公开(公告)号：US20100132984A1

公开(公告)日：2010-06-03

申请号：US12629162

申请日：2009-12-02

Applicant: Yuya Narazako ,  Kazunari Sakaki

Inventor： Yuya Narazako ,  Kazunari Sakaki

IPC: H05K1/03 ,  H05K1/16

CPC classification number: H05K1/0216 ,  H05K2201/093 ,  H05K2201/09309 ,  H05K2201/09663 ,  H05K2201/09972

Abstract: In order to reduce noise propagating from a digital signal circuit to an analog signal circuit, a multilayer printed circuit board includes a first digital signal circuit formed in a first region of a front surface, a first analog signal circuit formed in a second region of the front surface, a second digital signal circuit formed at a back surface corresponding to the first region, a second analog signal circuit formed at the back surface corresponding to the second region; an analog ground circuit formed between the front surface and the back surface to ground the first analog signal circuit and the second analog signal circuit, and a first digital ground circuit arranged between the first digital signal circuit and the analog ground circuit and a second digital ground circuit arranged between the second digital signal circuit and the analog ground circuit to ground the first digital signal circuit and the second digital signal circuit.

Abstract translation: 为了减少从数字信号电路传播到模拟信号电路的噪声，多层印刷电路板包括形成在前表面的第一区域中的第一数字信号电路，形成在第一区域的第一模拟信号电路 形成在与第一区域对应的背面的第二数字信号电路，形成在与第二区域对应的背面的第二模拟信号电路; 形成在所述前表面和所述后表面之间以将所述第一模拟信号电路和所述第二模拟信号电路接地的模拟接地电路，以及布置在所述第一数字信号电路和所述模拟地电路之间的第一数字接地电路和第二数字接地 布置在第二数字信号电路和模拟地电路之间以将第一数字信号电路和第二数字信号电路接地的电路。

公开(公告)号：US20100123233A1

公开(公告)日：2010-05-20

申请号：US12273541

申请日：2008-11-18

Applicant: In Sang Yoon ,  SeongMin Lee ,  Sungmin Song

Inventor： In Sang Yoon ,  SeongMin Lee ,  Sungmin Song

IPC: H01L21/50 ,  H01L23/48

CPC classification number: H05K1/144 ,  H01L23/3128 ,  H01L24/73 ,  H01L25/105 ,  H01L2224/04042 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2225/06562 ,  H01L2225/06568 ,  H01L2225/06572 ,  H01L2225/06586 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15321 ,  H01L2924/15331 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H05K1/141 ,  H05K3/3436 ,  H05K2201/09709 ,  H05K2201/09972 ,  H05K2201/10734 ,  H05K2203/049 ,  H01L2924/00012 ,  H01L2224/32225 ,  H01L2924/00 ,  H01L2224/0401

Abstract: A method of manufacturing an integrated circuit package system including: providing a circuit board having an interconnect thereon; mounting a first device offset on the circuit board; and applying a first encapsulant of a first thickness over the first device, the first encapsulant of a second thickness thinner than the first thickness over the remainder of the circuit board with the interconnect exposed, or a second encapsulant of a third thickness over a second device on an opposite surface of the circuit board and differently offset from the first device.

Abstract translation: 一种制造集成电路封装系统的方法，包括：提供其上具有互连的电路板; 在电路板上安装第一设备偏移; 以及在所述第一装置上施加第一厚度的第一密封剂，所述第一密封剂的第二厚度比所述电路板的剩余部分薄于所述第一厚度，所述第一厚度在所述第一装置上暴露，或者在第二装置上具有第三厚度的第二密封剂 在电路板的相对表面上，并且与第一器件不同地偏移。

