公开(公告)号：US20170359898A1

公开(公告)日：2017-12-14

申请号：US15176548

申请日：2016-06-08

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Lei Shan

IPC: H05K1/18 ,  H01L23/498 ,  H05K3/30 ,  H05K1/11 ,  H05K3/36 ,  H01L23/00 ,  H05K1/14 ,  H05K3/40 ,  H01L21/56 ,  H05K1/03 ,  H01L21/48 ,  H05K1/09 ,  H05K3/00

CPC classification number: H05K1/183 ,  H01L21/4853 ,  H01L21/486 ,  H01L21/563 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49833 ,  H01L23/49838 ,  H01L23/49866 ,  H01L23/49894 ,  H01L24/81 ,  H01L2224/16235 ,  H01L2224/16265 ,  H01L2224/81203 ,  H01L2224/81815 ,  H01L2924/01074 ,  H01L2924/15724 ,  H01L2924/15747 ,  H01L2924/15763 ,  H01L2924/19011 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19102 ,  H05K1/0313 ,  H05K1/036 ,  H05K1/09 ,  H05K1/115 ,  H05K1/144 ,  H05K3/0047 ,  H05K3/005 ,  H05K3/30 ,  H05K3/368 ,  H05K3/4038 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/1003 ,  H05K2203/1305

Abstract: An embodiment of the invention may include a method, and resulting structure, of forming a semiconductor structure. The method may include forming a component hole from a first surface to a second surface of a base layer. The method may include placing an electrical component in the component hole. The electrical component has a conductive structure on both ends of the electrical component. The electrical component is substantially parallel to the first surface. The method may include forming a laminate layer on the first surface of the base layer, the second surface of the base layer, and between the base layer and the electrical component. The method may include creating a pair of via holes, where the pair of holes align with the conductive structures on both ends of the electrical component. The method may include forming a conductive via in the pair of via holes.

公开(公告)号：US09839129B2

公开(公告)日：2017-12-05

申请号：US15395045

申请日：2016-12-30

Applicant: TDK Corporation

Inventor： Nobuo Takagi ,  Kouyu Ohi ,  Tasuku Mikogami ,  Setu Tsuchida

IPC: H01F27/28 ,  H05K1/18 ,  H05K3/34 ,  H01F27/24 ,  H01F27/29

CPC classification number: H05K1/181 ,  H01F3/10 ,  H01F19/04 ,  H01F27/24 ,  H01F27/2823 ,  H01F27/2828 ,  H01F27/292 ,  H05K3/3442 ,  H05K2201/1003 ,  Y02P70/611 ,  Y02P70/613

Abstract: Disclosed herein is a coil component that includes a drum-shaped core having a first flange part provided at one end of a winding core part, first to fourth terminal electrodes formed on the first flange part so as to be arranged in this order in a second direction, and first to fourth wires wound around the winding core part. One ends of the first to fourth wires are connected to different ones of the first to fourth terminal electrodes. The first and second terminal electrodes are not symmetrical with the third and fourth terminal electrodes so that the third and fourth terminal electrodes are offset outward compared with the first and second terminal electrodes.

公开(公告)号：US09837923B2

公开(公告)日：2017-12-05

申请号：US15247135

申请日：2016-08-25

Applicant: General Electric Company

Inventor： Ravisekhar Nadimpalli Raju ,  Mark Edward Dame ,  Nathaniel Benedict Hawes

IPC: H02M7/00 ,  H05K3/30 ,  H05K7/20 ,  H01F38/14 ,  H05K1/02 ,  H05K1/03 ,  H05K1/18 ,  H01F27/10 ,  H01F27/28

CPC classification number: H02M7/003 ,  H01F27/10 ,  H01F27/2847 ,  H01F38/14 ,  H01F2027/2861 ,  H01L23/3735 ,  H05K1/0204 ,  H05K1/0306 ,  H05K1/18 ,  H05K3/30 ,  H05K7/1432 ,  H05K7/2089 ,  H05K2201/1003 ,  H05K2201/10053 ,  H05K2201/10174

Abstract: A power converter for a power system includes an input ceramic layer, an output ceramic layer, an input stage coupled to the input ceramic layer, an output stage coupled to the output ceramic layer, and a planar transformer coupled between said input stage and said output stage. The input receives a power input and the output stage generates a power output at least partially as a function of the power input. The planar transformer includes an input winding coupled to the input stage and an output winding coupled to the output stage. The input winding has a plurality of input turns and the output winding has a plurality of output turns. The input turns interleave the output turns.

