中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

124 records (took 0.024 seconds)

    Electrochemically Fabricated Structures Having Dielectric or Active Bases and Methods of and Apparatus for Producing Such Structures
    81.
    发明申请
    Electrochemically Fabricated Structures Having Dielectric or Active Bases and Methods of and Apparatus for Producing Such Structures 审中-公开
    具有电介质或活性碱的电化学结构和用于生产这种结构的方法和装置

    公开(公告)号：US20110180410A1

    公开(公告)日：2011-07-28

    申请号：US13010324

    申请日：2011-01-20

    Applicant: Jeffrey A. Thompson ,  Adam L. Cohen ,  Michael S. Lockard ,  Dennis R. Smalley

    Inventor： Jeffrey A. Thompson ,  Adam L. Cohen ,  Michael S. Lockard ,  Dennis R. Smalley

    IPC: C25D1/00

    CPC classification number: C25D1/003 ,  B81C1/00373 ,  B81C2201/0181 ,  B81C2201/019

    Abstract: Multilayer structures are electrochemically fabricated on a temporary (e.g. conductive) substrate and are thereafter bonded to a permanent (e.g. dielectric, patterned, multi-material, or otherwise functional) substrate and removed from the temporary substrate. In some embodiments, the structures are formed from top layer to bottom layer, such that the bottom layer of the structure becomes adhered to the permanent substrate, while in other embodiments the structures are formed from bottom layer to top layer and then a double substrate swap occurs. The permanent substrate may be a solid that is bonded (e.g. by an adhesive) to the layered structure or it may start out as a flowable material that is solidified adjacent to or partially surrounding a portion of the structure with bonding occurring during solidification. The multilayer structure may be released from a sacrificial material prior to attaching the permanent substrate or it may be released after attachment.

    Abstract translation: 多层结构在临时的（例如导电的）衬底上电化学地制造，然后在永久（例如电介质，图案化，多材料或其他功能）的衬底上结合并从临时衬底去除。 在一些实施例中，结构由顶层到底层形成，使得结构的底层变得粘附到永久性基底上，而在其它实施例中，结构由底层到顶层形成，然后是双层衬底交换 发生。 永久性基材可以是与层状结构结合的固体（例如通过粘合剂），或者可以作为在凝固期间发生结合而邻近或部分地围绕结构的一部分固化的可流动材料开始。 多层结构可以在附着永久性基底之前从牺牲材料上释放，或者在附着后可以释放多层结构。

    Selective UV-Ozone Dry Etching of Anti-Stiction Coatings for MEMS Device Fabrication
    82.
    发明申请
    Selective UV-Ozone Dry Etching of Anti-Stiction Coatings for MEMS Device Fabrication 有权
    用于MEMS器件制造的抗静电涂层的选择性UV-臭氧干蚀刻

    公开(公告)号：US20100314724A1

    公开(公告)日：2010-12-16

    申请号：US12796162

    申请日：2010-06-08

    Applicant: Mehmet Hancer

    Inventor： Mehmet Hancer

    IPC: H01L21/302 ,  H01L23/28

    CPC classification number: B81C1/00269 ,  B81C2201/0181 ,  B81C2201/112 ,  B81C2203/0118

    Abstract: Organic anti-stiction coatings such as, for example, hydrocarbon and fluorocarbon based self-assembled organosilanes and siloxanes applied either in solvent or via chemical vapor deposition, are selectively etched using a UV-Ozone (UVO) dry etching technique in which the portions of the organic anti-stiction coating to be etched are exposed simultaneously to multiple wavelengths of ultraviolet light that excite and dissociate organic molecules from the anti-stiction coating and generate atomic oxygen from molecular oxygen and ozone so that the organic molecules react with atomic oxygen to form volatile products that are dissipated, resulting in removal of the exposed portions of the anti-stiction coating. A hybrid etching process using heat followed by UVO exposure may be used. A shadow mask (e.g., of glass or quartz), a protective material layer, or other mechanism may be used to selective expose the portions of the anti-stiction coating to be UVO etched. Such selective UVO etching may be used, for example, to expose wafer bond lines prior to wafer-to-wafer bonding in order to increase bond shear and adhesion strength, to expose bond pads in preparation for electrical or other connections, or for general removal of anti-stiction coating materials from metal or other material surfaces. One specific embodiment uses two wavelengths of ultraviolet light, one at around 184.9 nm and the other at around 253.7 nm.

