公开(公告)号：US08242384B2

公开(公告)日：2012-08-14

申请号：US12570029

申请日：2009-09-30

Applicant: Moises Cases ,  Tae Hong Kim ,  Rohan U. Mandrekar ,  Nusrat I. Sherali

Inventor： Moises Cases ,  Tae Hong Kim ,  Rohan U. Mandrekar ,  Nusrat I. Sherali

IPC: H05K1/11

CPC classification number: H05K3/0094 ,  H05K1/0234 ,  H05K1/0242 ,  H05K1/0251 ,  H05K1/09 ,  H05K1/167 ,  H05K3/0047 ,  H05K3/244 ,  H05K3/429 ,  H05K2201/0391 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T156/1057 ,  Y10T428/12528

Abstract: Example multi-layer printed circuit boards (‘PCBs’) are described as well as methods of making and using such PCBs that include layers of laminate; at least one via hole traversing the layers of laminate, and a via conductor contained within the via hole, the via conductor comprising a used portion and an unused portion, the via conductor comprising copper coated with a metal having a conductivity lower than the conductivity of copper.

Abstract translation: 描述了例如多层印刷电路板（“PCB”），以及制造和使用这种包括层压层的PCB​​的方法; 穿过层压体层的至少一个通孔，以及包含在通孔内的通孔导体，所述通孔导体包括使用部分和未使用部分，所述通孔导体包括涂覆有电导率低于 铜。

公开(公告)号：US20120080713A1

公开(公告)日：2012-04-05

申请号：US13242329

申请日：2011-09-23

Applicant: Makoto AGATANI ,  Toshio HATA ,  Tomokazu NADA ,  Shinya ISHIZAKI

Inventor： Makoto AGATANI ,  Toshio HATA ,  Tomokazu NADA ,  Shinya ISHIZAKI

IPC: H01L33/62

CPC classification number: H01L25/0753 ,  F21K9/00 ,  F21K9/232 ,  F21V23/06 ,  F21Y2101/00 ,  F21Y2105/10 ,  F21Y2115/10 ,  H01L33/483 ,  H01L33/52 ,  H01L33/54 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2924/01327 ,  H01L2933/0066 ,  H05K1/11 ,  H05K2201/0391 ,  H05K2201/094 ,  H05K2201/0979 ,  H05K2201/10106 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A light-emitting device capable of ensuring an electric connection between a light-emitting element and an electrode without generating any problem in practical use, by both connecting methods with a solder and a connector, and a lighting device provided with the light-emitting device are provided. The light-emitting device according to the present invention has a plurality of LED chips, and a soldering electrode land and a connector connecting electrode land electrically connected to the chips, on a ceramic substrate. The soldering electrode land is formed of a first conductive material having a function to prevent diffusion to a solder, and the connector connecting electrode land is formed of a second conductive material having a function to prevent oxidation.

Abstract translation: 一种能够确保发光元件和电极之间的电连接而不会在实际使用中产生任何问题的发光装置，通过两种连接方法与焊料和连接器，以及设置有发光装置的照明装置 被提供。 根据本发明的发光装置在陶瓷基板上具有多个LED芯片，以及焊接电极焊盘和与芯片电连接的连接器连接电极焊盘。 焊接电极焊盘由具有防止向焊料扩散的功能的第一导电材料形成，并且连接器连接电极焊盘由具有防止氧化功能的第二导电材料形成。

公开(公告)号：US20120018187A1

公开(公告)日：2012-01-26

申请号：US13263629

申请日：2010-03-29

Applicant: Lorenz Berchtold

Inventor： Lorenz Berchtold

IPC: H05K5/02 ,  H01R43/00

CPC classification number: H05K3/202 ,  H01L21/4821 ,  H01L23/49537 ,  H01L23/49579 ,  H01L2924/0002 ,  H05K2201/0391 ,  H05K2201/10924 ,  H05K2203/049 ,  H01L2924/00

Abstract: With the present invention, conductor grids for electronic housings and a manufacturing method for such conductor grids are provided. According to the invention, the conductor grid is produced from two metal strips (130, 110, 140) welded along the joint edge (150), with only one of the two metal strips needing to have a surface suitable for the wire bonding. The amount of the conventionally used, plated starting material can be considerably reduced in this way.

