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    Electromagnetic wave detection apparatus and information acquisition system
    84.
    发明授权
    Electromagnetic wave detection apparatus and information acquisition system 有权

    公开(公告)号：US11874162B2

    公开(公告)日：2024-01-16

    申请号：US17052686

    申请日：2019-05-08

    Applicant: KYOCERA Corporation

    Inventor： Eri Takeuchi

    IPC: G01J1/04 ,  G01J5/48 ,  G02B26/10

    CPC classification number: G01J1/0477 ,  G01J1/0403 ,  G01J1/044 ,  G01J1/0414 ,  G01J5/48 ,  G02B26/108

    Abstract: An electromagnetic wave detection apparatus 10 includes a first propagation unit 16, a second propagation unit 17, a first detector 19, and a second detector 20. The first propagation unit 16 propagates electromagnetic waves incident on a reference surface ss in a particular direction using each pixel px. The second propagation unit 17 includes a first surface s1, a second surface s2, a third surface s3, a fourth surface s4, a fifth surface s5, and a sixth surface s6. The first surface s1 propagates electromagnetic waves incident from a first direction in a second direction and propagates electromagnetic propagated in a third direction in a fourth direction. The second surface s2 separates electromagnetic waves propagated in the second direction d2 and propagate electromagnetic waves in a third direction d3 and a fifth direction d5. The first detector 19 detects electromagnetic waves emitted from the third surface s3. The second detector 20 detects electromagnetic waves emitted from the sixth surface s6.

    OPTICAL SENSING MODULE AND ELECTRONIC APPARATUS
    86.
    发明申请
    OPTICAL SENSING MODULE AND ELECTRONIC APPARATUS 审中-公开

    公开(公告)号：US20190078931A1

    公开(公告)日：2019-03-14

    申请号：US16186647

    申请日：2018-11-12

    Applicant: PixArt Imaging Inc.

    Inventor： HUI-HSUAN CHEN ,  JIA-HONG HUANG ,  TIEN-CHIA LIU

    IPC: G01J1/04 ,  G01J1/02 ,  G01J1/42

    CPC classification number: G01J1/0411 ,  G01J1/0242 ,  G01J1/0437 ,  G01J1/0477 ,  G01J1/42

    Abstract: An optical sensing module including a lens and a sensing device is provided. The lens has an optical axis. The sensing device is disposed under the lens, wherein the sensing device is to receive an object beam passing the lens. The optical axis of the lens deviates from a geometric center of the sensing device. An optical sensing module including a prism film, a sensing device and a lens is further provided. The prism film has a plurality of prisms. The sensing device is disposed under the prism film, wherein the sensing device is to receive an object beam sequentially passing the prism film and the lens. The lens is disposed between the prism film and the sensing device.

    Array of encoders for alignment measurement
    87.
    发明授权
    Array of encoders for alignment measurement 有权

    公开(公告)号：US10078269B2

    公开(公告)日：2018-09-18

    申请号：US15283669

    申请日：2016-10-03

    Applicant: NIKON CORPORATION

    Inventor： Eric Peter Goodwin ,  Michael B. Binnard ,  Ruslan Kurdyumov

    IPC: G03B27/52 ,  G03B27/54 ,  G03F7/20 ,  G01J1/04 ,  G01N21/47

    CPC classification number: G03F7/70141 ,  G01J1/0414 ,  G01J1/0448 ,  G01J1/0477 ,  G01J1/08 ,  G01J1/4209 ,  G01N21/4788 ,  G01N21/4795 ,  G03F7/70775 ,  G03F9/7088

    Abstract: System and method for accurately measuring alignment of every exposure field on a pre-patterned wafer without reducing wafer-exposure throughput. Diffraction grating disposed in scribe-lines of such wafer, used as alignment marks, and array of encoder-heads (each of which is configured to define positional phase(s) of at least one such alignment mark) are used. Determination of trajectory of a wafer-stage scanning during the wafer-exposure in the exposure tool employs determining in-plane coordinates of such spatially-periodic alignment marks by simultaneously measuring position-dependent phases of signals produced by these marks as a result of recombination of light corresponding to different diffraction orders produced by these marks. Measurements may be performed simultaneously at all areas corresponding to at least most of the exposure fields of the wafer, and/or with use of a homodyne light source, and/or in a wavelength-independent fashion, and/or with a pre-registration process allowing for accommodation of wafers with differently-dimensioned exposure fields.

    Deflecting prism and measuring assembly
    89.
    发明授权
    Deflecting prism and measuring assembly 有权

    公开(公告)号：US09703022B2

    公开(公告)日：2017-07-11

    申请号：US14682270

    申请日：2015-04-09

    Applicant: ANTON PAAR GMBH

    Inventor： Claus Cagran ,  Michael Imre ,  Ulrich Heppner

    IPC: G01N21/41 ,  G02B5/04 ,  G02B1/02 ,  G01N21/552 ,  G01J1/04 ,  G01N21/43

    CPC classification number: G02B5/04 ,  G01J1/0477 ,  G01N21/43 ,  G01N21/552 ,  G01N2021/434 ,  G01N2201/068 ,  G02B1/02

    Abstract: A deflecting prism for electromagnetic radiation, in particular for refractometer- and/or ATR-measurements, is part of a measuring configuration. The deflecting prism has a body produced in one piece from a mono-crystal. The body has at least two beam conductive surfaces on a side of the body opposite each other or circumferentially about the body and a measuring surface lying between the beam conductive surfaces or surrounded by the latter. The body further has at least one beam entry surface or a beam exit surface. Accordingly, the measuring surface lies on an elevation formed on the body, which crosses over via a ledge surrounding the elevation into the remaining part of the body. On the remaining part, the beam conductive surfaces and/or the beam entry surface or exit surface lie.

    ARRAY OF ENCODERS FOR ALIGNMENT MEASUREMENT
    90.
    发明申请
    ARRAY OF ENCODERS FOR ALIGNMENT MEASUREMENT 审中-公开

    公开(公告)号：US20170097574A1

    公开(公告)日：2017-04-06

    申请号：US15283669

    申请日：2016-10-03

    Applicant: NIKON CORPORATION

    Inventor： ERIC PETER GOODWIN ,  MICHAEL B. BINNARD ,  Ruslan Kurdyumov

    IPC: G03F7/20 ,  G01N21/47 ,  G01J1/04

    CPC classification number: G03F7/70141 ,  G01J1/0414 ,  G01J1/0448 ,  G01J1/0477 ,  G01J1/08 ,  G01J1/4209 ,  G01N21/4788 ,  G01N21/4795 ,  G03F7/70775 ,  G03F9/7088

    Abstract: System and method for accurately measuring alignment of every exposure field on a pre-patterned wafer without reducing wafer-exposure throughput. Diffraction grating disposed in scribe-lines of such wafer, used as alignment marks, and array of encoder-heads (each of which is configured to define positional phase(s) of at least one such alignment mark) are used. Determination of trajectory of a wafer-stage scanning during the wafer-exposure in the exposure tool employs determining in-plane coordinates of such spatially-periodic alignment marks by simultaneously measuring position-dependent phases of signals produced by these marks as a result of recombination of light corresponding to different diffraction orders produced by these marks. Measurements may be performed simultaneously at all areas corresponding to at least most of the exposure fields of the wafer, and/or with use of a homodyne light source, and/or in a wavelength-independent fashion, and/or with a pre-registration process allowing for accommodation of wafers with differently-dimensioned exposure fields.

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