公开(公告)号：US20070117423A1

公开(公告)日：2007-05-24

申请号：US11598699

申请日：2006-11-14

Applicant: Gab Kim ,  Seung Lee

Inventor： Gab Kim ,  Seung Lee

IPC: H05K1/00

CPC classification number: H04N5/2253 ,  G03B17/00 ,  H01L27/14618 ,  H01L31/0203 ,  H01L31/0232 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2924/16195 ,  H04N5/2257 ,  H05K1/111 ,  H05K3/305 ,  H05K2201/09736 ,  H05K2201/09745 ,  H05K2203/049 ,  Y02P70/611 ,  H01L2924/00014 ,  H01L2924/00

Abstract: Provided is a camera module using a PCB with a step portion. The camera module includes a PCB, a housing, and a lens barrel. The PCB includes a substrate main body, a plurality of pads, and a step portion. The substrate main body is formed of a stacked structure with the shape of a rectangular plate. The pads is formed on both sides of the top of the substrate main body and is electrically connected through wires to an image sensor mounted on a central portion of the top of the substrate main body. The step portion is formed at the peripheral edges of the pads. The housing has a bottom peripheral portion that is closely attached to the step portion of the PCB. The lens barrel is installed vertically in an upper region of the housing. Accordingly, it is possible to enhance the quality of image taken by the image sensor. In addition, the contact area between the housing and the PCB is increased to make it possible to enhance the assembly reliability of the camera module.

Abstract translation: 提供了一种使用具有台阶部分的PCB的相机模块。 相机模块包括PCB，外壳和镜筒。 PCB包括基板主体，多个焊盘和台阶部分。 基板主体由具有矩形板的形状的堆叠结构形成。 焊盘形成在基板主体的顶部的两侧，并且通过导线电连接到安装在基板主体的顶部的中心部分上的图像传感器。 台阶部分形成在焊盘的周边边缘处。 壳体具有紧密连接到PCB的台阶部分的底部周边部分。 透镜筒垂直安装在壳体的上部区域中。 因此，可以提高图像传感器拍摄的图像的质量。 此外，壳体和PCB之间的接触面积增加，使得可以增强相机模块的组装可靠性。

公开(公告)号：US07213331B2

公开(公告)日：2007-05-08

申请号：US10689471

申请日：2003-10-20

Applicant: Tongbi Jiang ,  Edward A. Schrock

Inventor： Tongbi Jiang ,  Edward A. Schrock

IPC: H05K3/34

CPC classification number: H01L24/83 ,  H01L24/31 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/0781 ,  H01L2924/12042 ,  H01L2924/14 ,  H05K1/095 ,  H05K3/1216 ,  H05K3/4007 ,  H05K2201/035 ,  H05K2201/0367 ,  H05K2201/09745 ,  H05K2203/167 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49147 ,  Y10T29/49155 ,  Y10T29/49181 ,  Y10T29/49204 ,  H01L2924/00

Abstract: A method of forming a stencil for the manufacture of semiconductor devices includes defining a plurality of slightly spaced segmental annular openings in a stencil plate. The spacing between the segmental annular openings define spokes extending from a central portion of said stencil connected via those spokes to the rest of the stencil plate. The spokes extend past two adjacent annular segments.

Abstract translation: 形成用于制造半导体器件的模板的方法包括在模板中限定多个稍微间隔开的节段环形开口。 节段环形开口之间的间隔限定了从通过这些轮辐连接到模板的其余部分的所述模板的中心部分延伸的辐条。 轮辐延伸过两个相邻的环形段。

公开(公告)号：US07213329B2

公开(公告)日：2007-05-08

申请号：US11196243

申请日：2005-08-04

Applicant: Seung-Woo Kim ,  Pyeong-Wan Kim ,  Sang-Ho Ahn ,  Bo-Seong Kim ,  Ho-Jeong Mun ,  Tae-Seong Park ,  Hee-Guk Choi

Inventor： Seung-Woo Kim ,  Pyeong-Wan Kim ,  Sang-Ho Ahn ,  Bo-Seong Kim ,  Ho-Jeong Mun ,  Tae-Seong Park ,  Hee-Guk Choi

