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    Modified core for circuit module system and method
    82.
    发明授权
    Modified core for circuit module system and method 有权
    电路模块系统和方法的改进核心

    公开(公告)号：US07760513B2

    公开(公告)日：2010-07-20

    申请号：US11397597

    申请日：2006-04-03

    Applicant: Julian Partridge ,  David Roper ,  Paul Goodwin

    Inventor： Julian Partridge ,  David Roper ,  Paul Goodwin

    IPC: H05K1/11

    CPC classification number: H05K1/189 ,  H05K1/0203 ,  H05K1/11 ,  H05K1/181 ,  H05K3/0061 ,  H05K2201/056 ,  H05K2201/09445 ,  H05K2201/10159 ,  H05K2201/1056 ,  H05K2201/10734 ,  H05K2203/1572

    Abstract: Flexible circuitry is populated with integrated circuitry (ICs) disposed along one or both of its major sides. The populated flexible circuitry is disposed proximal to a rigid substrate to place the integrated circuitry on one or both sides of the substrate with one or two layers of integrated circuitry on one or both sides of the substrate. The rigid substrate exhibits adhesion features that allow more advantageous use of thermoplastic adhesives with concomitant rework advantages and while providing flexibility in meeting dimensional specifications such as those promulgated by JEDEC, for example.

    Abstract translation: 灵活的电路填充有沿其主要一侧或两侧设置的集成电路（IC）。 填充的柔性电路设置在刚性衬底附近，以将集成电路放置在衬底的一侧或两侧上，在衬底的一侧或两侧上具有一层或两层集成电路。 刚性基材表现出粘合特征，其允许更有利地使用具有伴随返工优点的热塑性粘合剂，并且同时提供满足例如由JEDEC公布的尺寸规格的柔性。

    Circuit Module with Thermal Casing Systems
    84.
    发明申请
    Circuit Module with Thermal Casing Systems 失效
    具有热套管系统的电路模块

    公开(公告)号：US20090052124A1

    公开(公告)日：2009-02-26

    申请号：US12263060

    申请日：2008-10-31

    Applicant: James Douglas Wehrly, JR. ,  James Wilder ,  Mark Wolfe ,  Paul Goodwin

    Inventor： James Douglas Wehrly, JR. ,  James Wilder ,  Mark Wolfe ,  Paul Goodwin

    IPC: H05K7/20

    CPC classification number: H05K1/189 ,  H05K1/0203 ,  H05K1/11 ,  H05K1/181 ,  H05K3/0061 ,  H05K2201/056 ,  H05K2201/09445 ,  H05K2201/10159 ,  H05K2201/1056 ,  H05K2201/10734 ,  H05K2203/1572

    Abstract: Flexible circuitry is populated with integrated circuitry (ICs), and contacts are distributed along the flexible circuitry to provide connection to an application environment. The flexible circuitry is disposed about a rigid substrate, placing the ICs on one or both sides of the substrate with one or more layers of integrated circuitry on one or both sides of the substrate. The substrate is preferably devised from thermally-conductive materials and one or more thermal spreaders are in thermal contact with at least some of the ICs. Optionally, as an additional thermal management feature, the module may include a high thermal conductivity thermal sink or area that is disposed proximal to higher thermal energy IC devices. In preferred embodiments, extensions from the substrate body or substrate core encourage reduced thermal variations amongst the ICs of the module while providing an enlarged surface for shedding thermal energy from the module.

    Abstract translation: 灵活的电路采用集成电路（IC），并且触点沿柔性电路分布，以提供与应用环境的连接。 柔性电路围绕刚性衬底设置，将IC放置在衬底的一侧或两侧上，在衬底的一侧或两侧上具有一层或多层集成电路。 衬底优选地由导热材料设计，并且一个或多个热扩散器与至少一些IC热接触。 可选地，作为附加的热管理特征，模块可以包括设置在较高热能IC器件附近的高导热性散热器或区域。 在优选实施例中，来自衬底主体或衬底芯的延伸部促进模块的IC之间的热变化减小，同时提供用于从模块中排出热能的放大表面。

