公开(公告)号：US20030174877A1

公开(公告)日：2003-09-18

申请号：US10331556

申请日：2002-12-31

Applicant: ORBOTECH LTD

Inventor： Dror Aiger

IPC: G06K009/00

CPC classification number: G06T7/0004 ,  G01N21/95684 ,  G01N2021/8867 ,  G01R31/2801 ,  G06T2207/30141

Abstract: A method for the inspection of electrical circuit patterns including carrying out an initial inspection of a sequentially acquired image of an electrical circuit pattern to determine potential defects in the electrical circuit pattern; upon identifying a potential defect in the electrical circuit pattern in the course of the initial inspection, interrupting the initial inspection and carrying out a secondary evaluation of a portion of the sequentially acquired image including the potential defect; and following completion of the secondary inspection, resuming the initial inspection.

Abstract translation: 一种用于检查电路图案的方法，包括对电路图案的顺序获取的图像进行初始检查，以确定电路图案中的潜在缺陷; 在初次检查过程中识别电路图案中的潜在缺陷时，中断初始检查并对包括潜在缺陷的顺序获取的图像的一部分进行二次评估; 二次检查完成后，恢复初次检查。

公开(公告)号：US20030020905A1

公开(公告)日：2003-01-30

申请号：US10032098

申请日：2001-12-31

Applicant: Orbotech Ltd.

Inventor： Nissim Savareigo ,  Igor Markov ,  Dan Zemer

IPC: G01N021/00

CPC classification number: G01N21/95684

Abstract: A first inspection functionality is provided to obtain information about a first attribute at a conductor location on an electrical circuit. A second inspection functionality is provided to obtain information about a second attribute at the conductor location. A combination of first attribute information and second attribute information is analyzed to determine an inspection attribute of the conductor at the conductor location. Attribute information may relate to one or more of: reflectance, fluorescence or height.

Abstract translation: 提供第一检查功能以获得关于电路上的导体位置处的第一属性的信息。 提供第二检查功能以获得关于导体位置处的第二属性的信息。 分析第一属性信息和第二属性信息的组合以确定导体位置处的导体的检查属性。 属性信息可以涉及以下中的一个或多个：反射率，荧光或高度。

公开(公告)号：US20020154810A1

公开(公告)日：2002-10-24

申请号：US09782626

申请日：2001-02-13

Applicant: ORBOTECH LTD.

Inventor： Saki Itzhak Hakim ,  Zeev Smilansky

IPC: G06K009/00

CPC classification number: G06T7/001 ,  G06T5/50 ,  G06T2207/30141

Abstract: A system and method of inspecting electrical circuits with multiple optical inputs, including: obtaining first and second image data that are generally spatially coincidental but which each include some image data that is different, modifying one of the images by employing the other image so as to produce an enhanced representation of the electrical circuit, and inspecting the enhanced representation for defects.

Abstract translation: 一种检测具有多个光输入的电路的系统和方法，包括：获得通常为空间上一致的第一和第二图像数据，其中每个图像数据包括一些不同的图像数据，通过使用另一图像修改图像之一，以便 产生电路的增强表示，并检查增强的缺陷表示。

公开(公告)号：US20020096555A1

公开(公告)日：2002-07-25

申请号：US09767645

申请日：2001-01-23

Applicant: ORBOTECH LTD.

Inventor： Scott Steven Waxler ,  Dan Zemer

IPC: B23K031/02 ,  B23K001/08

CPC classification number: B23K1/0056 ,  B23K2101/40 ,  H01L24/11 ,  H01L2224/13099 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/00

Abstract: A system and method for forming bumps on an integrated circuit including a scanning direct laser imager employed to selectably expose a photosensitive layer deposited on an integrated circuit substrate, thereby to define regions overlying selected portions of the substrate, a developer developing said photosensitive layer to form apertures in the photosensitive layer at the defined regions, and a solder applicator applying a solder composition to the apertures to define solder bumps on the integrated circuit at selected portions thereof.

Abstract translation: 一种用于在包括扫描直接激光成像器的集成电路上形成凸块的系统和方法，所述扫描直接激光成像器用于可选择地曝光沉积在集成电路基板上的感光层，从而限定覆盖所述基板的选定部分的区域;显影所述感光层以形成 在限定区域的感光层中的孔，以及焊料施加器，将焊料组合物施加到孔，以在集成电路的选定部分处限定焊料凸块。

公开(公告)号：US20020039182A1

公开(公告)日：2002-04-04

申请号：US09939682

申请日：2001-08-28

Applicant: ORBOTECH, LTD.

Inventor： Nissim Savareigo ,  Igor Markov

IPC: G01N021/00

CPC classification number: G01N21/95684

Abstract: Surface dimension and footprint dimension values are determined by scanning a printed circuit board with a laser. Exposed substrate parts of the printed circuit board fluoresce significantly, emitting detectable luminance, while conductors do not. Conductors reflect the laser light much more strongly than the exposed substrate, especially at the substantially flat part of the top surface. Luminescence and reflectivity collectors provide signals indicative of the footprint and surface dimensions. This cross-sectional information is used in making adjustment determinations in the manufacturing process, and also decisions relating to repair or discard operations.