公开(公告)号：US07676917B2

公开(公告)日：2010-03-16

申请号：US11727279

申请日：2007-03-26

Applicant: James A. McCall ,  David Shykind

Inventor： James A. McCall ,  David Shykind

IPC: H05K3/02 ,  H05K3/10

CPC classification number: H05K3/10 ,  H05K1/0216 ,  H05K1/0245 ,  H05K1/0248 ,  H05K1/0366 ,  H05K3/0052 ,  H05K2201/0187 ,  H05K2201/029 ,  H05K2201/09236 ,  H05K2201/09972 ,  H05K2203/1554 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49798 ,  Y10T428/24058 ,  Y10T428/24917 ,  Y10T428/249935 ,  Y10T428/24994 ,  Y10T428/249943 ,  Y10T428/249946 ,  Y10T442/2926 ,  Y10T442/2992 ,  Y10T442/3065

Abstract: A method of manufacturing a circuit board which may include the steps of forming a circuit board with horizontal and vertical fiberglass fibers, rotating the circuit board, and cutting the circuit board so that the horizontal and vertical fiberglass fibers form a non-right angle with a cut line of the circuit board. The circuit board may have a plurality of conductive traces located thereon which pass by areas of higher fiberglass-to-resin material and lower fiberglass-to-resin material to assist in reducing differential to common mode conversion between signals in the plurality of conducive traces.

Abstract translation: 一种制造电路板的方法，其可以包括以下步骤：形成具有水平和垂直玻璃纤维的电路板，旋转电路板和切割电路板，使得水平和垂直玻璃纤维与...形成非直角 切割电路板的线。 电路板可以具有位于其上的多个导电迹线，其通过较高玻璃纤维 - 树脂材料的区域和较低的玻璃纤维 - 树脂材料，以帮助减少在多个导电迹线中的信号之间的共模转换的差异。

公开(公告)号：US20100061736A1

公开(公告)日：2010-03-11

申请号：US12554251

申请日：2009-09-04

Applicant: Toshiyuki KAWAGUCHI ,  Kazutoki TAHARA ,  Tsutomu SAGA

Inventor： Toshiyuki KAWAGUCHI ,  Kazutoki TAHARA ,  Tsutomu SAGA

IPC: H04B10/02

CPC classification number: H05K1/147 ,  H05K1/0234 ,  H05K1/0237 ,  H05K1/0393 ,  H05K1/167 ,  H05K1/189 ,  H05K2201/049 ,  H05K2201/055 ,  H05K2201/0715 ,  H05K2201/09236 ,  H05K2201/09627 ,  H05K2201/0979 ,  H05K2201/09972 ,  H05K2201/10121

Abstract: An optical transceiver of the present invention comprising an OSA, a circuit board, and a flexible substrate connecting these, in which the flexible substrate has high-speed signal lines and other lines other than the high speed signal lines provided separated from each other on the same surface, a ground layer placed apart and opposite these, and a resistive layer placed apart and opposite the high-speed signal lines, the other lines and the ground layer. High-speed signal and the resistive layer are opposite at least a part of the other lines.

Abstract translation: 本发明的光收发器包括OSA，电路板和连接它们的柔性基板，其中柔性基板具有高速信号线和除了高速信号线之外的其它线路，所述高速信号线彼此分离， 相同的表面，与这些放置分离并相对的接地层，以及与高速信号线，其他线路和接地层分开并相对的电阻层。 高速信号和电阻层与其他线路的至少一部分相对。

公开(公告)号：US20100060454A1

公开(公告)日：2010-03-11

申请号：US12558484

申请日：2009-09-11

Applicant: Armen E. Kazanchian

Inventor： Armen E. Kazanchian

IPC: G08B13/14 ,  H04W84/02

CPC classification number: H05K1/0218 ,  H04W88/06 ,  H05K1/0243 ,  H05K3/403 ,  H05K2201/09972 ,  H05K2201/10371

Abstract: A wireless module is configurable by a user to operate in different modes as a transmitter, receiver, transceiver, and repeater. A method of transmitting and receiving data while substantially reducing or eliminating interference from competing frequency bands, including Wi-Fi systems, as well as a method of transmitting data with a high degree of certainty without requiring an acknowledgement receipt, negotiation, or hand-shaking from a down line transceiver, receiver and/or repeater are disclosed.