    Abstract translation: 使用UV-臭氧（UVO）干蚀刻技术选择性地蚀刻有机抗静电涂层，例如在溶剂中或通过化学气相沉积施加的烃和氟碳基自组装有机硅烷和硅氧烷，其中部分 待蚀刻的有机抗静电涂层同时暴露于多个波长的紫外线，其激发和解离有机分子与抗静电涂层，并从分子氧和臭氧产生原子氧，使得有机分子与原子氧反应形成 挥发的产物被消散，导致去除抗静电涂层的暴露部分。 可以使用使用热量然后UVO曝光的混合蚀刻工艺。 可以使用荫罩（例如，玻璃或石英），保护材料层或其它机构来选择性地将抗静电涂层的部分暴露于UVO蚀刻。 可以使用这种选择性UVO蚀刻，例如在晶片到晶片接合之前暴露晶片接合线，以增加键合剪切和粘附强度，以暴露接合焊盘以准备电气或其它连接，或用于一般去除 的抗静电涂层材料从金属或其他材料表面。 一个具体实施方案使用两个波长的紫外光，一个在约184.9nm，另一个在约253.7nm。

    Method For Electrochemical Fabrication
    83.
    发明申请
    Method For Electrochemical Fabrication 有权
    电化学制造方法

    公开(公告)号：US20100193366A1

    公开(公告)日：2010-08-05

    申请号：US12698026

    申请日：2010-02-01

    Applicant: Adam L. Cohen

    Inventor： Adam L. Cohen

    IPC: C25D5/02 ,  C25D5/48

    CPC classification number: C25D5/10 ,  B33Y10/00 ,  B33Y70/00 ,  B81C1/00126 ,  B81C2201/0181 ,  B81C2201/0197 ,  B81C2201/032 ,  C25D1/00 ,  C25D1/003 ,  C25D5/022 ,  C25D5/12 ,  C25D5/22 ,  C25D17/06 ,  H01L21/2885 ,  H05K3/241 ,  Y10T428/12486 ,  Y10T428/239

    Abstract: An electroplating method that includes: a) contacting a first substrate with a first article, which includes a substrate and a conformable mask disposed in a pattern on the substrate; b) electroplating a first metal from a source of metal ions onto the first substrate in a first pattern, the first pattern corresponding to the complement of the conformable mask pattern; and c) removing the first article from the first substrate, is disclosed. Electroplating articles and electroplating apparatus are also disclosed.

    Abstract translation: 一种电镀方法，包括：a）使第一衬底与第一制品接触，所述第一制品包括衬底和以衬底形式设置的贴合掩模; b）以第一图案将来自金属离子源的第一金属电镀到所述第一基板上，所述第一图案对应于所述适形掩模图案的所述补体; 和c）从第一基板上去除第一制品。 还公开了电镀制品和电镀装置。

    Electrochemically fabricated structures having dielectric or active bases and methods of and apparatus for producing such structures
    84.
    发明授权
    Electrochemically fabricated structures having dielectric or active bases and methods of and apparatus for producing such structures 有权
    具有电介质或活性碱的电化学制造结构以及用于制造这种结构的方法和装置

    公开(公告)号：US07250101B2

    公开(公告)日：2007-07-31

    申请号：US10434493

    申请日：2003-05-07

    Applicant: Jeffrey A. Thompson ,  Adam L. Cohen ,  Michael S. Lockard ,  Dennis R. Smalley

    Inventor： Jeffrey A. Thompson ,  Adam L. Cohen ,  Michael S. Lockard ,  Dennis R. Smalley

