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    Polymerizable composition
    83.
    发明授权
    Polymerizable composition 有权
    可聚合组合物

    公开(公告)号：US07964685B2

    公开(公告)日：2011-06-21

    申请号：US12521502

    申请日：2007-12-27

    Applicant: Akihiko Yoshiwara ,  Junji Kodemura

    Inventor： Akihiko Yoshiwara ,  Junji Kodemura

    IPC: C08G61/08 ,  C08F2/02 ,  C08F4/70 ,  C08F36/00 ,  B32B15/08

    CPC classification number: C08L65/00 ,  C08G61/08 ,  C08G2261/418 ,  C08J5/24 ,  C08J2365/00 ,  C08K3/36 ,  C08K7/26 ,  H01B3/448 ,  H05K1/0373 ,  H05K2201/0158 ,  H05K2201/0254

    Abstract: A polymerizable composition is obtained by mixing a metathesis polymerization catalyst including benzylidene(1,3-dimethyl-4-imidazolidin-2-ylidene)(tricyclohexylphosphine)ruthenium dichloride, a cycloolefin monomer such as 2-norbornene or tetracyclo[6.2.1.13,6.02,7]dodec-4-ene, a chain transfer agent such as allyl methacrylate, and hollow particles such as Shirasu balloons. A crosslinkable resin composite is obtained by coating or impregnating the polymerizable composition onto or into a support medium, and carrying out bulk polymerization of the polymerizable composition. A crosslinked resin composite is obtained by crosslinking the crosslinkable resin composite.

    Abstract translation: 通过将包含亚苄基（1,3-二甲基-4-咪唑烷-2-亚基）（三环己基膦）二氯化钌，易环烯烃单体如2-降冰片烯或四环[6.2.1.13,6.02 ，7]十二碳-4-烯，链转移剂如甲基丙烯酸烯丙酯和中空颗粒如白砂糖气球。 通过将可聚合组合物涂布或浸渍到载体介质上或浸渍到载体介质中并进行可聚合组合物的本体聚合来获得可交联树脂复合材料。 通过使交联性树脂复合体交联而得到交联树脂复合体。

    POLYMER MOLDED BODIES AND PRINTED CIRCUIT BOARD ARRANGEMENT AND METHOD FOR THE PRODUCTION THEREOF
    84.
    发明申请
    POLYMER MOLDED BODIES AND PRINTED CIRCUIT BOARD ARRANGEMENT AND METHOD FOR THE PRODUCTION THEREOF 审中-公开
    聚合物成型体和印刷电路板布置及其生产方法

    公开(公告)号：US20110134617A1

    公开(公告)日：2011-06-09

    申请号：US13058013

    申请日：2009-08-07

    Applicant: Peter Putsch

    Inventor： Peter Putsch

    IPC: H05K7/00 ,  H05K3/00 ,  B32B7/12 ,  B32B5/16 ,  B32B27/18 ,  B82Y99/00 ,  B82Y40/00 ,  B82Y30/00

    CPC classification number: C08J7/08 ,  B82Y10/00 ,  B82Y30/00 ,  C08J5/005 ,  C08J7/123 ,  H05K1/0293 ,  H05K1/0373 ,  H05K3/105 ,  H05K3/321 ,  H05K2201/0129 ,  H05K2201/0158 ,  H05K2201/026 ,  H05K2201/0323 ,  H05K2201/0347 ,  H05K2201/09118 ,  H05K2203/0195 ,  H05K2203/105 ,  H05K2203/107 ,  H05K2203/1105 ,  H05K2203/1115 ,  H05K2203/173 ,  Y10T428/24893

    Abstract: The present invention relates to polymer moldings with conductive, especially electrically conductive, structures on the surface, and to a process for production of these polymer moldings. A further aspect of the invention relates to the use of a device for production of the conductive, especially of the electrically conductive, structures on the surface of the polymer molding. The invention additionally relates to the use of an adhesive comprising carbon nanotubes (CNTs) for electrically conductive bonding of an electronic component to another electrically conductive component or molding.The invention additionally relates to a circuit board arrangement comprising at least one circuit board with at least one electrically conductive track. The at least one electrically conductive track preferably comprises a metal layer and/or at least one electronic component.The invention also relates to processes for production of the inventive circuit board arrangements.

