Mask blank, transfer mask, and method of manufacturing semiconductor device

    公开(公告)号:US11314162B2

    公开(公告)日:2022-04-26

    申请号:US16492904

    申请日:2018-02-28

    Abstract: Provided is a mask blank in which a light shielding film which is a single layer film formed of a silicon nitride-based material has high light shielding performance against ArF exposure light and is capable of reducing EMF bias of a pattern of the light shielding film. The mask blank includes the light shielding film on a transparent substrate. The light shielding film has an optical density of 3.0 or greater to ArF exposure light. A refractive index n and an extinction coefficient k of the light shielding film to ArF exposure light simultaneously satisfy relationships defined by Formulas (1) and (2) below. n≤0.0733×k2+0.4069×k+1.0083  Formula (1) n≥29.316×k2−92.292×k+72.671  Formula (2)

    Substrate with a multilayer reflective film, reflective mask blank, reflective mask, and method of manufacturing semiconductor device

    公开(公告)号:US11281090B2

    公开(公告)日:2022-03-22

    申请号:US16754306

    申请日:2018-10-16

    Abstract: A substrate with a multilayer reflective film, a reflective mask blank, a reflective mask and a method of manufacturing a semiconductor device can prevent contamination of the surface of the multilayer reflective film even in the case of having formed reference marks on the multilayer reflective film. A substrate with a multilayer reflective film contains a substrate, a multilayer reflective film that reflects EUV light formed on the substrate, and a protective film formed on the multilayer reflective film. Reference marks are formed to a concave shape on the surface of the protective film. A surface layer of the reference marks contains an element that is the same as at least one of the elements contained in the protective film. A shrink region, where at least a portion of the plurality of films contained in the multilayer reflective film are shrunk, is formed at the bottom of the reference marks.

    Substrate with multilayer reflective film, reflective mask blank, reflective mask, and semiconductor device manufacturing method

    公开(公告)号:US11262647B2

    公开(公告)日:2022-03-01

    申请号:US16756727

    申请日:2018-10-16

    Abstract: A substrate with a multilayer reflective film, a reflective mask blank, a reflective mask and a method of manufacturing a semiconductor device that can prevent contamination of the surface of the multilayer reflective film even in the case of having formed reference marks on the multilayer reflective film. A substrate with a multilayer reflective film contains a substrate and a multilayer reflective film that reflects EUV light formed on the substrate. Reference marks are formed to a concave shape on the surface of the substrate with the multilayer reflective film. The reference marks have grooves or protrusions roughly in the center. The shape of the grooves or protrusions when viewed from overhead is similar or roughly similar to the shape of the reference marks.

    Spacer and hard disk drive apparatus

    公开(公告)号:US11238895B2

    公开(公告)日:2022-02-01

    申请号:US17111068

    申请日:2020-12-03

    Inventor: Masao Takano

    Abstract: A ring-shaped spacer is to be arranged in contact with a magnetic disk in a hard disk drive apparatus. A maximum height surface roughness Rz of an outer circumferential edge surface of the spacer is at least 1.5 μm, and the spacer is made of amorphous glass.

    ENDOSCOPE CONTROL DEVICE AND ENDOSCOPE COMPRISING AN ENDOSCOPE CONTROL DEVICE

    公开(公告)号:US20220022732A1

    公开(公告)日:2022-01-27

    申请号:US17284223

    申请日:2019-10-25

    Inventor: Anh Minh DO

    Abstract: The invention relates to an endoscope control device including a control body holder, a joystick-like control element for effecting a deflection movement, and at least one control wire guided through the control body holder and transmitting the deflection movement of the control element to an element to be controlled in the endoscope. The control element extends from the control body holder in a proximal direction. The at least one control wire is fixed to the control element in a manner spaced from the control body holder. The control element includes an elastic rod element which is bendable upon actuation of the control element so as to effect a deflection movement.