Abstract translation: 无线模块可由用户配置，以作为发射机，接收机，收发机和中继器以不同的模式操作。 一种在显着减少或消除包括Wi-Fi系统的竞争频带的干扰的同时发送和接收数据的方法，以及一种高度确定性地发送数据的方法，而不需要确认接收，协商或手握 从下行收发器，接收器和/或中继器被公开。

公开(公告)号：US20100044100A1

公开(公告)日：2010-02-25

申请号：US12065042

申请日：2006-08-03

Applicant: Masahiro Ono ,  Yosihiro Uda ,  Seiji Yamaguchi ,  Kazuhiro Shinchi ,  Satoru Tomekawa

Inventor： Masahiro Ono ,  Yosihiro Uda ,  Seiji Yamaguchi ,  Kazuhiro Shinchi ,  Satoru Tomekawa

IPC: H01L23/28

CPC classification number: H05K3/284 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/19105 ,  H05K1/0218 ,  H05K7/20463 ,  H05K9/0083 ,  H05K2201/09972 ,  H05K2201/10371 ,  H05K2201/2018 ,  H01L2224/0401

Abstract: A substrate structure whereby a resin part for coating a plurality of electronic components by one operation is given a shielding property and the mounting strength of electronic components with respect to the substrate is secured and an electronic device including the substrate structure are provided.A substrate structure 10 includes a substrate 11, a plurality of electronic components 12 mounted along the substrate 11, and a resin part 13 coating each electronic component 12 with a resin 18 while kept in close contact with the substrate 11. The substrate structure 10 includes a frame body 15 surrounding each electronic component 12 while kept in close contact with the substrate 11 and a lid part 17 closing an opening 16 in the frame body 15, and a resin 18 is filled inside the frame body 15.

Abstract translation: 具有通过一次操作涂覆多个电子部件的树脂部件的基板结构被确定，并且确保了电子部件相对于基板的安装强度，并且提供了包括该基板结构的电子设备。 基板结构10包括基板11，沿着基板11安装的多个电子部件12以及与基板11保持紧密接触的，用树脂18涂覆各电子部件12的树脂部13。 同时保持与基板11紧密接触的每个电子部件12的框体15和封闭框体15中的开口16的盖部17，并且树脂18填充在框体15的内部。

公开(公告)号：US07666292B2

公开(公告)日：2010-02-23

申请号：US11334240

申请日：2006-01-17

Applicant: Jae Choon Cho ,  Il Sang Maeng ,  Choon Keun Lee ,  Seung Hyun Ra

Inventor： Jae Choon Cho ,  Il Sang Maeng ,  Choon Keun Lee ,  Seung Hyun Ra

IPC: C25D5/02

CPC classification number: H05K3/107 ,  H01L2251/105 ,  H05K3/045 ,  H05K3/181 ,  H05K2201/09972 ,  H05K2203/0108 ,  Y10T29/49126

Abstract: The present invention relates to a method of manufacturing a printed circuit board using an imprinting process, in which a pattern having a large area can be uniformly formed using a plurality of molds, and the plurality of molds is sequentially removed, thereby solving problems occurring in release of the molds from an insulating layer.

Abstract translation: 本发明涉及使用压印工艺制造印刷电路板的方法，其中可以使用多个模具均匀地形成具有大面积的图案，并且顺序地移除多个模具，从而解决了在 从绝缘层释放模具。

公开(公告)号：US20100027225A1

公开(公告)日：2010-02-04

申请号：US12579617

申请日：2009-10-15

Applicant: Kazuyuki YUDA ,  Tsutomu IEKI

Inventor： Kazuyuki YUDA ,  Tsutomu IEKI

IPC: H05K1/14 ,  B32B38/10 ,  H05K3/30

CPC classification number: H05K1/141 ,  H01L23/552 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/15192 ,  H01L2924/15313 ,  H01L2924/19105 ,  H05K1/0218 ,  H05K1/183 ,  H05K1/187 ,  H05K3/007 ,  H05K3/20 ,  H05K3/284 ,  H05K3/303 ,  H05K3/46 ,  H05K3/4694 ,  H05K3/4697 ,  H05K2201/0715 ,  H05K2201/0979 ,  H05K2201/09972 ,  H05K2203/016 ,  H05K2203/167 ,  Y10T29/4913 ,  H01L2224/0401