    SEMICONDUCTOR MODULE
    85.
    发明申请
    SEMICONDUCTOR MODULE 审中-公开
    半导体模块

    公开(公告)号：US20090016022A1

    公开(公告)日：2009-01-15

    申请号：US12172133

    申请日：2008-07-11

    Applicant: Hun HAN ,  Dong-Chun LEE ,  Hyo-Jae BANG

    Inventor： Hun HAN ,  Dong-Chun LEE ,  Hyo-Jae BANG

    IPC: H05K7/20

    CPC classification number: H05K1/189 ,  G11C5/04 ,  H05K1/0272 ,  H05K3/0061 ,  H05K2201/056 ,  H05K2201/064 ,  H05K2201/09445 ,  H05K2201/10159 ,  H05K2203/1572

    Abstract: A semiconductor module includes a base plate, a circuit substrate coupled to a side face of the base plate, a first semiconductor package mounted on the circuit substrate and a radiation channel portion inside the base plate. The radiation channel portion includes at least one heat pipe containing a working fluid. The at least one heat pipe containing the working fluid is configured to transfer heat generated by the first semiconductor package. Thus, the radiation channel portion may provide an efficient and reliable semiconductor module having improved heat transfer and radiation performance.

    Abstract translation: 半导体模块包括基板，耦合到基板的侧面的电路基板，安装在电路基板上的第一半导体封装和基板内部的辐射通道部分。 辐射通道部分包括至少一个含有工作流体的热管。 含有工作流体的至少一个热管构造成传递由第一半导体封装产生的热量。 因此，辐射通道部分可以提供具有改进的热传递和辐射性能的有效且可靠的半导体模块。

    TAB WRAP FOLDABLE ELECTRONIC ASSEMBLY MODULE AND METHOD OF MANUFACTURE
    87.
    发明申请
    TAB WRAP FOLDABLE ELECTRONIC ASSEMBLY MODULE AND METHOD OF MANUFACTURE 审中-公开
    TAB封装可折叠电子组件模块及其制造方法

    公开(公告)号：US20080225476A1

    公开(公告)日：2008-09-18

    申请号：US11306803

    申请日：2006-01-11

    Applicant: Chris Karabatsos

    Inventor： Chris Karabatsos

    IPC: H05K5/00 ,  H01R43/00

    CPC classification number: G06F1/185 ,  H05K1/189 ,  H05K3/0061 ,  H05K3/4691 ,  H05K2201/056 ,  H05K2201/09445 ,  H05K2201/10159 ,  H05K2201/10734 ,  H05K2203/1572 ,  Y10T29/49169

    Abstract: A high-density memory module is made up of two memory boards, each with memory elements affixed to each of two sides, the two memory boards disposed on either side of a central rigid substrate, each memory board having a flexible wiring array, electrically and mechanically affixed at one end to one of the memory board and at the other end to the other of the memory boards, the flexible wiring array wrapped at its midpoint around a bottom of the central rigid substrate, so that two linear arrays of comb tabs affixed to the flexible wiring array are disposed in proximity to the bottom of the central rigid substrate, so that the central rigid substrate may be inserted into a mating electrical connector, making an electrical connection with both memory boards.

    Abstract translation: 高密度存储器模块由两个存储器板组成，每个存储器板具有固定到两侧中的每一个的存储元件，两个存储器板设置在中央刚性衬底的任一侧上，每个存储器板具有柔性布线阵列，电和 在一端机械地固定在存储器板之一上，另一端机械地固定到另一个存储器板上，柔性布线阵列围绕中心刚性基板的底部包裹在其中点，从而固定两个线形阵列的梳齿 柔性布线阵列设置在中央刚性基板的底部附近，使得中心刚性基板可插入配合的电连接器中，从而与两个存储板电连接。

    Thin multichip flex-module
    89.
    发明申请
    Thin multichip flex-module 失效
    薄多芯片柔性模块