Abstract translation: 通过本发明，提供了电子壳体的导体栅格和这种导体栅格的制造方法。 根据本发明，导体栅格由沿着接合边缘（150）焊接的两个金属条（130,110,140）制成，只有两个金属条中的一个需要具有适于引线接合的表面。 以这种方式可以显着减少常规使用的镀覆起始材料的量。

公开(公告)号：US20110012845A1

公开(公告)日：2011-01-20

申请号：US12615191

申请日：2009-11-09

Applicant: Fletcher R. Rothkopf ,  Stephen P. Zadesky ,  Richard Hung Minh Dinh

Inventor： Fletcher R. Rothkopf ,  Stephen P. Zadesky ,  Richard Hung Minh Dinh

IPC: G06F3/041

CPC classification number: G06F3/044 ,  G06F2203/04111 ,  H05K1/0393 ,  H05K1/09 ,  H05K2201/0108 ,  H05K2201/0326 ,  H05K2201/0391

Abstract: An electronic device may have a touch screen display. The display may have a touch sensor structure that determines the location at which external objects touch the display. The touch sensor structure may have a clear substrate on which conductive capacitive touch sensor electrodes are formed. The electrodes may be formed from a transparent conductive material such as indium-tin oxide. The clear substrate may be formed from a flexible material such as a polymer. The polymer may be a clear polyimide. Copper traces or other conductive traces may be used to route sensor signals from the capacitive touch sensor electrodes to processing circuitry in the electronic device.

Abstract translation: 电子设备可以具有触摸屏显示器。 显示器可以具有确定外部物体触摸显示器的位置的触摸传感器结构。 触摸传感器结构可以具有透明基板，在其上形成导电电容式触摸传感器电极。 电极可以由诸如氧化铟锡的透明导电材料形成。 透明基材可以由柔性材料如聚合物形成。 聚合物可以是透明的聚酰亚胺。 可以使用铜迹线或其它导电迹线将传感器信号从电容式触摸传感器电极路由到电子设备中的处理电路。

公开(公告)号：US20110005822A1

公开(公告)日：2011-01-13

申请号：US12446342

申请日：2007-10-19

Applicant: Yuuki Momokawa

Inventor： Yuuki Momokawa

IPC: H05K1/18 ,  B23K31/02 ,  B23K1/20

CPC classification number: H05K3/321 ,  H01L21/563 ,  H01L21/565 ,  H01L21/6835 ,  H01L23/498 ,  H01L23/49811 ,  H01L24/16 ,  H01L24/81 ,  H01L24/83 ,  H01L2221/68345 ,  H01L2224/134 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81193 ,  H01L2224/8184 ,  H01L2224/83192 ,  H01L2224/8384 ,  H01L2224/92125 ,  H01L2224/92225 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/0102 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/19105 ,  H05K1/095 ,  H05K3/284 ,  H05K3/4664 ,  H05K2201/035 ,  H05K2201/0391 ,  H05K2201/09436 ,  H05K2201/10636 ,  H05K2201/10674 ,  H05K2203/1453 ,  Y02P70/611 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A package structure for an electronic device having an electronic device mounted on a substrate; the electronic device including an external electrode; the substrate including an interconnection and an electrode pad for mounting the electronic device thereon. Part or entire of the interconnection and part or entire of the electrode pad of the substrate are formed of the same material; and the external electrode of the electronic device is joined to the electrode pad of the substrate with a joining part which is the same material as the interconnection and the electrode pad.

Abstract translation: 一种用于电子装置的封装结构，其具有安装在基板上的电子装置; 所述电子设备包括外部电极; 所述基板包括互连件和用于在其上安装所述电子器件的电极焊盘。 部分或全部的互连和基板的电极焊盘的一部分或全部由相同的材料形成; 并且电子器件的外部电极通过与布线和电极焊盘相同的材料的接合部分接合到基板的电极焊盘。

公开(公告)号：US07812460B2

公开(公告)日：2010-10-12

申请号：US12474654

申请日：2009-05-29

Applicant: Shih-Ping Hsu

Inventor： Shih-Ping Hsu

IPC: H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC classification number: H05K3/243 ,  H01L23/49816 ,  H01L23/49866 ,  H01L24/16 ,  H01L24/45 ,  H01L24/48 ,  H01L25/0657 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01055 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/181 ,  H05K1/111 ,  H05K3/3436 ,  H05K2201/0367 ,  H05K2201/0391 ,  H05K2203/049 ,  H05K2203/054 ,  H01L2224/05599 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A packaging substrate and a method for fabricating the same are proposed, including: providing a substrate body having a first surface and an opposing second surface, wherein the first surface has a plurality of flip-chip solder pads and wire bonding pads and the second surface has a plurality of solder ball pads; forming a first and a second solder mask layers on the first and second surfaces respectively and forming openings in the first and second solder mask layers to expose the flip-chip solder pads, the wire bonding pads and the solder ball pads; forming first bumps on the flip-chip solder pads; and forming an electroless Ni/Pd/Au layer on the first bumps and the wire bonding pads by electroless plating, wherein the electroless Ni/Pd/Au layer has a thickness tolerance capable of meeting evenness requirements for fine pitch applications.

