公开(公告)号：US09000453B2

公开(公告)日：2015-04-07

申请号：US13724713

申请日：2012-12-21

Applicant: David Hamby ,  Adam Scotch

Inventor： David Hamby ,  Adam Scotch

IPC: H01L21/00 ,  H02H3/20 ,  H05K1/02 ,  H05K1/18 ,  H02H7/20 ,  H05K1/16 ,  H02H9/04

CPC classification number: H02H3/20 ,  H02H7/20 ,  H02H9/046 ,  H05K1/0259 ,  H05K1/16 ,  H05K1/189 ,  H05K2201/0329 ,  H05K2201/0738 ,  H05K2201/10106 ,  H05K2201/10174

Abstract: Systems and methods for protecting electrical components such as light emitting diodes are described. In some embodiments, electrical components are protected from high level electrostatic discharge (“ESD”) events by a circuit board that provides an intrinsic level of ESD protection. At the same time, such electrical components are protected against low level ESD events by one or more diodes that are electrically coupled thereto. The one or more diodes may be thin film diodes comprising at least one layer of p-type semiconductive material and at least one layer of n-type semiconductive material. Devices including ESD protection and methods for manufacturing such devices are also described.

Abstract translation: 描述了用于保护诸如发光二极管的电气部件的系统和方法。 在一些实施例中，通过提供固有水平的ESD保护的电路板来保护电气部件免受高电平静电放电（“ESD”）事件的影响。 同时，通过与电耦合到其上的一个或多个二极管来保护这种电气部件免受低电平ESD事件的影响。 一个或多个二极管可以是包括至少一层p型半导体材料和至少一层n型半导体材料的薄膜二极管。 还描述了包括ESD保护的装置和用于制造这种装置的方法。

公开(公告)号：US08964410B2

公开(公告)日：2015-02-24

申请号：US13706536

申请日：2012-12-06

Applicant: Acbel Polytech Inc.

Inventor： Shun-Te Chang ,  Chien-Hua Wu ,  Chia-An Yeh ,  Hsiang-Yu Hung

IPC: H05K7/00 ,  H05K1/18 ,  H01F27/28 ,  H05K1/14 ,  H05K3/36 ,  H01F27/40

CPC classification number: H05K1/18 ,  H01F27/2866 ,  H01F2027/2814 ,  H01F2027/408 ,  H05K1/141 ,  H05K1/181 ,  H05K3/366 ,  H05K2201/1003 ,  H05K2201/10174 ,  Y02P70/611

Abstract: A transformer has two magnetic cores, at least one primary winding unit mounted in the magnetic cores, at least one secondary winding unit mounted in the magnetic cores and two rectifying circuit boards externally mounted beside the magnetic cores. An AC voltage output from the secondary winding unit is transmitted to and rectified by the rectifying circuit board. Therefore, the size of the transformer is compact, and heat energy generated by electronic elements mounted on the rectifying circuit board is effectively dissipated to maintain normal operation of the transformer. Further, since the transmission path from the secondary winding unit to the rectifying circuit board is short, energy loss is reasonably reduced when the transformer is operated under a high frequency situation or a larger current mode.

Abstract translation: 变压器具有两个磁芯，安装在磁芯中的至少一个初级绕组单元，安装在磁芯中的至少一个次级绕组单元和外部安装在磁芯旁边的两个整流电路板。 从次级绕组单元输出的交流电压被整流电路板传输并整流。 因此，变压器的尺寸紧凑，并且安装在整流电路板上的电子元件产生的热能被有效地消散，以保持变压器的正常工作。 此外，由于从次级绕组单元到整流电路板的传输路径短，当变压器在高频情况下或较大的电流模式下工作时，能量损耗被合理地减小。

公开(公告)号：US20150029759A1

公开(公告)日：2015-01-29

申请号：US14339859

申请日：2014-07-24

Applicant: DENSO CORPORATION

Inventor： Yuuki TAKEMOTO ,  Katsutoyo MISAWA ,  Yuuichi HANDA ,  Syotarou YAMASAKI ,  Syuji KURAUCHI ,  Kenta HATAKENAKA

IPC: H02M3/335

CPC classification number: H02M3/33507 ,  B60L11/00 ,  B60L15/007 ,  B60L2210/10 ,  H01F5/00 ,  H02M3/00 ,  H02M3/337 ,  H05K1/0263 ,  H05K1/18 ,  H05K2201/1003 ,  H05K2201/10166 ,  H05K2201/10174 ,  H05K2201/10515 ,  Y02T10/645 ,  Y02T10/7216