公开(公告)号：US20170345756A1

公开(公告)日：2017-11-30

申请号：US15600913

申请日：2017-05-22

Applicant: Delta Electronics (Shanghai) CO., LTD

Inventor： Guodong YIN ,  Jinfa ZHANG ,  Haijun YANG ,  Ben WU ,  Lei CAI ,  Zhongwei KE

IPC: H01L23/522 ,  H01L23/64 ,  H05K7/14 ,  H01L23/528 ,  H01L49/02

CPC classification number: H01L23/5227 ,  H01F27/2804 ,  H01F2027/2809 ,  H01F2027/2819 ,  H01L23/5286 ,  H01L23/645 ,  H01L28/10 ,  H05K1/0265 ,  H05K1/165 ,  H05K7/1457 ,  H05K2201/086 ,  H05K2201/1003 ,  H05K2201/1028 ,  H05K2201/10287

Abstract: A power module and a power device having the power module are disclosed. The power device includes a main board. The power module is inserted in the main board and includes a PCB, a magnetic element, a primary winding circuit and at least one secondary winding circuit. The magnetic element is provided on the PCB and includes a core structure, a primary winding and at least one secondary winding. The core structure has a first side and a second side opposite to each other, and a third side and a fourth side opposite to each other. The primary winding circuit is provided on the PCB and positioned in the vicinity of the first or second side of the core structure. The secondary winding circuit is provided on the PCB and positioned in the vicinity of the third or fourth side of the core structure.

公开(公告)号：US20170345545A1

公开(公告)日：2017-11-30

申请号：US15168365

申请日：2016-05-31

Applicant: COOPER TECHNOLOGIES COMPANY

Inventor： Zhuo Min Liu ,  Ramdev Kanapady

IPC: H01F27/28 ,  H01F27/24 ,  H05K1/18

CPC classification number: H01F27/28 ,  H01F27/06 ,  H01F27/24 ,  H01F27/2852 ,  H01F27/306 ,  H01F2027/065 ,  H05K1/0263 ,  H05K1/181 ,  H05K2201/086 ,  H05K2201/1003 ,  Y02P70/611

Abstract: An electromagnetic component for a circuit board includes first and second magnetic core pieces and a bifilar coil extending between the first and second magnetic core pieces. The bifilar coil includes a first coil segment having first and second surface mount terminations, and a second coil segment having third and fourth surface mount terminations. The bifilar coil and core pieces facilitate a significant height reduction in the component while offering the same performance as existing power inductor components.

公开(公告)号：US09819263B2

公开(公告)日：2017-11-14

申请号：US15286542

申请日：2016-10-05

Applicant: DELTA ELECTRONICS, INC.

Inventor： Jian-Hong Zeng ,  Shou-Yu Hong ,  Xiao-Ni Xin ,  Pei-Qing Hu

IPC: H02M3/156 ,  H05K1/02 ,  H05K1/18 ,  H05K3/22 ,  H01F27/24 ,  H05K3/30 ,  H05K1/11 ,  H01F27/28 ,  H05K3/40 ,  H05K1/14

CPC classification number: H02M3/156 ,  H01F27/24 ,  H01F27/28 ,  H01F27/292 ,  H01F41/02 ,  H05K1/028 ,  H05K1/111 ,  H05K1/145 ,  H05K1/147 ,  H05K1/18 ,  H05K1/181 ,  H05K3/22 ,  H05K3/305 ,  H05K3/4038 ,  H05K2201/1003 ,  H05K2201/10946 ,  H05K2203/02 ,  H05K2203/0228

Abstract: A power converter includes a carrier, a first electronic component, a second electronic component, and a connection part. The first electronic component is disposed on the bottom surface of the carrier. The second electronic component is disposed on the top surface of the carrier. A first terminal of the connection part is coupled to the top surface or the bottom surface of the carrier. A second terminal of the connection part is a bonding pad and attached to the first electronic component's surface apart from the carrier. The carrier is disposed at ⅓ to ⅔ of a height of the power-converter. The connection part is fabricated by mechanical support of the first electronic component.

公开(公告)号：US20170311447A1

公开(公告)日：2017-10-26

申请号：US15495405

申请日：2017-04-24

Applicant: LINEAR TECHNOLOGY CORPORATION

Inventor： John David BRAZZLE ,  Frederick E. BEVILLE ,  David A. PRUITT

IPC: H05K1/18 ,  H05K3/34 ,  H05K1/02 ,  H05K3/28

CPC classification number: H05K1/181 ,  H01L23/49811 ,  H01L23/50 ,  H05K1/0203 ,  H05K3/284 ,  H05K3/3426 ,  H05K2201/1003 ,  H05K2201/10515 ,  H05K2201/10522 ,  H05K2201/10553 ,  H05K2201/10757 ,  H05K2203/1316

Abstract: A component-on-package circuit may include a component for an electrical circuit and a circuit module attached to the component. The circuit module may have circuitry and at least one leadframe which connects the circuitry to the component both electrically and thermally. The leadframe may have a high degree of both electrical and thermal conductivity and a non-planar shape that provides spring-like cushioning of force applied to the component in the direction of the circuit module.A method of making a component-on-package circuit may include attaching a component for an electrical circuit to a circuit module. The circuit module may have circuitry and at least one leadframe which connects the circuitry to the component after the attachment both electrically and thermally. The leadframe may have a high degree of both electrical and thermal conductivity and a non-planar shape that provides a spring-like cushioning of force applied to the component in the direction of the circuit module. The circuit module may be encapsulated in molding material after the circuit module has been attached to the component, without encapsulation the component at the same time.

