公开(公告)号：US06509546B1

公开(公告)日：2003-01-21

申请号：US09526034

申请日：2000-03-15

Applicant: Frank D. Egitto ,  John S. Kresge

Inventor： Frank D. Egitto ,  John S. Kresge

IPC: B23K2618

CPC classification number: H05K3/0038 ,  B23K26/40 ,  B23K2101/34 ,  B23K2103/02 ,  B23K2103/05 ,  B23K2103/08 ,  B23K2103/10 ,  B23K2103/12 ,  B23K2103/172 ,  B23K2103/42 ,  B23K2103/50 ,  H01L21/78 ,  H05K1/056 ,  H05K3/0052 ,  H05K3/44 ,  H05K2201/09036 ,  H05K2201/0909

Abstract: A method and associated structure for excising laminate chip carriers from a panel that has a thickness less than about 100 mils. A laser beam is focused on a surface of the panel, and the panel is moved relative to the laser beam in a geometric pattern, such that cells of the panel (e.g., chip carriers) are excised from the panel. The laser parameters include a wavelength between about 500 nanometers and about 600 nanometers, a pulse width greater than about 100 nanoseconds and less than about 350 nanoseconds, an average power of at least about 1 watt, a pulse repetition rate between about 5,000 pulses/sec and about 20,000 pulses/sec, and a target diameter (D) between about 2 microns and about 30 microns. The kerf width between adjacent excised cells is between about 2 microns and about 75 microns. The width of an excised cell is at least 5 mm. A displacement between successive pulses of the laser beam is less than about 2D. The panel may comprise a layered structure that includes an organic layer and a metal layer. The laser includes, inter alia, a lasant of Nd:YAG, Nd:YLF, Nd:YAP, or Nd:YVO4. The method of the present invention wastes less panel area by at least a factor of about 13 than does the mechanical excising techniques of the related art.

Abstract translation: 一种用于从厚度小于约100密耳的面板切割层压芯片载体的方法和相关结构。 激光束聚焦在面板的表面上，并且面板以几何图案相对于激光束移动，使得面板的单元（例如，芯片载体）从面板上被切除。 激光参数包括约500纳米至约600纳米之间的波长，大于约100纳秒且小于约350纳秒的脉冲宽度，至少约1瓦特的平均功率，约5,000脉冲/秒之间的脉冲重复率 和约20,000脉冲/秒，目标直径（D）在约2微米至约30微米之间。 相邻切割细胞之间的切口宽度在约2微米至约75微米之间。 切除的细胞的宽度至少为5mm。 激光束的连续脉冲之间的位移小于约2D。 面板可以包括层状结构，其包括有机层和金属层。 激光器尤其包括Nd：YAG，Nd：YLF，Nd：YAP或Nd：YVO4的农民。 与现有技术的机械切除技术相比，本发明的方法比面板面积少了约13倍。

公开(公告)号：US20020111029A1

公开(公告)日：2002-08-15

申请号：US10076178

申请日：2002-02-12

Inventor： Morgan T. Johnson

IPC: H01L021/302 ,  H01L021/461

CPC classification number: B23K26/073 ,  B23K26/382 ,  B23K26/40 ,  B23K2101/40 ,  B23K2103/12 ,  B23K2103/172 ,  B23K2103/42 ,  B23K2103/50 ,  H05K1/0269 ,  H05K1/0393 ,  H05K1/165 ,  H05K3/0032 ,  H05K3/0052 ,  H05K3/027 ,  H05K2201/09063 ,  H05K2201/0909 ,  H05K2201/09918

Abstract: A unified process of making an electrical structure includes performing a plurality of laser etching operations on workpiece, without removing the workpiece from a laser processing system. The workpiece includes a conductive material disposed on an electrically insulating substrate, and the plurality of laser etching operations include, but are not limited to, two or more of forming a fiducial, forming thick metal traces separated by high aspect ratio spaces, cutting an alignment hole, cutting a folding line, and singulating the electrical structure. In another aspect of the invention, a database is prepared, and communicatively coupled to the laser processing system to provide control signals that direct a portion of the plurality of operations of the laser processing system, wherein each plurality of etching operations is defined with respect to a common coordinate system.