IPC: H05K3/00 ,  H05K3/40 ,  H05K7/06 ,  H01L21/44

CPC classification number: H05K1/111 ,  H01L21/4853 ,  H01L23/49816 ,  H01L2224/03831 ,  H01L2224/0391 ,  H01L2224/0401 ,  H01L2224/05551 ,  H01L2224/05557 ,  H01L2224/05567 ,  H01L2224/05571 ,  H01L2224/13007 ,  H01L2224/13018 ,  H01L2224/13022 ,  H01L2924/0002 ,  H01L2924/01046 ,  H01L2924/01327 ,  H05K3/06 ,  H05K3/282 ,  H05K3/3452 ,  H05K2201/09745 ,  H05K2201/099 ,  H05K2203/0353 ,  Y02P70/611 ,  Y10T29/49124 ,  Y10T29/49147 ,  H01L2924/00 ,  H01L2224/05552 ,  H01L2924/00012

Abstract: In the method, a conductive pad of the board is etched to a depth that is greater than 50% and less than 100% of a thickness of the conductive pad. Subsequently, a solder ball may be formed on the etched conductive pad. For example, the conductive pad may be copper.

Abstract translation: 在该方法中，将电路板的导电焊盘蚀刻到大于导电焊盘厚度的50％且小于100％的深度。 随后，可以在蚀刻的导电焊盘上形成焊球。 例如，导电焊盘可以是铜。

公开(公告)号：US20070080360A1

公开(公告)日：2007-04-12

申请号：US11518193

申请日：2006-09-11

Applicant: Url Mirsky ,  Shimon Neftin ,  Furee Lov

Inventor： Url Mirsky ,  Shimon Neftin ,  Furee Lov

IPC: H01L33/00

CPC classification number: H01L33/64 ,  H01L23/3677 ,  H01L23/3735 ,  H01L24/48 ,  H01L25/0753 ,  H01L33/62 ,  H01L33/641 ,  H01L33/642 ,  H01L33/647 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01055 ,  H01L2924/01063 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/12044 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/19041 ,  H01L2924/30107 ,  H01L2924/3011 ,  H05K1/021 ,  H05K1/053 ,  H05K3/445 ,  H05K2201/09745 ,  H05K2201/10106 ,  H05K2203/0315 ,  H05K2203/049 ,  H05K2203/1142 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A LED (Light Emitting Diode) substrate and packaging for a single diode or a diode array is described. The substrate includes an integral reflector(s) for the diode(s) in the form of a shaped cavity (or cavities) to house the diode die(s). The reflector cavity walls can optionally be plated with a reflective material and may include a molding material to serve as lens and sealant. Also described is a method for building a substrate with direct metal connection of low thermal path between a die and a bottom surface of the substrate. Another embodiment is for two electrical traces crossing each other without the need for a two layer interconnect structure. The substrate and reflector structures are built of aluminum-aluminum oxide composition applying a technology known in the art as ALOX technology. The resulting substrate and packaging afford the required electrical interconnections and enhanced thermal performance while maintaining excellent mechanical properties. The same substrate and packaging concepts can be applied for other high power devices requiring high thermal conductivity substrate and package.

Abstract translation: 描述了用于单个二极管或二极管阵列的LED（发光二极管）基板和封装。 衬底包括用于容纳二极管管芯的成形腔（或腔）形式的二极管的整体反射器。 反射器空腔壁可以可选地镀有反射材料，并且可以包括用作透镜和密封剂的模制材料。 还描述了一种用于在芯片和基板的底表面之间构建具有低热路径的直接金属连接的基板的方法。 另一个实施例是两个电迹线彼此交叉而不需要两层互连结构。 基板和反射器结构由铝 - 铝氧化物组合物构成，应用本领域已知的技术作为ALOX技术。 所得的基材和包装提供所需的电互连和增强的热性能，同时保持优异的机械性能。 相同的基板和封装概念可以应用于需要高导热性基板和封装的其他大功率器件。

公开(公告)号：US20070023900A1

公开(公告)日：2007-02-01

申请号：US11457505

申请日：2006-07-14

Applicant: Naoyuki TOYODA

Inventor： Naoyuki TOYODA

IPC: H01L23/48

CPC classification number: H05K1/111 ,  H01L24/02 ,  H01L24/45 ,  H01L24/48 ,  H01L24/85 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/48475 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/85051 ,  H01L2224/85205 ,  H01L2224/85385 ,  H01L2224/85423 ,  H01L2224/85444 ,  H01L2924/00014 ,  H01L2924/10161 ,  H01L2924/10253 ,  H01L2924/12044 ,  H01L2924/14 ,  H05K3/125 ,  H05K2201/09745 ,  H05K2203/013 ,  Y02P70/611 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2224/4554

Abstract: A method for fabricating a bonding pad 45 includes disposing a droplet L including a liquid containing a conductive material on a substrate P by a droplet ejection method and solidifying the disposed droplet L to forms the pad. The bonding pad 45 formed has a cylindrical shape and includes a concave part 47.

