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    Microreactor Glass Diaphragm Sensors
    82.
    发明申请
    Microreactor Glass Diaphragm Sensors 审中-公开
    微反应器玻璃隔膜传感器

    公开(公告)号：US20090064790A1

    公开(公告)日：2009-03-12

    申请号：US12087394

    申请日：2006-12-22

    Applicant: Jerome Vivien Davidovits ,  James Scott Sutherland

    Inventor： Jerome Vivien Davidovits ,  James Scott Sutherland

    IPC: G01L9/12 ,  G01L9/04 ,  H01L21/00

    CPC classification number: B01J19/0093 ,  B01J2219/00783 ,  B01J2219/00824 ,  B01J2219/00831 ,  B01J2219/00853 ,  B01J2219/0086 ,  B01J2219/00907 ,  B01J2219/00963 ,  B01J2219/0097 ,  B81B7/02 ,  B81B2201/0264 ,  B81B2201/051 ,  B81B2203/0127 ,  B81C2201/019 ,  C03C17/04 ,  C03C2218/328 ,  C03C2218/33

    Abstract: Microfluidic devices having wall structures comprised of sintered glass frit and further including a glass, glass-ceramic or ceramic membrane structure sealed by a sintered seal to said wall structures, such that a fluid passage or chamber is defined at least in part by the wall structures and said membrane structure. This allows for changes in pressure within the fluid passage or chamber to cause deflections of the membrane structure, providing for direct measurement of pressure within the device. The microfluidic device may have both floors and walls of sintered frit, or may have only walls of sintered frit, with planar floor-like substrate structures, thicker than the membrane structure defining the vertical boundaries of the internal passages. The device may include multiple fluid passages or chambers each defined at least in part by a membrane structure. Multiple membrane structures may be used in a single device, and one single membrane structure may be used for multiple passages or chamber.

    Abstract translation: 具有由烧结玻璃料组成的壁结构并且还包括通过烧结密封件密封到所述壁结构的玻璃，玻璃陶瓷或陶瓷膜结构的微流体装置，使得流体通道或室至少部分地由壁结构限定 和膜结构。 这允许流体通道或腔室内的压力变化导致膜结构的偏转，从而直接测量装置内的压力。 微流体装置可以具有烧结玻璃料的两个底板和壁，或者可以仅具有烧结玻璃料的壁，其具有平面地板状衬底结构，比限定内部通道的垂直边界的膜结构更厚。 该装置可以包括多个流体通道或室，每个液体通道至少部分地由膜结构限定。 多个膜结构可以用于单个装置中，并且一个单一的膜结构可用于多个通道或室。

    Fracture-resistant micromachined devices
    85.
    发明授权
    Fracture-resistant micromachined devices 失效
    耐断裂微加工设备

    公开(公告)号：US06171972B2

    公开(公告)日：2001-01-09

    申请号：US09191966

    申请日：1998-11-13

    Applicant: Mehran Mehregany ,  Christopher A. Bang ,  Kevin C. Stark

    Inventor： Mehran Mehregany ,  Christopher A. Bang ,  Kevin C. Stark

    IPC: H01L2100

    CPC classification number: B05B1/3436 ,  B81B2201/051 ,  B81C1/00531

    Abstract: A method for forming micromachined devices out of a polycrystalline silicon substrate using deep reactive ion etching to form the micromachined device. The method comprises the steps of providing a bulk material substrate of polycrystalline silicon, and etching the bulk material using deep reactive ion etching to form the micromachined device. The present invention also includes a method for forming a micromachined device comprising the steps of providing a first layer of single crystal silicon and etching a first set of elements on the first layer. The method further includes the steps of providing a second layer of single crystal silicon, etching a second set of elements on the second layer, and joining the first and second layers together such that the crystal planes of the first layer and the second layer are misaligned and such that the first set and the second set of elements are properly aligned.

    Abstract translation: 使用深反应离子蚀刻从多晶硅衬底形成微加工器件以形成微机械加工器件的方法。 该方法包括以下步骤：提供多晶硅的散装材料基板，并使用深反应离子蚀刻来蚀刻散装材料以形成微机械加工装置。 本发明还包括一种用于形成微加工装置的方法，包括以下步骤：提供第一层单晶硅并蚀刻第一层上的第一组元件。 该方法还包括以下步骤：提供第二层单晶硅，蚀刻第二层上的第二组元件，以及将第一和第二层接合在一起，使得第一层和第二层的晶面失配 并且使得第一组和第二组元件被适当对准。

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