Abstract translation: 制造电结构的统一过程包括在工件上执行多个激光蚀刻操作，而不从激光处理系统移除工件。 工件包括设置在电绝缘基板上的导电材料，并且多个激光蚀刻操作包括但不限于形成基准，形成由高纵横比空间分开的厚金属迹线的两个或更多个，切割对准 孔，切割折叠线，并分割电气结构。 在本发明的另一方面中，准备数据库，并且通信地耦合到激光处理系统以提供控制信号，该控制信号指导激光处理系统的多个操作的一部分，其中对于多个蚀刻操作相对于 一个共同的坐标系。

公开(公告)号：US06427892B1

公开(公告)日：2002-08-06

申请号：US10024185

申请日：2001-12-21

Applicant: Harry M. Reijnders

Inventor： Harry M. Reijnders

IPC: B26F300

CPC classification number: H05K1/148 ,  H05K3/0052 ,  H05K2201/09036 ,  H05K2201/0909 ,  H05K2201/10287 ,  H05K2203/0195 ,  H05K2203/302 ,  Y10T29/49135 ,  Y10T29/49155 ,  Y10T83/9449 ,  Y10T225/10 ,  Y10T225/12 ,  Y10T225/325 ,  Y10T225/371

Abstract: A tool for separating a common printed wiring board substrate into a plurality of substrates where, prior to separation, the plurality of substrates are connected by at least one circuit connector. The purpose of the tool is to apply pressure along a dividing line to break the common substrate into separate boards without crimping or breaking the connectors between the boards. In a preferred embodiment, the tool has a beveled edge for contacting the common substrate with mechanism for adjusting the location of notches in the beveled edge. The notches are for alignment with the location of the connectors between the boards.

公开(公告)号：US20020084300A1

公开(公告)日：2002-07-04

申请号：US09751975

申请日：2000-12-29

Inventor： Charles Elkins ,  Dennis Perry

IPC: B26F003/00

CPC classification number: H05K3/0052 ,  B26F3/002 ,  H05K2201/09036 ,  H05K2201/0909 ,  H05K2203/302 ,  Y10T225/10 ,  Y10T225/325 ,  Y10T225/371

Abstract: An apparatus for separating individual circuit boards from a multiple board array with pre-scored planes 10 is provided. The apparatus includes a splitting element 36, positioned along one of the pre-scored planes 28, and a torque inducing element 38 mechanically forcing the multiple board array 20 onto the splitting element 36 thereby breaking the board array 20 along the pre-scored plane 28.

Abstract translation: 提供了一种用于将各个电路板与具有预刻平面10的多板阵列分离的装置。 该设备包括沿着预刻平面28中的一个定位的分离元件36和扭矩诱导元件38，其将多板阵列20机械地强制施加到分离元件36上，从而沿着预刻平面28断开板阵列20 。

公开(公告)号：US06391138B1

公开(公告)日：2002-05-21

申请号：US09399824

申请日：1999-09-20

Applicant: Bruno Bablee ,  Michael Malone

Inventor： Bruno Bablee ,  Michael Malone

IPC: B32B3118

CPC classification number: H05K3/0058 ,  H05K3/386 ,  H05K2201/0909 ,  H05K2201/2009 ,  H05K2203/0264 ,  H05K2203/066 ,  Y10T156/1052 ,  Y10T156/1056 ,  Y10T156/1057 ,  Y10T156/1062 ,  Y10T156/1074 ,  Y10T428/15 ,  Y10T428/24314 ,  Y10T428/24777

Abstract: A method of fabricating a laminated circuit assembly and the assembly made therefrom including the steps of providing a relatively stiff substrate. A U-shaped slit is cut in the substrate in an area where a peripheral pull tab subsequently is to be located. The side legs of the U-shaped configuration define spaced slit portions. A relatively flexible backing sheet is adhered to a back side of the substrate. The laminated substrate and backing sheet are cut with a peripheral cut intersecting the side legs of the U-shaped slit, with the peripheral cut forming a pull tab projecting outwardly from the U-shaped slit. The pull tab can be grasped and separated from the substrate to strip the backing sheet therefrom.