Abstract translation: 提出了一种封装基板及其制造方法，包括：提供具有第一表面和相对的第二表面的基板主体，其中第一表面具有多个倒装芯片焊盘和引线接合焊盘，第二表面 具有多个焊球垫; 在第一和第二表面上形成第一和第二焊料掩模层，并在第一和第二焊料掩模层中形成开口以暴露倒装芯片焊盘，引线接合焊盘和焊球焊盘; 在倒装焊盘上形成第一凸点; 以及通过化学镀在所述第一凸块和所述引线接合焊盘上形成化学镀Ni / Pd / Au层，其中所述无电镀Ni / Pd / Au层具有能够满足细间距应用的均匀性要求的厚度公差。

公开(公告)号：US20090296413A1

公开(公告)日：2009-12-03

申请号：US12471634

申请日：2009-05-26

Applicant: Hiroyuki Fukui

Inventor： Hiroyuki Fukui

IPC: F21V29/00 ,  H01J9/00

CPC classification number: F21V29/70 ,  F21K9/00 ,  F21K9/27 ,  F21V29/81 ,  F21V29/83 ,  F21V29/89 ,  F21Y2103/10 ,  F21Y2115/10 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H05K1/0209 ,  H05K1/09 ,  H05K2201/0391 ,  H05K2201/09781 ,  H05K2201/10106 ,  H05K2203/092 ,  Y10S362/80 ,  Y10S438/964 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An LED lamp includes a board, a metal wiring provided on the board, an LED mounted on the metal wiring, and a metal heat dissipation film mainly made of a metal different from a metal for forming the metal wiring. The metal heat dissipation film partially overlaps the metal wiring. The metal heat dissipation film has an irregular surface. The metal heat dissipation film is mainly made of a metal that is softer than the metal wiring. The metal heat dissipation film intervenes between the board and the metal wiring, and part of the metal heat dissipation film that is in contact with the metal wiring has an irregular surface.

Abstract translation: LED灯包括板，设置在板上的金属布线，安装在金属布线上的LED以及金属散热膜，金属散热膜主要由不同于用于形成金属布线的金属的金属制成。 金属散热膜与金属布线部分重叠。 金属散热膜具有不规则的表面。 金属散热膜主要由比金属布线软的金属制成。 金属散热膜介于基板和金属布线之间，与金属布线接触的金属散热膜的一部分具有不规则的表面。

公开(公告)号：US20090278249A1

公开(公告)日：2009-11-12

申请号：US12458429

申请日：2009-07-13

Applicant: Ky-hyun Jung ,  Heui-seog Kim ,  Sang-jun Kim ,  Wha-su Sin ,  Ho-geon Song ,  Jun-young Ko

Inventor： Ky-hyun Jung ,  Heui-seog Kim ,  Sang-jun Kim ,  Wha-su Sin ,  Ho-geon Song ,  Jun-young Ko

IPC: H01L23/498 ,  H05K1/11 ,  H01B5/00

CPC classification number: H05K3/282 ,  H01L21/4853 ,  H01L23/49816 ,  H01L23/49838 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05548 ,  H01L2224/05567 ,  H01L2224/16503 ,  H01L2224/32057 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83102 ,  H01L2224/83385 ,  H01L2224/92125 ,  H01L2924/01006 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K3/243 ,  H05K3/3457 ,  H05K2201/0391 ,  H05K2201/0989 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: A printed circuit board and method thereof and a solder ball land and method thereof. The example printed circuit board (PCB) may include a first solder ball land having a first surface treatment portion configured for a first type of resistance and a second solder ball land having a second surface treatment portion configured for a second type of resistance. The example solder ball land may include a first surface treatment portion configured for a first type of resistance and a second surface treatment portion configured for a second type of resistance. A first example method may include first treating a first surface of a first solder ball land to increase a first type of resistance and second treating a second surface of a second solder ball land to increase a second type of resistance other than the first type of resistance. A second example method may include first treating a solder ball land to increase a first type of resistance and second treating the solder ball land to increase a second type of resistance other than the first type of resistance.