    Mask blank, method for manufacturing transfer mask, and method for manufacturing semiconductor device

    公开(公告)号:US11231645B2

    公开(公告)日:2022-01-25

    申请号:US16282699

    申请日:2019-02-22

    Abstract: A mask blank, which is capable of being formed with high transfer accuracy when a hard mask film pattern is used as a mask, and even when the mask blank includes a chromium-based light shielding film. A light-semitransmissive film, a light shielding film, and a hard mask film are laminated in the stated order on a transparent substrate. The light-semitransmissive film contains silicon, and the hard mask film contains any one or both of silicon and tantalum. The light shielding film has a laminate structure of a lower layer and an upper layer, and contains chromium. The upper layer has a content of chromium of 65 at % or more, and a content of oxygen of less than 20 at %, and the lower layer has a content of chromium of less than 60 at %, and a content of oxygen of 20 at % or more.

    SUBSTRATE FOR MAGNETIC DISK, MAGNETIC DISK, AND HARD DISK DRIVE APPARATUS

    公开(公告)号:US20210407544A1

    公开(公告)日:2021-12-30

    申请号:US17472567

    申请日:2021-09-10

    Inventor: Kinobu OSAKABE

    Abstract: A substrate for a magnetic disk includes a substrate main body having two main surfaces and an outer circumferential edge surface that has a side wall surface and chamfered surfaces, and a film that is an alloy film containing Ni and P and provided on a surface of the substrate main body. A disk shape of the substrate main body has an outer diameter of 90 mm or more. A thickness T of the substrate that includes the film provided on the main surfaces is 0.520 mm or less. A total thickness D mm of the film on the main surfaces and the thickness T mm satisfy D≥0.0082/T−0.0015. A film thickness of the film on the outer circumferential edge surface is larger than a film thickness of the film on the main surfaces, and is 150% or less of the film thickness of the film on the main surfaces.

    Reflective mask blank, method of manufacturing reflective mask and method of manufacturing semiconductor device

    公开(公告)号:US11187972B2

    公开(公告)日:2021-11-30

    申请号:US16343505

    申请日:2017-10-18

    Abstract: The present invention provides a reflective mask blank and reflective mask capable of reducing the shadowing effect of EUV lithography and forming a fine pattern. As a result, a semiconductor device can be more stably manufactured with high transfer accuracy. The reflective mask blank comprises a multilayer reflective film, an absorber film and an etching mask film on a substrate in that order, wherein the absorber film is made of a material containing nickel (Ni), and the etching mask film is made of a material containing chromium (Cr) or a material containing silicon (Si).

    MASK BLANK, PHASE SHIFT MASK, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

    公开(公告)号:US20210364909A1

    公开(公告)日:2021-11-25

    申请号:US16755117

    申请日:2018-11-20

    Abstract: Provided is a mask blank including a phase shift film. The phase shift film is made of a material containing a non-metallic element and silicon and includes first, second, and third layers; refractive indexes n1, n2, and n3 of the first, second, and third layers, respectively, at the wavelength of an exposure light satisfy the relations of n1 n3; and extinction coefficients k1, k2, and k3 of the first, second, and third layers, respectively, at the wavelength of an exposure light satisfy the relation of k1>k2>k3.

    Mask blank, method for manufacturing transfer mask, and method for manufacturing semiconductor device

    公开(公告)号:US11119400B2

    公开(公告)日:2021-09-14

    申请号:US16603127

    申请日:2018-04-02

    Abstract: In the present disclosure, an etching stopper film, a light shielding film comprising a material containing one or more elements selected from silicon and tantalum, and a hard mask film are laminated in that order on a transparent substrate. The etching stopper film is made of a material containing chromium, oxygen and carbon, the chromium content is 50 atomic % or more, the maximum peak in N1s narrow spectrum obtained by means of analysis using X-Ray photoelectron spectroscopy is below the detection limit, and Cr2p narrow spectrum obtained by means of analysis using X-Ray photoelectron spectroscopy has a maximum peak at a binding energy of 574 eV or less.

Patent Agency Ranking