Abstract translation: 一种制造层压电路组件的方法及由此制成的组件包括提供相对刚性的衬底的步骤。 在随后设置外围拉片的区域中，在基板上切割U形狭缝。 U形构造的侧腿限定了间隔的狭缝部分。 相对柔性的背衬片粘附到基底的背面。 层叠基板和背衬片用与U形狭缝的侧腿相交的周边切口切割，周边切口形成从U形狭缝向外突出的拉片。 拉片可以被抓握并与衬底分离以从其剥离背衬片。

公开(公告)号：US20020023344A1

公开(公告)日：2002-02-28

申请号：US09940655

申请日：2001-08-29

Inventor： Kazuhide Ohira ,  Teturou Uchida

IPC: H05K003/02 ,  H05K003/10 ,  B23P017/00

CPC classification number: H05K3/0052 ,  H05K1/0286 ,  H05K2201/09063 ,  H05K2201/0909 ,  Y10T29/49126 ,  Y10T29/49144 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T29/49789

Abstract: A method for manufacturing two kinds of printed circuit boards from one master board, comprises the steps of preparing the master board, forming slits on the master board to define a first circuit area, and executing: (a) forming first cut grooves extending substantially perpendicular to the slits so as to across outer side of both ends of the slits on the master board to define a second circuit area which surrounds the first circuit area, and cutting the master board along the first cut grooves to separate a first individual circuit board including the first and second circuit areas, or (b) forming second cut grooves on the master board so as to across both ends of the slits, and cutting the master board along the second cut grooves to separate a second individual circuit board including only the first circuit area.

Abstract translation: 一种用于从一个主板制造两种印刷电路板的方法包括以下步骤：准备主板，在主板上形成狭缝以限定第一电路区域，并执行：（a）形成基本垂直延伸的第一切割槽 到所述狭缝，以便跨越所述主板上的狭缝的两端的外侧，以限定围绕所述第一电路区域的第二电路区域，以及沿着所述第一切割槽切割所述主板，以分离第一单独电路板，所述第一单独电路板包括 第一和第二电路区域，或（b）在主板上形成第二切割凹槽以跨过狭缝的两端，并沿着第二切割槽切割主板，以分离仅包括第一切割槽的第二单独电路板 电路面积。

公开(公告)号：US06328598B1

公开(公告)日：2001-12-11

申请号：US09556595

申请日：2000-04-21

Applicant: James Errol Harris, Jr.

Inventor： James Errol Harris, Jr.

IPC: H01R2700

CPC classification number: H05K1/141 ,  H01R12/7088 ,  H05K1/14 ,  H05K1/142 ,  H05K1/148 ,  H05K3/0052 ,  H05K3/36 ,  H05K3/361 ,  H05K2201/0909 ,  H05K2201/09954 ,  H05K2201/10189

Abstract: An improved printed circuit board capable of being received by two different types of connector panels is disclosed. The printed circuit board includes a main board portion, and a breakaway board portion. The main board portion includes a first connector. The breakaway board portion is coupled to the main board portion utilizing perforations. The breakaway board portion includes a second connector. The breakaway board portion is capable of being completely detached from the main board portion. The main board portion is electrically coupled to the breakaway board portion utilizing a flexible ribbon cable. The printed circuit board is capable of being received by either a first or a second type of connector panel. The first type of connector panel includes a first connector receptacle and a second connector receptacle disposed in a first configuration. The first connector receptacle is capable of receiving the first connector, and the second connector receptacle is capable of receiving the second connector when the breakaway board portion remains attached to the main board portion. The second type of connector panel includes a third connector receptacle and a fourth connector receptacle disposed in a second configuration. The third connector receptacle is capable of receiving the first connector, and the fourth connector receptacle is capable of receiving the second connector when the breakaway board portion is detached from the main board portion.

Abstract translation: 公开了能够被两种不同类型的连接器面板接收的改进的印刷电路板。 印刷电路板包括主板部分和分离板部分。 主板部分包括第一连接器。 分离板部分利用穿孔联接到主板部分。 分离板部分包括第二连接器。 分离板部分能够从主板部分完全分离。 主板部分利用柔性带状电缆电耦合到分离板部分。 印刷电路板能够被第一或第二类型的连接器面板接收。 第一类型的连接器面板包括第一连接器插座和设置在第一配置中的第二连接器插座。 第一连接器插座能够接收第一连接器，并且当分离板部分保持附接到主板部分时，第二连接器插座能够接收第二连接器。 第二类型的连接器面板包括设置在第二构造中的第三连接器插座和第四连接器插座。 第三连接器插座能够接收第一连接器，并且当分离板部分与主板部分分离时，第四连接器插座能够接收第二连接器。

公开(公告)号：US20010048014A1

公开(公告)日：2001-12-06

申请号：US09870299

申请日：2001-05-30

Applicant: NEC Corporation

Inventor： Seiji Ichikawa ,  Tatsuo Tokue ,  Nobuo Nagano ,  Fumie Ogihara ,  Taku Sato