Abstract translation: 一种印刷电路板及其方法和焊球地及其方法。 示例性印刷电路板（PCB）可以包括具有构造成用于第一类型电阻的第一表面处理部分的第一焊球焊盘和具有被配置为用于第二类型电阻的第二表面处理部分的第二焊球焊盘。 示例性焊球焊盘可以包括被配置为用于第一类型电阻的第一表面处理部分和被配置用于第二类型电阻的第二表面处理部分。 第一示例性方法可以包括首先处理第一焊球焊盘的第一表面以增加第一类型的电阻，并且第二处理第二焊球焊盘的第二表面以增加除第一类型电阻之外的第二类型的电阻 。 第二示例性方法可以包括首先处理焊球焊盘以增加第一类型的电阻，并且第二次处理焊球焊盘以增加除第一类型电阻之外的第二类型的电阻。

公开(公告)号：US07576438B2

公开(公告)日：2009-08-18

申请号：US11486064

申请日：2006-07-14

Applicant: Ky-hyun Jung ,  Heui-seog Kim ,  Sang-jun Kim ,  Wha-su Sin ,  Ho-geon Song ,  Jun-young Ko

Inventor： Ky-hyun Jung ,  Heui-seog Kim ,  Sang-jun Kim ,  Wha-su Sin ,  Ho-geon Song ,  Jun-young Ko

IPC: H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC classification number: H05K3/282 ,  H01L21/4853 ,  H01L23/49816 ,  H01L23/49838 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05548 ,  H01L2224/05567 ,  H01L2224/16503 ,  H01L2224/32057 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83102 ,  H01L2224/83385 ,  H01L2224/92125 ,  H01L2924/01006 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K3/243 ,  H05K3/3457 ,  H05K2201/0391 ,  H05K2201/0989 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: A printed circuit board and method thereof and a solder ball land and method thereof. The example printed circuit board (PCB) may include a first solder ball land having a first surface treatment portion configured for a first type of resistance and a second solder ball land having a second surface treatment portion configured for a second type of resistance. The example solder ball land may include a first surface treatment portion configured for a first type of resistance and a second surface treatment portion configured for a second type of resistance. A first example method may include first treating a first surface of a first solder ball land to increase a first type of resistance and second treating a second surface of a second solder ball land to increase a second type of resistance other than the first type of resistance. A second example method may include first treating a solder ball land to increase a first type of resistance and second treating the solder ball land to increase a second type of resistance other than the first type of resistance.

公开(公告)号：US07553750B2

公开(公告)日：2009-06-30

申请号：US11559576

申请日：2006-11-14

Applicant: Chao Wen Shih

Inventor： Chao Wen Shih

IPC: H01L21/44

CPC classification number: H05K3/243 ,  H01L21/4853 ,  H05K1/111 ,  H05K3/28 ,  H05K3/4007 ,  H05K2201/0367 ,  H05K2201/0391 ,  H05K2201/09436 ,  H05K2201/0989 ,  H05K2203/054

Abstract: A method for fabricating an electrical conductive structure of a circuit board is disclosed. The method includes providing a circuit board having a plurality of first and second electrically conductive pads; forming on the circuit board an insulating protection layer having a plurality of openings for exposing the first and second electrically conductive pads; forming a metal adhesive layer on the first and second electrically conductive pads; forming a conductive layer on the insulating protection layer and on the metal adhesive layer formed on the first and second electrically conductive pads, the conductive layer being electrical conductive to the first and second electrically conductive pads; forming on the conductive layer a resist layer having a plurality of openings for exposing the conductive layer on the second electrically conductive pads; and electroplating a conductive structure on the conductive layer on the second electrically conductive pads exposed from the openings.

Abstract translation: 公开了一种用于制造电路板的导电结构的方法。 该方法包括提供具有多个第一和第二导电焊盘的电路板; 在所述电路板上形成具有用于暴露所述第一和第二导电焊盘的多个开口的绝缘保护层; 在第一和第二导电焊盘上形成金属粘合剂层; 在绝缘保护层和形成在第一和第二导电焊盘上的金属粘合剂层上形成导电层，导电层与第一和第二导电焊盘导电; 在所述导电层上形成具有多个开口的抗蚀剂层，用于将所述导电层暴露在所述第二导电焊盘上; 以及在从所述开口暴露的所述第二导电焊盘上的所述导电层上电镀导电结构。