Abstract: A component-embedded module includes a module substrate having wiring electrodes on the upper surface thereof, first circuit components mounted on the wiring electrodes, a sub-module disposed on an area on which no wiring electrodes are provided, and an insulating resin layer provided on substantially the entire upper surface of the module substrate such that the insulating resin layer covers at least a portion of the first circuit components and sub-module. The second circuit components including an integrated circuit element are mounted on the sub-module or embedded therein. Via conductors are provided through the module substrate from the lower surface thereof and are directly coupled to terminal electrodes on the lower surface of the sub-module. By using a substrate having a wiring greater accuracy than that of the module substrate, a reliable component-embedded module is obtained.

Abstract translation: 组件嵌入式模块包括在其上表面上具有布线电极的模块基板，安装在布线电极上的第一电路部件，设置在不设有布线电极的区域上的子模块以及设置在其上的绝缘树脂层 基本上整个模块基板的上表面，使得绝缘树脂层覆盖第一电路部件和子模块的至少一部分。 包括集成电路元件的第二电路部件安装在子模块上或嵌入其中。 通孔导体通过模块基板从其下表面提供，并且直接耦合到子模块的下表面上的端子电极。 通过使用具有比模块基板的布线精度更高的布线的基板，获得了可靠的部件嵌入式模块。

公开(公告)号：US07655870B2

公开(公告)日：2010-02-02

申请号：US11829972

申请日：2007-07-30

Applicant: Liang-Yao Chang ,  Shou-Kuo Hsu

Inventor： Liang-Yao Chang ,  Shou-Kuo Hsu

IPC: H05K1/03

CPC classification number: H05K1/0225 ,  H05K2201/093 ,  H05K2201/09309 ,  H05K2201/09663 ,  H05K2201/0969 ,  H05K2201/09972

Abstract: An exemplary printed circuit board includes a power plane, and a ground plane. The power plane includes two power modules, and an insulating medium for insulating the two power modules from each other. The ground plane is insulated from the power plane, a plurality of slots is defined in the ground plane and located close to facing edges of the two power modules, and the slots are arranged in rows along the facing edges of the two power modules.

Abstract translation: 示例性印刷电路板包括电源平面和接地平面。 电力平面包括两个电源模块和用于将两个电源模块彼此绝缘的绝缘介质。 接地层与电源平面绝缘，多个槽位于接地平面内，靠近两个电源模块的相对边缘，并沿着两个电源模块的相对边缘排成行。

公开(公告)号：US20100020510A1

公开(公告)日：2010-01-28

申请号：US12406160

申请日：2009-03-18

Applicant: Chul-woo OH ,  Joong-gi KWON

Inventor： Chul-woo OH ,  Joong-gi KWON

IPC: H05K7/00

CPC classification number: H02M3/00 ,  G03G15/80 ,  H05K1/0256 ,  H05K1/0262 ,  H05K1/189 ,  H05K2201/042 ,  H05K2201/09972

Abstract: Provided is a high-voltage power supply including a board having at least one bent portion separating a first region of the board from a second region of the board, the first region not being coplanar with the second region of the board; a first circuit, on the first region of the board, generating a second voltage according to a first voltage; and a second circuit, on the second region of the board, amplifying the second voltage and then rectifying the amplified second voltage.

Abstract translation: 本发明提供一种高压电源，其特征在于，包括具有将所述基板的第一区域与所述基板的第二区域分开的至少一个弯曲部分的基板，所述第一区域不与所述基板的第二区域共面; 在所述板的第一区域上的第一电路，根据第一电压产生第二电压; 以及第二电路，在所述板的第二区域上放大所述第二电压，然后对所述放大的第二电压进行整流。