Abstract: An electric power source device has a transformer, a primary-side semiconductor module, a secondary-side semiconductor module, a secondary-side electrical component, a base plate and a circuit substrate on which substrate-side electrical components are mounted. The primary-side semiconductor module has a larger exterior size than the secondary-side electrical component. The primary-side semiconductor module and the secondary-side electrical component form a stacked section. In the stacked section, the secondary-side electrical component is stacked, in a vertical direction, i.e. a direction of a normal line of a mounting surface of the base plate, on the primary-side semiconductor module. The primary-side semiconductor module is directly mounted on the mounting surface. At least a part of the substrate-side electrical components is arranged inside of the primary-side semiconductor module in a horizontal direction, and inside of a second surface of the stacked section toward the mounting surface along the normal line.

Abstract translation: 电源装置具有安装有基板侧电气部件的变压器，初级侧半导体模块，二次侧半导体模块，二次侧电气部件，基板以及电路基板。 初级侧半导体模块具有比次级侧电气部件更大的外部尺寸。 初级侧半导体模块和次级侧电气部件形成堆叠部。 在堆叠部分中，次级侧电气元件在初级侧半导体模块上沿垂直方向，即基板的安装表面的法线方向堆叠。 初级侧半导体模块直接安装在安装面上。 基板侧电气部件的至少一部分在水平方向配置在一次侧半导体模块的内部，在堆叠部的第二面的内侧沿着法线配置在安装面上。

公开(公告)号：US08912090B2

公开(公告)日：2014-12-16

申请号：US14047551

申请日：2013-10-07

Applicant: Marki Microwave, Inc.

Inventor： Christopher Ferenc Marki

IPC: H01L21/00 ,  H01L21/4763 ,  H03D7/02 ,  H05K3/30 ,  H05K1/02 ,  H03H1/00 ,  H05K3/46 ,  H05K1/03 ,  H05K1/16

CPC classification number: H03D7/02 ,  H01P5/10 ,  H03D7/1408 ,  H03D7/1458 ,  H03D7/1466 ,  H03D2200/0023 ,  H03H1/00 ,  H05K1/0243 ,  H05K1/0306 ,  H05K1/165 ,  H05K3/30 ,  H05K3/4605 ,  H05K2201/10174 ,  Y10T29/49128

Abstract: An improved microwave mixer manufactured using multilayer processing includes an integrated circuit that is electrically connected to a top metal layer of a substrate. The microwave mixer includes: a first metal layer; a dielectric substrate on the first metal layer; a second metal layer directly on the substrate, at least two passive circuits arranged on the second metal layer and a top layer metal; a thin dielectric layer on the second metal layer, wherein the top layer metal is directly on the thin dielectric layer; an integrated circuit (IC) attached to the second metal layer, wherein the IC includes at least one combination of non-linear devices, and wherein the IC is directly connected to the passive circuits on the second metal layer; and a protection layer on the IC.

Abstract translation: 使用多层处理制造的改进的微波混频器包括电连接到衬底的顶部金属层的集成电路。 微波混合器包括：第一金属层; 第一金属层上的电介质基板; 直接在所述基板上的第二金属层，布置在所述第二金属层上的至少两个无源电路和顶层金属; 在所述第二金属层上的薄介电层，其中所述顶层金属直接在所述薄介电层上; 连接到所述第二金属层的集成电路（IC），其中所述IC包括非线性器件的至少一种组合，并且其中所述IC直接连接到所述第二金属层上的无源电路; 和IC上的保护层。

公开(公告)号：US20140301054A1

公开(公告)日：2014-10-09

申请号：US14355190

申请日：2012-11-22

Applicant: NGK SPARK PLUG CO., LTD.

Inventor： Makoto Nagai ,  Kenzo Kawaguchi

IPC: H05K1/18

CPC classification number: H05K1/184 ,  H01L25/167 ,  H01L33/62 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/30107 ,  H05K1/0257 ,  H05K1/185 ,  H05K3/4602 ,  H05K2201/0979 ,  H05K2201/10106 ,  H05K2201/10174 ,  H01L2924/00014 ,  H01L2924/00

Abstract: To provide a light emitting element mounting wiring substrate having a light emitting element mounting section on a substrate main body having a front surface and a back surface, and a confined component electrically connected to the light emitting element, such that the confine component does not obstruct the optical path of the light emitted from the light emitting element, resulting in uniform distribution of light intensity. The light emitting element mounting wiring substrate (1a) includes a substrate main body (2) which has a front surface (3) and a back surface (4) and which includes at least an insulating substrate (2a), and a plurality of element terminals (13, 14) formed on the front surface (3) of the substrate main body (2), at least one of the element terminals having a light emitting element mounting section (fa) on the top surface thereof, wherein the wiring substrate has a Zener diode (confined element) (10) embedded in the substrate main body (2), which element is electrically connected to a light emitting element (20) mounted on the mounting section (fa) and prevents application of overvoltage to the light emitting element (20).