    Abstract translation: 本发明涉及在表面上具有导电性，特别是导电性的结构的聚合物模制品，以及这些聚合物模制品的制造方法。 本发明的另一方面涉及用于在聚合物模制件的表面上制造导电材料，特别是导电结构的装置的用途。 本发明还涉及使用包含碳纳米管（CNT）的粘合剂用于电子部件与另一个导电部件或模制件的导电接合。 本发明还涉及一种电路板装置，其包括具有至少一个导电轨道的至少一个电路板。 所述至少一个导电轨道优选地包括金属层和/或至少一个电子部件。 本发明还涉及用于生产本发明的电路板装置的方法。

    Low dielectric loss composite material
    87.
    发明授权
    Low dielectric loss composite material 有权
    低介电损耗复合材料

    公开(公告)号：US07648758B2

    公开(公告)日：2010-01-19

    申请号：US11671698

    申请日：2007-02-06

    Applicant: Brian G. Morin

    Inventor： Brian G. Morin

    IPC: D02G3/00 ,  D04H1/00

    CPC classification number: H05K1/0366 ,  B29C70/506 ,  B29K2995/0006 ,  C08J5/043 ,  C08J2365/00 ,  D21H13/40 ,  H05K2201/0129 ,  H05K2201/0158 ,  Y10T428/249924 ,  Y10T428/2913 ,  Y10T428/2915 ,  Y10T428/2931 ,  Y10T442/2475 ,  Y10T442/3146

    Abstract: Disclosed are composite materials that can exhibit low transmission energy loss and can also be temperature resistant. The composites include reinforcement fibers held in a polymeric matrix. The polymeric matrix can include an amorphous polymer component. Also disclosed are methods of forming the composites. Methods can include forming amorphous thermoplastic polymer fibers, forming a fabric from the fibers, combining the fabric with reinforcement fibers, and molding the structure thus formed under heat and pressure such that the amorphous thermoplastic polymer flows and forms a polymeric matrix incorporating the reinforcement fibers. The composites can be molded from multi-layer structures that can include layers of differing materials, for instance layers formed of polyaramids, fiberglass, or carbon fiber wovens or nonwovens. The composites can advantageously be utilized in low loss dielectric applications, such as in forming circuit board substrates, radomes, antennas, and the like.

    Abstract translation: 公开了可以表现出低的透射能量损失并且也可以是耐温的复合材料。 复合材料包括保持在聚合物基质中的增强纤维。 聚合物基质可以包括无定形聚合物组分。 还公开了形成复合材料的方法。 方法可以包括形成无定形热塑性聚合物纤维，从纤维形成织物，将织物与增强纤维相结合，以及在热和压力下模制由此形成的结构，使得无定型热塑性聚合物流动并形成结合增强纤维的聚合物基体。 复合材料可以由可以包括不同材料的层的多层结构模制，例如由聚芳酰胺，玻璃纤维或碳纤维织物或无纺布形成的层。 复合材料可有利地用于低损耗介电应用中，例如形成电路板基板，天线罩，天线等。

    METHOD FOR APPLYING A METAL ON PAPER
    88.
    发明申请
    METHOD FOR APPLYING A METAL ON PAPER 审中-公开
    在纸上应用金属的方法

    公开(公告)号：US20090297840A1

    公开(公告)日：2009-12-03

    申请号：US12296663

    申请日：2007-04-10

    Applicant: Karl-Gunnar Larsson ,  Anders Hult

    Inventor： Karl-Gunnar Larsson ,  Anders Hult

    IPC: B32B15/12 ,  B05D1/38 ,  H05H1/00 ,  B05D5/00

    CPC classification number: D21H19/02 ,  C23C18/1605 ,  C23C18/1651 ,  C23C18/1692 ,  C23C18/2006 ,  C23C18/2086 ,  C23C18/28 ,  C23C18/31 ,  C23C18/40 ,  C23C26/00 ,  D21H19/08 ,  D21H23/30 ,  H05K1/03 ,  H05K1/032 ,  H05K1/0366 ,  H05K1/038 ,  H05K1/0386 ,  H05K3/181 ,  H05K3/381 ,  H05K2201/0158 ,  H05K2201/0179 ,  H05K2201/0284 ,  H05K2203/095 ,  Y10T428/265 ,  Y10T428/31703

    Abstract: There is disclosed a method for applying a first metal on paper, which method comprises the steps a) producing polymers on the surface of said paper, said polymers comprising carboxylic groups and adsorbed ions of at least one second metal, said ions being adsorbed at a pH above 7, b) reducing said ions to the second metal and c) depositing said first metal on the reduced ions of said second metal. The invention further comprises objects manufactured according to the method. Advantages of the present invention include improved adhesion of the metal coating, possibility to coat many difficult materials. The process is suitable for large-scale and continuous production and it will reduce the waste of metal. Circuits manufactured according to the invention display improved signal integrity. Also there is the possibility to manufacture circuits which are built up sequentially with several layers of conductors in distinct patterns. It is also possible to manufacture of circuits with a very small line width.

    Abstract translation: 公开了一种在纸上施加第一金属的方法，该方法包括以下步骤：a）在所述纸的表面上制备聚合物，所述聚合物包含羧基和至少一种第二金属的吸附离子，所述离子被吸附在 b）将所述离子还原成第二金属，和c）将所述第一金属沉积在所述第二金属的还原离子上。 本发明还包括根据该方法制造的物体。 本发明的优点包括改善金属涂层的附着力，可能涂覆许多困难的材料。 该工艺适合大规模连续生产，减少金属的浪费。 根据本发明制造的电路显示改进的信号完整性。 还有可能制造电路，其顺序地以不同图案的几层导体构成。 也可以制造线宽非常小的电路。

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