IPC: B26F003/00

CPC classification number: H01L21/67092 ,  B28D5/0011 ,  H01L21/3043 ,  H01L21/78 ,  H05K1/0306 ,  H05K3/0052 ,  H05K2201/09036 ,  H05K2201/0909 ,  H05K2203/1572 ,  H05K2203/302 ,  Y10T225/12 ,  Y10T225/325

Abstract: A method of producing a semiconductor device of the present invention is applicable to a multilayer wafer for leadless chip carrier packages and breaks it on a package basis. The method begins with a step of forming a generally V-shaped groove in one major surfaces of the wafer in the direction of thickness of the wafer. A weak, cleaving portion is formed in the other major surface of the wafer in alignment with the groove. A cleaving force is exerted on the wafer to thereby form a break in the cleaving portion, so that the wafer is caused to break from the groove toward the cleaving portion in the direction of thickness of the wafer. The cleaving portion may be replaced with a strong, non-cleaving portion, in which case the break is formed in the interface between the non-cleaving portion and the wafer due to a difference in cleaving force.

Abstract translation: 本发明的半导体器件的制造方法可应用于无引线芯片载体封装的多层晶片，并以封装为基础将其破坏。 该方法开始于在晶片的一个主表面上沿晶片厚度方向形成大致V形槽的步骤。 在晶片的另一个主表面上与凹槽对准地形成弱的分离部分。 切割力施加在晶片上，从而在裂开部分形成断裂，从而使得晶片在晶片的厚度方向上从凹槽向分裂部分断裂。 切割部分可以用强的非分裂部分代替，在这种情况下，由于分裂力的差异，在非裂开部分和晶片之间的界面中形成断裂。

公开(公告)号：US20010018983A1

公开(公告)日：2001-09-06

申请号：US09783922

申请日：2001-02-15

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Norio Sakai ,  Kazuhiro Iida

IPC: H05K001/03

CPC classification number: H01L23/585 ,  H01L21/481 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K3/0052 ,  H05K2201/09036 ,  H05K2201/0909 ,  H05K2201/09781 ,  H05K2203/302 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49163 ,  Y10T29/49165 ,  Y10T29/49789 ,  Y10T29/4979 ,  H01L2924/00

Abstract: A multilayer integrated substrate includes breaking grooves arranged in a grid pattern so as to section the main surface of the substrate into a plurality of blocks, and also includes fracture-preventing conductor films arranged so as to cross the breaking grooves. The fracture-preventing conductor films contain a metal component that prevents undesirable fracturing of the multilayer integrated substrate along the breaking grooves.

Abstract translation: 多层集成基板包括以栅格图案布置的断开槽，以将基板的主表面分割成多个块，并且还包括布置成穿过断开槽的防裂导体膜。 防断裂导体膜含有防止多层一体化基板沿着断裂槽的不希望的断裂的金属成分。

公开(公告)号：US06240635B1

公开(公告)日：2001-06-05

申请号：US09196885

申请日：1998-11-20

Applicant: Scott Peter Graves ,  George Anton Huston

Inventor： Scott Peter Graves ,  George Anton Huston

IPC: H05K334

CPC classification number: H05K3/0052 ,  H05K3/0097 ,  H05K3/303 ,  H05K2201/0909 ,  H05K2203/302 ,  Y10T29/49144 ,  Y10T29/49789 ,  Y10T29/4979 ,  Y10T29/49792 ,  Y10T29/49794

Abstract: Circuit boards are formed within the boundaries of an insulative sheet or panel such that the panel may be automatably processed. The periphery of each printed circuit board is defined by at least a plurality of score lines which do not extend to the edge of the sheets and may include also uncut and/or unscored areas to provide stability to either the sheet or segments of scrap material, lending rigidity to the sheet. Following complete fabrication of the printed circuit board, the sheet is cut by a routing process to extend selected score lines to the edges of the sheet to destroy the integrity of the frame of scrap material surrounding the printed circuit boards.

Abstract translation: 电路板形成在绝缘片或面板的边界内，使得面板可以被自动地处理。 每个印刷电路板的周边由至少多个刻痕线限定，其不延伸到片材的边缘，并且还可以包括未切割和/或未切割的区域，以为片材或碎片的片段提供稳定性， 向片材借出刚性。 在完成印刷电路板的制造之后，通过布线工艺切割片材以将选定的刻痕线延伸到片材的边缘以破坏围绕印刷电路板的废料的框架的完整性。