Abstract translation: 为了提供一种在具有前表面和背面的基板主体上具有发光元件安装部的发光元件安装布线基板，以及与发光元件电连接的限制部件，使得限制部件不会阻塞 从发光元件发射的光的光路，导致光强度的均匀分布。 发光元件安装用配线基板（1a）具备：具有前表面（3）和背面（4）的至少包含绝缘基板（2a）的基板主体（2），以及多个元件 形成在基板主体（2）的前表面（3）上的端子（13,14）中的至少一个元件端子在其顶表面上具有发光元件安装部（fa），其中布线基板 具有嵌入在基板主体（2）中的齐纳二极管（限制元件）（10），该元件电连接到安装在安装部分（fa）上的发光元件（20），并且防止对光线施加过电压 发光元件（20）。

公开(公告)号：US20130301982A1

公开(公告)日：2013-11-14

申请号：US13941425

申请日：2013-07-12

Applicant: YTEL PHOTONICS INC.

Inventor： Yong Tak Lee

IPC: G02B6/12 ,  G02B6/42

CPC classification number: G02B6/4239 ,  G02B6/12019 ,  G02B6/2552 ,  G02B6/262 ,  G02B6/3644 ,  G02B6/4206 ,  G02B6/423 ,  G02B6/43 ,  H05K1/0274 ,  H05K1/181 ,  H05K2201/09072 ,  H05K2201/09827 ,  H05K2201/09845 ,  H05K2201/10174 ,  H05K2201/10674 ,  Y10T29/49124

Abstract: The present invention relates to the apparatus and method for optical interconnection. The present invention provides an optical interconnection structure comprising: a substrate on which double side perforated multi-hole through a predetermined region is formed; bottom hole which is etched and tapered for optical fiber array is bigger than upper hole which is etched for the optical devices. The present invention provides the optical interconnection structure that can facilitate the optical interconnection between the active optoelectronic devices that transmit/receive the optical signals and the optical fiber array, making it possible to align easily and acutely between the optical devices and optical fiber array.

Abstract translation: 本发明涉及光互连的装置和方法。 本发明提供一种光学互连结构，包括：基板，其上形成有穿过预定区域的双面穿孔多孔; 针对光纤阵列蚀刻和锥形的底孔大于蚀刻用于光学器件的上孔。 本发明提供了可以促进发送/接收光信号的有源光电子器件与光纤阵列之间的光学互连的光学互连结构，使得可以在光学器件和光纤阵列之间容易且锐利地对准。

公开(公告)号：US08351213B2

公开(公告)日：2013-01-08

申请号：US11749480

申请日：2007-05-16

Applicant: Brian Gorrell ,  Austin A. Saylor

Inventor： Brian Gorrell ,  Austin A. Saylor

IPC: H05K1/18

CPC classification number: H05K1/183 ,  H05K1/0306 ,  H05K1/092 ,  H05K2201/09036 ,  H05K2201/10174 ,  H05K2201/1053 ,  H05K2201/10651 ,  Y10T29/4913 ,  Y10T29/49165

Abstract: An electrical assembly including a substantially planar substrate having at least one recess therein and a plurality of electrical components. The electrical components are positioned in the at least one recess and include a first electrical component and a second electrical component. Each of the electrical components has a body and an electrical connection. The electrical connection of the first electrical component and the electrical connection of the second electrical component are aligned with each other when the body of the first electrical component is in a recess and the body of the second electrical component is in a recess.

Abstract translation: 一种电气组件，包括其中具有至少一个凹部的基本平坦的基板和多个电气部件。 电气部件定位在至少一个凹部中并且包括第一电气部件和第二电气部件。 每个电气部件都具有主体和电气连接。 当第一电气部件的主体处于凹部中并且第二电气部件的主体处于凹部中时，第一电气部件的电连接和第二电气部件的电连接彼此对准。

公开(公告)号：US20110141646A1

公开(公告)日：2011-06-16

申请号：US13035126

申请日：2011-02-25

Applicant: Jonathan L. Jones ,  Chris Penwell

Inventor： Jonathan L. Jones ,  Chris Penwell

IPC: H02H3/22

CPC classification number: H01P1/203 ,  H05K1/0237 ,  H05K1/0257 ,  H05K1/181 ,  H05K2201/1003 ,  H05K2201/10174

Abstract: A surge protection circuit may include a tuned circuit board with traces designed to provide a surge protected and RF isolated DC path while propagating RF signals through the PCB dielectric with microstrip lines. The surge protection circuit utilizes high impedance RF decoupling devices such as quarterwave traces or inductors which isolate the multistage DC protection scheme which may include a gas discharge tube, serial surge impeding devices such as inductors and/or resistors, a decoupled air/spark gap device and a Zener diode junction.