公开(公告)号：US20170287615A1

公开(公告)日：2017-10-05

申请号：US15447267

申请日：2017-03-02

Applicant: Delta Electronics (Shanghai) CO., LTD

Inventor： Zengyi LU ,  Shaohua ZHU ,  Haijun YANG

IPC: H01F27/24 ,  H02M3/156 ,  H05K1/18 ,  H01F27/28 ,  H01F1/34

CPC classification number: H01F27/24 ,  H01F1/34 ,  H01F3/10 ,  H01F3/14 ,  H01F17/04 ,  H01F27/2823 ,  H02M3/00 ,  H02M3/156 ,  H02M2001/008 ,  H05K1/0262 ,  H05K1/18 ,  H05K2201/1003

Abstract: A power supply module having two output voltages includes an inductor module and a main board. The inductor module includes a first magnetic core, a second magnetic core, an intermediate magnetic core disposed therebetween, a first winding and a second winding. The first winding is disposed on one of a magnetic column of the first magnetic core and a magnetic column of the intermediate magnetic core to form a first inductor. The second winding is disposed on one of a magnetic column of the second magnetic core and a magnetic column of the intermediate magnetic core to form a second inductor. There is no air gap at a portion of the intermediate magnetic core where magnetic paths of the first and second inductors pass through together. The inductor module is disposed on the main board. The first winding and the second winding are electrically connected with the main board.

公开(公告)号：US09781835B2

公开(公告)日：2017-10-03

申请号：US14438666

申请日：2013-05-09

Applicant: LG INNOTEK CO., LTD.

Inventor： Won Suk Jung ,  Kyu Won Lee ,  Yun Ho An ,  Woo Young Lee

IPC: H05K1/18 ,  H05K1/03 ,  H05K1/16 ,  H05K3/30 ,  H05K3/46 ,  H01L23/00 ,  H05K1/02 ,  H05K1/11 ,  H01L23/498 ,  H01L21/48 ,  H01L23/538 ,  H01L23/31

CPC classification number: H05K1/186 ,  H01L21/4857 ,  H01L21/486 ,  H01L23/3135 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/20 ,  H01L24/97 ,  H01L2224/04105 ,  H01L2224/2402 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/82039 ,  H01L2224/83005 ,  H01L2224/8314 ,  H01L2224/83191 ,  H01L2224/92144 ,  H01L2224/97 ,  H01L2924/15787 ,  H01L2924/15788 ,  H05K1/0298 ,  H05K1/0366 ,  H05K1/115 ,  H05K1/185 ,  H05K3/305 ,  H05K3/4602 ,  H05K2201/0195 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/1003 ,  H05K2201/10984 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2224/83 ,  H01L2224/82

Abstract: Provided is a printed circuit board including: an insulating layer; electronic devices embedded in the insulating layer; and an adhesive layer for fixing the electronic devices.

公开(公告)号：US20170280595A1

公开(公告)日：2017-09-28

申请号：US15528603

申请日：2015-11-06

Applicant: KABUSHIKI KAISHA TOYOTA JIDOSHOKKI

Inventor： Shogo MORI ,  Naoki KATO ,  Hiroshi YUGUCHI ,  Yoshitaka IWATA ,  Masahiko KAWABE ,  Yuri OTOBE

IPC: H05K7/20 ,  H01L21/48 ,  H02M7/42 ,  H05K7/14 ,  H02M7/00

CPC classification number: H05K7/20927 ,  H01L21/4846 ,  H01L23/29 ,  H01L23/3121 ,  H01L2224/32221 ,  H01L2924/0002 ,  H02M7/003 ,  H02M7/42 ,  H02M2001/327 ,  H05K1/0204 ,  H05K1/0207 ,  H05K1/021 ,  H05K1/185 ,  H05K3/4697 ,  H05K7/14 ,  H05K7/20263 ,  H05K7/20436 ,  H05K2201/1003 ,  H05K2201/10166 ,  H01L2924/00

Abstract: An electronic device includes a heat dissipation member, a power element that is thermally coupled to the heat dissipation member, and a first conductive layer to which the power element is electrically coupled. The electronic device further includes a control element that controls a switching operation of the power element, a second conductive layer to which the control element is electrically coupled, and a resin layer arranged between the first conductive layer and the second conductive layer. The power element is embedded in the resin layer. The first conductive layer, the resin layer, and the second conductive layer are stacked on the heat dissipation member in this order from the ones closer to the heat dissipation member.