stages as well as the operating conditions for each stage at a particular time. Such manufacturing and/or post-manufacturing metrics can then be retrieved on a stage-by-stage basis for a particular circuit board by an identifier associated with the circuit board.

Abstract translation: 当电路板通过一个或多个制造和/或后期制造阶段时，射频识别（RFID）标签被耦合到电路板以跟踪每个级的特定操作和环境条件。 在每个阶段都使用RFID阅读器和数据采集器来读取RFID标签，并将其识别信息与每个阶段的处理信息，操作条件和结果一起存储。 这允许在各个阶段快速且准确地收集每个电路板的制造和后期制造信息以及在特定时间的每个阶段的操作条件。 然后可以通过与电路板相关联的标识符在逐个基础上为特定电路板检索这样的制造和/或后制造度量。

公开(公告)号：US08072777B2

公开(公告)日：2011-12-06

申请号：US12409527

申请日：2009-03-24

Applicant: Lei Liu ,  Zheng-Heng Sun

Inventor： Lei Liu ,  Zheng-Heng Sun

IPC: H05K7/00

CPC classification number: G09F3/0297 ,  G09F3/12 ,  H05K1/0266 ,  H05K2201/09927 ,  H05K2201/09936 ,  H05K2201/10204 ,  H05K2201/10598 ,  Y10T428/24008

Abstract: A label assembly includes a support and a label body. The label body is configured to allow a label to be attached thereto. The support includes an upright post, and a fixing portion formed at a distal end of the post opposite to the label body. The fixing portion is configured to removably attach the label assembly to a circuit board. A circuit board supporting the label assembly is further provided.

Abstract translation: 标签组件包括支撑件和标签主体。 标签主体被配置为允许附加标签。 支撑件包括立柱，和形成在与标签体相对的柱的远端处的固定部。 固定部分构造成将标签组件可移除地附接到电路板。 还提供了支撑标签组件的电路板。

公开(公告)号：US20110062237A1

公开(公告)日：2011-03-17

申请号：US12561730

申请日：2009-09-17

Applicant: Leonardo Weiss F. Chaves

Inventor： Leonardo Weiss F. Chaves

IPC: G06K7/00 ,  G06K19/07 ,  G06K19/06 ,  G06K7/10 ,  H05K3/00

CPC classification number: G06K19/06046 ,  G06K19/06018 ,  G06K19/06056 ,  G06K19/07749 ,  H05K1/0266 ,  H05K1/0269 ,  H05K1/16 ,  H05K2201/09927 ,  H05K2201/10098 ,  Y10T29/49124

Abstract: Implementations of the present disclosure provide an integrated smart label, comprising a plurality of electronic components, each of the electronic components including a profile defining at least a portion of a machine-readable indicia, at least one of the electronic components storing first data, and the machine-readable indicia being a visual representation of second data. Implementations of the present disclosure also provide a method of producing an integrated smart label, and a system employing an integrated smart label.

Abstract translation: 本公开的实施例提供了一种集成的智能标签，其包括多个电子部件，每个电子部件包括限定机器可读标记的至少一部分的轮廓，存储第一数据的电子部件中的至少一个，以及 机器可读标记是第二数据的视觉表示。 本公开的实现还提供了一种制造集成智能标签的方法，以及采用集成智能标签的系统。

公开(公告)号：US07795722B2

公开(公告)日：2010-09-14

申请号：US11617138

申请日：2006-12-28

Applicant: Shu-Luan Chan ,  Chi-Chih Huang ,  Shuo-Hsun Chang

Inventor： Shu-Luan Chan ,  Chi-Chih Huang ,  Shuo-Hsun Chang

IPC: H01L23/053

CPC classification number: H05K1/0266 ,  H05K3/0035 ,  H05K3/28 ,  H05K3/4602 ,  H05K2201/09781 ,  H05K2201/0989 ,  H05K2201/09927 ,  H05K2201/09936

Abstract: A substrate structure is disclosed. The substrate structure includes a core substrate, an interconnection portion and a solder mask. The core substrate includes a top surface and a bottom surface opposite the top surface. A circuit pattern is disposed on the top surface. The interconnection portion is disposed on the top surface; herein the interconnection portion includes a surface dielectric layer and a surface circuit layer disposed on the surface dielectric layer. The surface circuit layer is electrically connected to the circuit pattern. The solder mask is disposed on the interconnection portion; herein the solder mask includes a hole to identify the substrate structure. Besides, a method for manufacturing the substrate structure is disclosed.

Abstract translation: 公开了一种衬底结构。 基板结构包括芯基板，互连部分和焊接掩模。 核心基板包括顶表面和与顶表面相对的底表面。 电路图案设置在顶表面上。 互连部分设置在顶表面上; 这里的互连部分包括表面电介质层和设置在表面电介质层上的表面电路层。 表面电路层电连接到电路图案。 焊接掩模设置在互连部分上; 这里，焊料掩模包括用于识别衬底结构的孔。 此外，公开了一种用于制造衬底结构的方法。