公开(公告)号：US08263879B2

公开(公告)日：2012-09-11

申请号：US12614224

申请日：2009-11-06

Applicant: Gareth Hougham ,  Gerard McVicker ,  Xiaoxiong Gu ,  Sung K. Kang ,  Frank R. Libsch ,  Xiao H. Liu

Inventor： Gareth Hougham ,  Gerard McVicker ,  Xiaoxiong Gu ,  Sung K. Kang ,  Frank R. Libsch ,  Xiao H. Liu

IPC: H05K1/11

CPC classification number: H05K1/11 ,  H01R12/7082 ,  H01R12/714 ,  H01R13/2414 ,  H01R13/2421 ,  H01R43/16 ,  H05K3/326 ,  H05K3/4092 ,  H05K2201/0311 ,  H05K2201/10265 ,  H05K2201/10378 ,  Y10T29/49224 ,  Y10T29/49226

Abstract: A contact structure and assembly and a method for manufacturing the same for a microelectronics device includes first and second electrically conductive contacts being helically shaped. A carrier element is attached to and positioned between the first and second contacts. The first and second contacts are in electrical communication with each other, and the first and second contacts are in a mirror image relationship with each other. A pair of insulating substrates each include electrically conductive members. A contact point on each of the first and second contacts is attached and electrically communicating to respective electrically conductive members such that the first and second electrically conductive contacts between the pair of insulating substrates form an electrically conductive package. A metal layer on the carrier element provides electrical conductivity through a first opening defined by the carrier element between the first and second portions of the helix shaped contact.

Abstract translation: 接触结构和组件及其制造方法用于微电子器件包括第一和第二导电接触件，其为螺旋形的。 载体元件附接到并定位在第一和第二触点之间。 第一和第二触点彼此电连通，并且第一和第二触点彼此成镜像关系。 一对绝缘基板各自包括导电构件。 每个第一和第二触点上的接触点被附接并与相应的导电构件电连通，使得该对绝缘基板之间的第一和第二导电触点形成导电封装。 载体元件上的金属层通过由载体元件在螺旋形接触件的第一和第二部分之间限定的第一开口提供导电性。

公开(公告)号：US20120222891A1

公开(公告)日：2012-09-06

申请号：US13508974

申请日：2010-10-20

Applicant: Hisashi Ishida

Inventor： Hisashi Ishida

IPC: H05K1/03 ,  H05K3/10 ,  H05K1/09 ,  H05K1/11 ,  H05K1/16

CPC classification number: H05K1/0236 ,  H05K1/0233 ,  H05K1/141 ,  H05K2201/09727 ,  H05K2201/10265 ,  H05K2201/10704 ,  H05K2201/10734 ,  Y10T29/49155

Abstract: A first interconnect substrate includes a first conductor pattern. A second interconnect substrate includes a second conductor pattern. At least a portion of the second conductor pattern is formed in a region opposite the first conductor pattern. At least either the first conductor pattern or the second conductor pattern has a repeated structure. The first conductor pattern and the second conductor pattern constitute at least a portion of an electromagnetic band gap (EBG) structure.

Abstract translation: 第一互连基板包括第一导体图案。 第二互连基板包括第二导体图案。 第二导体图案的至少一部分形成在与第一导体图案相对的区域中。 第一导体图案或第二导体图案中的至少一个具有重复的结构。 第一导体图案和第二导体图案构成电磁带隙（EBG）结构的至少一部分。

公开(公告)号：US08139374B2

公开(公告)日：2012-03-20

申请号：US12412178

申请日：2009-03-26

Applicant: Yoshiaki Hiraoka

Inventor： Yoshiaki Hiraoka

IPC: H05K1/11

CPC classification number: H04M1/026 ,  H05K1/0233 ,  H05K1/148 ,  H05K2201/10265 ,  H05K2201/10287

Abstract: An electronic device is provided which makes it possible to reduce noise generated from a signal line around a connecting portion connecting a first body and a second body. The connecting portion has a first metallic portion. A first circuit board provided in the first body and a second circuit board provided in the second body. The signal line that electrically connects the first circuit board and the second circuit board via the connecting portion, in which the signal line is wound around the first metallic portion.

Abstract translation: 提供了一种电子设备，其可以减少由连接第一主体和第二主体的连接部分周围的信号线产生的噪音。 连接部分具有第一金属部分。 设置在第一主体中的第一电路板和设置在第二主体中的第二电路板。 所述信号线经由所述连接部分电连接所述第一电路板和所述第二电路板，其中所述信号线缠绕在所述第一金属部分上。