    IPC: C25D1/00 ,  C25D5/02 ,  C25D5/48 ,  C25D5/52

    CPC classification number: B81C1/00126 ,  B33Y10/00 ,  B33Y70/00 ,  B81C2201/0181 ,  B81C2201/0188 ,  B81C2201/019

    Abstract: Multilayer structures are electrochemically fabricated on a temporary (e.g. conductive) substrate and are thereafter bonded to a permanent (e.g. dielectric, patterned, multi-material, or otherwise functional) substrate and removed from the temporary substrate. In some embodiments, the structures are formed from top layer to bottom layer, such that the bottom layer of the structure becomes adhered to the permanent substrate, while in other embodiments the structures are form from bottom layer to top layer and then a double substrate swap occurs. The permanent substrate may be a solid that is bonded (e.g. by an adhesive) to the layered structure or it may start out as a flowable material that is solidified adjacent to or partially surrounding a portion of the structure with bonding occurs during solidification. The multilayer structure may be released from a sacrificial material prior to attaching the permanent substrate or it may be released after attachment.

    Abstract translation: 多层结构在临时的（例如导电的）衬底上电化学地制造，然后在永久（例如电介质，图案化，多材料或其他功能）的衬底上结合并从临时衬底去除。 在一些实施例中，结构由顶层到底层形成，使得结构的底层变得粘附到永久性基底上，而在其它实施例中，结构是从底层到顶层形成的，然后是双层衬底交换 发生。 永久性基材可以是与层状结构结合的固体（例如通过粘合剂），或者可以作为在凝固期间发生结合而在结构的一部分附近凝固的可流动材料开始。 多层结构可以在附着永久性基底之前从牺牲材料上释放，或者在附着后可以释放多层结构。

    Low compressive TiNx, materials and methods of making the same
    85.
    发明申请
    Low compressive TiNx, materials and methods of making the same 审中-公开
    低压TiNx，材料和制作方法相同

    公开(公告)号：US20070015304A1

    公开(公告)日：2007-01-18

    申请号：US11183056

    申请日：2005-07-15

    Applicant: Jonathan Doan

    Inventor： Jonathan Doan

    IPC: H01L21/00

    CPC classification number: B81C1/00365 ,  B81C2201/0181

    Abstract: Disclosed herein is a microelectromechanical device having a structural layer composed of a low stress TiNx layer and a method of making the same.

    Abstract translation: 本文公开了具有由低应力TiN层组成的结构层的微机电装置及其制造方法。

    Apparatus for electrochemical fabrication using a conformable mask
    87.
    发明授权
    Apparatus for electrochemical fabrication using a conformable mask 有权
    用于使用适形掩模进行电化学制造的装置

    公开(公告)号：US06572742B1

    公开(公告)日：2003-06-03

    申请号：US09488142

    申请日：2000-01-20

    Applicant: Adam L. Cohen

    Inventor： Adam L. Cohen

    IPC: C25D1706

    CPC classification number: C25D5/10 ,  B33Y10/00 ,  B33Y70/00 ,  B81C1/00126 ,  B81C2201/0181 ,  B81C2201/0197 ,  B81C2201/032 ,  C25D1/00 ,  C25D1/003 ,  C25D5/022 ,  C25D5/12 ,  C25D5/22 ,  C25D17/06 ,  H01L21/2885 ,  H05K3/241 ,  Y10T428/12486 ,  Y10T428/239

    Abstract: An electroplating method includes forming a layer, the forming of the layer includes: a) contacting a substrate with a first article, the first article includes a support and a conformable mask disposed in a pattern on the support; b) electroplating a first metal from a source of metal ions onto the substrate in a first pattern, the first pattern corresponding to the complement of the conformable mask pattern; and c) removing the first article from the substrate. The method may further involve one or more of (1) selectively depositing or non-selectively depositing one or more additional materials to complete formation of the layer, (2) planarizing deposited material after each deposition or after all depositions for a layer, and/or (3) forming layers adjacent previously formed layers to build up a structure from a plurality of adhered layers. Electroplating articles and electroplating apparatus are also disclosed.