Abstract translation: 浪涌保护电路可以包括调谐电路板，其具有设计成在通过具有微带线的PCB电介质传播RF信号的同时提供浪涌保护和RF隔离DC路径的迹线。 浪涌保护电路使用诸如四分之一波导或电感器的高阻抗RF去耦装置，其隔离多级DC保护方案，其可以包括气体放电管，串联浪涌阻止装置，例如电感器和/或电阻器，去耦空气/火花隙装置 和齐纳二极管结。

公开(公告)号：US20100112826A1

公开(公告)日：2010-05-06

申请号：US12265311

申请日：2008-11-05

Applicant: Gary D. Frasco

Inventor： Gary D. Frasco

IPC: H01R12/00

CPC classification number: H01R12/52 ,  H05K1/023 ,  H05K1/0231 ,  H05K1/0233 ,  H05K1/0246 ,  H05K1/141 ,  H05K1/181 ,  H05K1/184 ,  H05K3/4046 ,  H05K2201/10022 ,  H05K2201/10037 ,  H05K2201/10174 ,  H05K2201/10181 ,  H05K2201/10265 ,  H05K2201/10378 ,  H05K2201/10734 ,  Y02P70/611

Abstract: An interconnect device is provided with a body through which a plurality of wells has been defined. At least one component having two terminals is provided in one or more of the wells. The component is sealed in its respective well such that the two terminals are accessible on opposite sides of the body. The body corresponds to a Ball Grid Array (BGA) device and is positioned between a BGA device and a printed circuit board (PCB). The component in the well is then inline with a solder ball on the BGA device and a corresponding pad on the PCB. Providing the component in the well frees up surface area on the PCB and also allows for positioning the component closer to a source of a signal. A component in the well is a discrete component having two terminals that may be solderable or made from a conductive pliable material. The terminals may be spring-mounted on the component.

Abstract translation: 互连装置设置有已经定义了多个井的主体。 在一个或多个井中提供具有两个端子的至少一个部件。 该部件密封在其各自的井中，使得两个端子可在主体的相对侧上接近。 主体对应于球栅阵列（BGA）器件，并位于BGA器件和印刷电路板（PCB）之间。 然后，井中的组件与BGA设备上的焊球和PCB上的相应焊盘成直线。 提供井中的组件释放PCB上的表面积，并且还允许将组件定位成更靠近信号源。 井中的部件是具有两个端子的分立部件，该端子可以是可焊接的或由导电柔性材料制成。 端子可以弹簧安装在部件上。

公开(公告)号：US07620151B2

公开(公告)日：2009-11-17

申请号：US11834952

申请日：2007-08-07

Applicant: Senthil Kumar Sundaram ,  Rohini Krishnamoorthy

Inventor： Senthil Kumar Sundaram ,  Rohini Krishnamoorthy

IPC: H05G1/12

CPC classification number: H05G1/04 ,  H05K1/0254 ,  H05K1/144 ,  H05K1/162 ,  H05K1/167 ,  H05K2201/09309 ,  H05K2201/09718 ,  H05K2201/10174

Abstract: In one embodiment, a voltage rectifier circuit for a radiation generator is provided. The voltage rectifier circuit is configured to be used in a voltage multiplier circuit and a voltage doubler circuit. The voltage rectifier circuit comprises at least one first printed circuit board and at least one second printed circuit board coupled to each other using a plurality of connectors. Further, each printed circuit board comprises, a first terminal, a second terminal, a third terminal, a diode assembly externally connected between the first terminal and the second terminal and a capacitor assembly embedded between the second terminal and the third terminal.

Abstract translation: 在一个实施例中，提供了一种用于辐射发生器的电压整流电路。 电压整流电路配置为用于倍压电路和倍压器电路。 电压整流电路包括使用多个连接器彼此耦合的至少一个第一印刷电路板和至少一个第二印刷电路板。 此外，每个印刷电路板包括第一端子，第二端子，第三端子，外部连接在第一端子和第二端子之间的二极管组件和嵌入在第二端子和第三端子之间的电容器组件。