Abstract translation: 通过用激光扫描印刷电路板来确定表面尺寸和尺寸尺寸值。 印刷电路板的暴露的基板部分显着发出荧光，发射可检测的亮度，而导体不发光。 导体比暴露的基板更强烈地反射激光，特别是在顶表面的基本上平坦的部分。 发光和反射率收集器提供指示占地面积和表面尺寸的信号。 该横截面信息用于在制造过程中进行调整确定，以及关于修理或丢弃操作的决定。

公开(公告)号：US20020013667A1

公开(公告)日：2002-01-31

申请号：US09906798

申请日：2001-07-18

Applicant: Orbotech, Ltd.

Inventor： Dan Zemer ,  Eyal Harel

IPC: G01R015/00

CPC classification number: G01R31/2887 ,  G01R1/06705

Abstract: Apparatus for electrical testing of electrical circuits includes an array of probes arranged for selective engagement with portions of electrical circuits to be tested, testing circuitry associated with the array of probes for sensing electrical characteristics of the electrical circuits engaged by the array of probes, and control circuitry associated with the array of probes for causing engagement between selected ones of the array of probes with selected ones of the portions of electrical circuits to be tested. The array of probes includes at least two static probe assemblies arranged in a fixed array, and the static probe assemblies include a selectively positionable probe element and a probe element positioner. The apparatus is employed to test electrical circuits during fabrication.

Abstract translation: 用于电气电气测试的装置包括一组探针，其布置用于与要测试的电路的部分选择性接合，与用于感测由探针阵列接合的电路的电特性的探头阵列相关联的测试电路，以及控制 与探针阵列相关联的电路，用于引起探针阵列中选定的探针阵列与要测试的电路部分中的选定部分之间的接合。 探针阵列包括以固定阵列布置的至少两个静态探针组件，并且静态探针组件包括可选择性定位的探针元件和探针元件定位器。 该装置用于在制造期间测试电路。

公开(公告)号：US20010035267A1

公开(公告)日：2001-11-01

申请号：US09824500

申请日：2001-04-02

Applicant: ORBOTECH LTD.

Inventor： Nissim Savareigo

IPC: G01L021/30

CPC classification number: G01N21/95684

Abstract: Apparatus and method for post etching inspection of electrical circuits including an optical inspection assembly viewing an electrical circuit at various regions thereon and providing output indications of etching characteristics of the electrical circuit at the various regions and output circuitry receiving the output indications of etching characteristics of the electrical circuit at the various regions and providing an output indication of variations in the etching characteristics between at least some of the various regions.

Abstract translation: 电路的后蚀刻检查装置和方法，包括在其各个区域上观察电路的光学检查组件，并且提供在各个区域处的电路的蚀刻特性的输出指示，以及输出电路，其接收所述电路的蚀刻特性的输出指示 电路，并且提供在各个区域中的至少一些之间的蚀刻特性的变化的输出指示。

公开(公告)号：US20250105065A1

公开(公告)日：2025-03-27

申请号：US18472555

申请日：2023-09-22

Applicant: Orbotech Ltd.

Inventor： Arie Glazer

IPC: H01L21/66 ,  G06T7/00 ,  H01L21/67 ,  H01L25/075 ,  H01L33/00

Abstract: The system includes a glass panel, a radio frequency generator, a camera, and a processor. The glass panel includes a conductive layer, and the conductive layer is disposed on top of an LED. The radio frequency generator is configured to apply a radio frequency signal to the glass panel, and the radio frequency signal illuminates the LED by induction through the conductive layer. The camera is configured to capture an image of the LED illuminated by the radio frequency signal. The processor is in electronic communication with the camera and is configured to receive the image from the camera and determine whether the LED is a defective LED or a functioning LED based on the image of the LED.

公开(公告)号：US12259606B2

公开(公告)日：2025-03-25

申请号：US18244087

申请日：2023-09-08

Applicant: Orbotech Ltd.

Inventor： Jason S. Reid ,  Karla Gutierrez Cuevas

IPC: G02F1/03 ,  G01N21/17 ,  G02B5/08 ,  G02F1/1337

Abstract: An electro-optic modulator is a liquid-crystal-based electro-optical light modulator. The liquid-crystal-based electro-optical light modulator is fabricated using surface Micro-electromechanical Systems (MEMS) techniques. The electro-optical light modulator is used for inspecting flat panel displays or the like. Utilizing surface MEMS techniques for fabrication considerably thins the electro-optic modulator and allows the use of pure liquid crystal without the need for thick containment plates.

公开(公告)号：US12204228B2

公开(公告)日：2025-01-21

申请号：US17423471

申请日：2020-02-27

Applicant: Orbotech Ltd.

Inventor： Zvi Kotler ,  Yuval Berg

IPC: G02F1/33 ,  B23K26/06 ,  B23K26/064 ,  B23K26/073 ,  G02B27/09

Abstract: Optical apparatus (20) includes a laser (22), which is configured to emit a beam of coherent optical radiation at a specified wavelength along a beam axis. A deflector (24) is configured to intercept and selectably deflect the beam over a range of angles relative to the beam axis. A plurality of diffractive optical elements (DOEs—32, 34, 36, 64, 66, 68) are positioned to receive the deflected beam at different, respective deflection angles within the range and to output respective diffracted beams. Beam-combining optics (42, 74) are configured to receive and deflect the diffracted beams from the DOEs so that all of the diffracted beams are directed along a common output axis toward a target (48).