    Abstract translation: 一种电镀方法包括形成层，所述层的形成包括：a）使基底与第一制品接触，所述第一制品包括以支持物的形式设置的支撑体和适形掩模; b）以第一图案将来自金属离子源的第一金属电镀到所述衬底上，所述第一图案对应于所述适形掩模图案的所述补体; 以及c）从所述基底中去除所述第一制品。 该方法还可以包括以下一个或多个：（1）选择性地沉积或非选择性地沉积一种或多种附加材料以完成层的形成，（2）在每次沉积之后或在所有沉积之后平坦化沉积的材料，以及/ 或（3）形成与先前形成的层相邻的层，以从多个附着层建立结构。 还公开了电镀制品和电镀装置。

    Diluent assisted lubrication of micromechanical devices
    88.
    发明授权
    Diluent assisted lubrication of micromechanical devices 有权
    稀释剂辅助微机械装置的润滑

    公开(公告)号：US06475570B2

    公开(公告)日：2002-11-05

    申请号：US10036611

    申请日：2001-12-31

    Applicant: Simon Joshua Jacobs

    Inventor： Simon Joshua Jacobs

    IPC: B05D102

    CPC classification number: B81C1/0096 ,  B05D1/60 ,  B05D5/083 ,  B81B3/0005 ,  B81C2201/0181 ,  B81C2201/112

    Abstract: A method and apparatus for delivering a fine mist of a lubricant to a micromechanical device. A mixture 402 of a lubricant and a diluent carrier fluid is held in a supply reservoir 404. The mixture is forced through a nebulizer tip 406 to produce a fine aerosol. A particle selector 408 removes large droplets from the aerosol as the aerosol passes. The aerosol travels a distance through a delivery conduit 410 while the diluent carrier fluid evaporates from the nebulized droplets. The evaporation removes the vast majority of the diluent carrier fluid from the droplets, greatly reducing the size of the lubricant droplets. The evaporated aerosol enters a deposition chamber 412 and is deposited on a micromechanical device 414. The micromechanical devices may be lubricated in wafer form, in which case the lubricant aerosol will lubricate an entire wafer of micromechanical devices at one time. One embodiment produces an aerosol having a mean droplet size of less than 10 microns. Evaporation of the diluent carrier fluid reduces this droplet size to 10-500 nm by the time the lubricant is deposited on the micromechanical devices. The preceding abstract is submitted with the understanding that it only will be used to assist in determining, from a cursory inspection, the nature and gist of the technical disclosure as described in 37 C.F.R. §1.72(b). In no case should this abstract be used for interpreting the scope of any patent claims.

    Abstract translation: 一种用于将微细油雾润滑剂输送到微机械装置的方法和装置。 润滑剂和稀释剂载体流体的混合物402被保持在供应容器404中。混合物被迫通过雾化器尖端406以产生细小的气溶胶。 颗粒选择器408随着气溶胶通过而从气溶胶中去除大​​的液滴。 气雾剂通过输送管道410行进一段距离，同时稀释剂载体流体从喷雾的液滴中蒸发。 蒸发从液滴中除去大部分稀释剂载体流体，大大减小了润滑剂液滴的尺寸。 蒸发的气溶胶进入沉积室412并沉积在微机械装置414上。微机械装置可以以晶片形式润滑，在这种情况下，润滑剂气溶胶将一次润滑整个微机械装置的晶片。 一个实施例产生具有小于10微米的平均液滴尺寸的气溶胶。 润滑剂沉积在微机械装置上时，稀释剂载体流体的蒸发将该液滴尺寸减小到10-500nm。 提交上述摘要的理解是，它只会用于协助从粗略检查中确定37 C.F.R.描述的技术披露的性质和要点。 §1.72（b）。 在任何情况下，本摘要不得用于解释任何专利权利要求的范围。

Patent Agency Ranking