    公开(公告)号：US20070212906A1

    公开(公告)日：2007-09-13

    申请号：US11715091

    申请日：2007-03-07

    Applicant: James E. Clayton ,  Zakaryae Fathi

    Inventor： James E. Clayton ,  Zakaryae Fathi

    IPC: H05K1/00

    CPC classification number: H05K1/189 ,  H01L23/473 ,  H01L23/5387 ,  H01L25/50 ,  H01L2225/06589 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/3011 ,  H05K1/0278 ,  H05K1/028 ,  H05K3/0064 ,  H05K2201/0191 ,  H05K2201/056 ,  H05K2201/09118 ,  H05K2201/09445 ,  H05K2201/10159 ,  H05K2201/2018 ,  H01L2924/00

    Abstract: A thin multichip module comprises: a foldable frame comprising two rigid, substantially planar members capable of being folded together about a selected fold axis to form a substantially closed structure; a flex circuit having a plurality of integrated circuit chips disposed thereon, the flex circuit bonded to at least one of the planar members over at least a portion of each of their respective surfaces; and, electrodes on the module configured to be accessible to an external socket after the frame is closed. A method for making a thin multichip module comprises the steps of: a. attaching integrated circuit chips to a flex circuit; b. bonding the flex circuit to a foldable frame comprising two rigid, substantially planar members capable of being folded together about a selected fold axis to form a substantially closed structure; and, c. folding the frame approximately 180° about the fold axis.

    Abstract translation: 薄多芯片模块包括：可折叠框架，其包括两个刚性的基本平坦的构件，其能够围绕选定的折叠轴线折叠在一起以形成基本封闭的结构; 具有设置在其上的多个集成电路芯片的柔性电路，所述柔性电路在其各自表面的每一个的至少一部分上结合到所述平面构件中的至少一个; 并且模块上的电极被配置为在框架关闭之后可以被外部插座访问。 一种制造薄多芯片模块的方法包括以下步骤：a。 将集成电路芯片附接到柔性电路; b。 将柔性电路接合到可折叠框架，该可折叠框架包括两个刚性的基本平坦的构件，能够围绕选定的折叠轴线折叠在一起以形成基本封闭的结构; 和，c。 将框架围绕折叠轴线折叠约180°。

    Thin multichip flex-module
    90.
    发明申请
    Thin multichip flex-module 有权
    薄多芯片柔性模块

    公开(公告)号：US20070212902A1

    公开(公告)日：2007-09-13

    申请号：US11715303

    申请日：2007-03-07

    Applicant: James E. Clayton ,  Zakaryae Fathi

    Inventor： James E. Clayton ,  Zakaryae Fathi

    IPC: H01R12/00

    CPC classification number: H05K1/189 ,  G06F1/183 ,  H05K3/0061 ,  H05K2201/056 ,  H05K2201/09445 ,  H05K2201/2018

    Abstract: A low insertion force multichip in-line module comprises: a substantially rigid frame; a flex circuit having a plurality of integrated circuit chips disposed thereon, the flex circuit having contacts at least partially exposed along one edge of the frame; and, a compliant layer disposed between the exposed flex circuit and the rigid frame, whereby controlled deformation of the compliant layer enhances electrical continuity between the contacts and corresponding external electrical pins. Alternatively, a low insertion force multichip in-line module comprises: a substantially rigid frame; a flex circuit having a plurality of integrated circuit chips disposed thereon, the flex circuit having contacts at least partially exposed along one edge of the frame; a socket configured to matably engage the module; and, a compliant layer disposed between the exposed flex circuit and the rigid frame, whereby controlled deformation of the compliant layer enhances electrical continuity between the contacts and corresponding external electrical pins.

    Abstract translation: 低插入力多芯片在线模块包括：基本刚性的框架; 具有设置在其上的多个集成电路芯片的柔性电路，所述柔性电路具有至少部分地沿着所述框架的一个边缘露出的触点; 以及设置在暴露的柔性电路和刚性框架之间的柔性层，由此柔性层的受控变形增强了触头和对应的外部电引脚之间的电连续性。 或者，低插入力多芯片在线模块包括：基本刚性的框架; 具有设置在其上的多个集成电路芯片的柔性电路，所述柔性电路具有至少部分地沿着所述框架的一个边缘露出的触点; 被配置成与所述模块配合地配合的插座; 以及设置在暴露的柔性电路和刚性框架之间的柔性层，由此柔性层的受控变形增强了触头和对应的外部电引脚之间的电连续性。

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