Abstract translation: 用于制造接合焊盘45的方法包括：通过液滴喷射方法将包含导电材料的液体的液滴L设置在基板P上，并使所设置的液滴L凝固形成焊盘。 所形成的焊盘45具有圆筒形状，并且包括凹部47。

公开(公告)号：US07166481B2

公开(公告)日：2007-01-23

申请号：US10896808

申请日：2004-07-22

Applicant: John Paul Tellkamp

Inventor： John Paul Tellkamp

IPC: H01L21/66

CPC classification number: H01L24/83 ,  H01L24/29 ,  H01L24/32 ,  H01L2224/291 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/181 ,  H05K1/0204 ,  H05K1/0206 ,  H05K3/0005 ,  H05K3/341 ,  H05K2201/0367 ,  H05K2201/09745 ,  H05K2201/10689 ,  H05K2201/10969 ,  H05K2203/162 ,  Y02P70/613 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A method of reducing a likelihood that a die pad will be delaminated from a die in an integrated circuit die package for a structure design during an attachment of a heat sink member to the die pad using solder, is provided. A sample structure of the structure design is evaluated to determine whether a volume of last solidification for the solder is centrally located with respect to the die pad and is located at or near an interface of the solder and the die pad. If the last solidification volume is centrally located and is located at or near the interface of the solder and the die pad, and if the die pad is delaminated from the die, the structure design is modified so that less metal of the heat sink member is centrally located than before the modifying.

Abstract translation: 提供了一种降低在使用焊料将散热构件附接到裸片焊盘期间用于结构设计的集成电路管芯封装中的管芯焊盘从管芯剥离的可能性的方法。 评估结构设计的样品结构以确定焊料的最后凝固体积是否相对于芯片焊盘位于中心位置，并且位于焊料和管芯焊盘的界面处或附近。 如果最后一个凝固体位于中心位置并且位于焊料和管芯焊盘的界面处或附近，并且如果管芯焊盘从模具分层，则结构设计被修改为使得散热构件的金属少于 位于中心位置比修改前。

公开(公告)号：US20060234528A1

公开(公告)日：2006-10-19

申请号：US11402881

申请日：2006-04-13

Applicant: Tetsuo Nakano ,  Yukihiro Maeda

Inventor： Tetsuo Nakano ,  Yukihiro Maeda

IPC: H05K1/00

CPC classification number: H05K3/3405 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/19105 ,  H01L2924/19107 ,  H05K3/0061 ,  H05K3/3415 ,  H05K3/3421 ,  H05K5/0069 ,  H05K2201/09745 ,  H05K2201/10189 ,  H05K2201/10446 ,  H05K2203/0173 ,  H01L2224/0401

Abstract: An electronic apparatus has a wiring board and connector units which are mounted at a case unit. The connector unit has an external connection surface connected with the external and a terminal installation surface, which is substantially flat and positioned at an opposite side to the external connection surface. A terminal of the connector unit is electrically connected with a pad positioned at a first surface of the wiring board via a connection member. The wiring board and the connector unit which are integrated are mounted at the case unit, with the first surface and the terminal installation surface facing the case unit. The case unit has an installation surface at which a recess for accommodating therein the connection member is arranged.

Abstract translation: 电子设备具有安装在壳体单元上的布线板和连接器单元。 连接器单元具有与外部连接的外部连接表面和终端安装表面，其基本平坦并且位于与外部连接表面相对的一侧。 连接器单元的端子经由连接构件与位于布线板的第一表面的焊盘电连接。 集成的布线板和连接器单元安装在壳体单元处，第一表面和端子安装表面面向壳体单元。 壳体单元具有安装表面，在该安装表面上设置用于容纳连接构件的凹部。

公开(公告)号：US07108399B2

公开(公告)日：2006-09-19

申请号：US10789003

申请日：2004-02-27

Applicant: Hiroshi Miyawaki ,  Masayuki Tamai ,  Ryohei Yamashita

Inventor： Hiroshi Miyawaki ,  Masayuki Tamai ,  Ryohei Yamashita

IPC: F21V29/00

CPC classification number: H04N1/02815 ,  F21K9/00 ,  F21V23/003 ,  H01L25/0753 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2224/4911 ,  H01L2224/73265 ,  H01L2924/19107 ,  H01L2924/3011 ,  H04N1/02865 ,  H04N2201/0404 ,  H05K1/0274 ,  H05K1/056 ,  H05K1/183 ,  H05K2201/09036 ,  H05K2201/09745 ,  H05K2201/10106 ,  H05K2201/2054 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A light source unit includes a substrate mounting a plurality of light emitting diodes (LED's) for irradiating beam to an object. The substrate is formed of a material having high heat conductivity and the unit includes a chip resistor mounted on the substrate and heat generation controller for heating the substrate with heat generated in the chip resistor upon supply of power to the chip resistor. The plural LED's are arranged in the form of an array on the substrate and a plurality of the chip resistors are arranged linearly along the array of LED's.

Abstract translation: 光源单元包括安装用于将光束照射到物体的多个发光二极管（LED）的基板。 基板由具有高导热性的材料形成，该单元包括安装在基板上的芯片电阻器和用于在向芯片电阻器供电时在芯片电阻器中产生的热量加热基板的发热控制器。 多个LED以阵列形式布置在基板上，并且多个芯片电阻器沿LED阵列线性布置。

公开(公告)号：US20060197198A1

公开(公告)日：2006-09-07

申请号：US11306354

申请日：2005-12-23

Applicant: Seng Guan Chow ,  Il Kwon Shim ,  Ming Ying ,  Byung Hoon Ahn

Inventor： Seng Guan Chow ,  Il Kwon Shim ,  Ming Ying ,  Byung Hoon Ahn

IPC: H01L23/495

CPC classification number: H01L21/568 ,  H01L21/56 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/49503 ,  H01L23/49548 ,  H01L23/49551 ,  H01L23/49575 ,  H01L23/49589 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L25/0657 ,  H01L25/16 ,  H01L25/50 ,  H01L2224/05554 ,  H01L2224/16245 ,  H01L2224/27013 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/32257 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/83051 ,  H01L2224/83192 ,  H01L2224/8385 ,  H01L2224/92247 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06582 ,  H01L2924/00014 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19103 ,  H01L2924/19105 ,  H01L2924/19106 ,  H05K3/202 ,  H05K3/3442 ,  H05K2201/09745 ,  H05K2201/10636 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A system is provided for an integrated circuit package including a leadframe with a lead finger. A groove is in a lead finger for a conductive bonding agent and a passive device is in the groove to be held by the conductive bonding agent.

Abstract translation: 提供了一种用于集成电路封装的系统，其包括具有引线指的引线框架。 凹槽位于用于导电粘合剂的引线指中，并且无源器件位于沟槽中以由导电粘合剂保持。

公开(公告)号：US20060124927A1

公开(公告)日：2006-06-15

申请号：US10905013

申请日：2004-12-09

Applicant: Robert Groves ,  Peter Gruber ,  Kevin Petrarca ,  Richard Volant ,  George Walker

Inventor： Robert Groves ,  Peter Gruber ,  Kevin Petrarca ,  Richard Volant ,  George Walker

IPC: H01L21/66 ,  H01L23/58

CPC classification number: H05K3/3468 ,  G01R1/07314 ,  G01R3/00 ,  H01L21/4853 ,  H01L21/6835 ,  H01L24/11 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01058 ,  H01L2924/01066 ,  H01L2924/01067 ,  H01L2924/01068 ,  H01L2924/01075 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/19041 ,  H01L2924/19042 ,  H05K3/325 ,  H05K2201/09745 ,  H05K2201/10734 ,  H05K2203/0113 ,  H05K2203/0338 ,  H05K2203/128 ,  H05K2203/162 ,  H05K2203/167 ,  H01L2224/0401

Abstract: Methods of forming a conductive structure on a substrate prior to packaging, and a test probe structure generated according to the method, are disclosed. The conductive structure includes a high aspect ratio structure formed by injected molded solder. The invention can be applied to form passive elements and interconnects on a conventional semiconductor substrate after the typical BEOL, and prior to packaging. The method may provide better electromigration characteristics, lower resistivity, and higher Q factors for conductive structures. In addition, the method is backwardly compatible and customizable.

Abstract translation: 公开了在封装之前在基板上形成导电结构的方法和根据该方法生成的测试探针结构。 导电结构包括通过注射成型的焊料形成的高纵横比结构。 本发明可以应用于在典型的BEOL之后以及在封装之前在常规半导体衬底上形成无源元件和互连。 该方法可以为导电结构提供更好的电迁移特性，较低的电阻率和更高的Q因子。 此外，该方法可以向后兼容并可定制。