公开(公告)号：US20110111647A1

公开(公告)日：2011-05-12

申请号：US12614231

申请日：2009-11-06

Applicant: Gareth Hougham ,  Gerard McVicker ,  Xiaoxiong Gu

Inventor： Gareth Hougham ,  Gerard McVicker ,  Xiaoxiong Gu

IPC: H01R13/02 ,  H01R43/00

CPC classification number: H01L24/14 ,  H01L21/486 ,  H01L23/48 ,  H01L23/49827 ,  H01L24/11 ,  H01L24/17 ,  H01L24/81 ,  H01L25/50 ,  H01L2224/11622 ,  H01L2224/1182 ,  H01L2224/13014 ,  H01L2224/13017 ,  H01L2224/1607 ,  H01L2224/16145 ,  H01L2224/81101 ,  H01L2224/81208 ,  H01L2224/81899 ,  H01L2225/06513 ,  H01L2924/0002 ,  H01L2924/12042 ,  H01L2924/15313 ,  H01L2924/15323 ,  H01L2924/15333 ,  H01R13/02 ,  H01R13/2421 ,  H01R43/16 ,  H05K3/064 ,  H05K3/326 ,  H05K3/4092 ,  H05K2201/0355 ,  H05K2201/0382 ,  H05K2201/10265 ,  H05K2201/10378 ,  Y10T29/49126 ,  Y10T29/49208 ,  Y10T29/49218 ,  Y10T29/49222 ,  Y10T29/49224 ,  H01L2924/00

Abstract: A structure and method for manufacturing the same for manufacturing a contact structure for microelectronics manufacturing including the steps of forming first and second metal sheets to form a plurality of outwardly extending bump each defining a cavity. Symmetrically mating the first and second metal sheets in opposing relation to each other to form upper and lower bumps each defining an enclosure therebetween wherein the mated first and second sheets form a contact structure. Coating the contact structure with an insulating material, and fabricating helix shaped contacts from upper and lower bumps. The helix shaped contacts having first and second portions being in mirror image relationship to each other.

Abstract translation: 一种用于制造用于微电子制造的接触结构的结构和方法，包括以下步骤：形成第一和第二金属片以形成多个向外延伸的凸起，每个限定腔。 将第一和第二金属板彼此相对地对称地配合，以形成每个限定其间的外壳的上凸块和下凸块，其中配合的第一和第二板形成接触结构。 用绝缘材料涂覆接触结构，并从上部和下部凸块制造螺旋形接触。 具有彼此成镜像关系的第一和第二部分的螺旋形接触件。

公开(公告)号：US20110108316A1

公开(公告)日：2011-05-12

申请号：US12614224

申请日：2009-11-06

Applicant: Gareth Hougham ,  Gerard McVicker ,  Xiaoxiong Gu ,  Sung K. Kang ,  Frank R. Libsch ,  Xiao H. Liu

Inventor： Gareth Hougham ,  Gerard McVicker ,  Xiaoxiong Gu ,  Sung K. Kang ,  Frank R. Libsch ,  Xiao H. Liu

IPC: H05K1/11 ,  G03F7/20

CPC classification number: H05K1/11 ,  H01R12/7082 ,  H01R12/714 ,  H01R13/2414 ,  H01R13/2421 ,  H01R43/16 ,  H05K3/326 ,  H05K3/4092 ,  H05K2201/0311 ,  H05K2201/10265 ,  H05K2201/10378 ,  Y10T29/49224 ,  Y10T29/49226

Abstract: A contact structure and assembly and a method for manufacturing the same for a microelectronics device includes first and second electrically conductive contacts being helically shaped. A carrier element is attached to and positioned between the first and second contacts. The first and second contacts are in electrical communication with each other, and the first and second contacts are in a mirror image relationship with each other. A pair of insulating substrates each include electrically conductive members. A contact point on each of the first and second contacts is attached and electrically communicating to respective electrically conductive members such that the first and second electrically conductive contacts between the pair of insulating substrates form an electrically conductive package. A metal layer on the carrier element provides electrical conductivity through a first opening defined by the carrier element between the first and second portions of the helix shaped contact.

Abstract translation: 接触结构和组件及其制造方法用于微电子器件包括第一和第二导电接触件，其为螺旋形的。 载体元件附接到并定位在第一和第二触点之间。 第一和第二触点彼此电连通，并且第一和第二触点彼此成镜像关系。 一对绝缘基板各自包括导电构件。 每个第一和第二触点上的接触点被附接并与相应的导电部件电连通，使得该对绝缘基板之间的第一和第二导电触点形成导电封装。 载体元件上的金属层通过由载体元件在螺旋形接触件的第一和第二部分之间限定的第一开口提供导电性。

公开(公告)号：US07826024B2

公开(公告)日：2010-11-02

申请号：US11939607

申请日：2007-11-14

Applicant: Young-Min Lee

Inventor： Young-Min Lee

IPC: G02F1/1345 ,  G02F1/1333

CPC classification number: H05K3/325 ,  G02F1/13452 ,  H05K2201/10136 ,  H05K2201/10265

Abstract: Disclosed is an LCD module and a liquid crystal imaging means using the same. The LCD module includes an LCD panel, a circuit board on which the LCD panel is mounted, and a plurality of pogo pins electrically connected to the circuit board. The liquid crystal imaging means include an LCD module having a circuit board, an LCD panel seated on the circuit board, and a plurality of pogo pins electrically connected to the circuit board; and a main board having a plurality of contact members corresponding to the pogo pins so that the pogo pins are connected to respective contact members.

Abstract translation: 公开了一种LCD模块和使用该模块的液晶成像装置。 LCD模块包括LCD面板，安装有LCD面板的电路板和电连接到电路板的多个弹簧针。 液晶成像装置包括具有电路板的LCD模块，坐在电路板上的LCD面板和电连接到电路板的多个弹簧销; 以及具有与弹簧销对应的多个接触构件的主板，使得弹簧销连接到相应的接触构件。

公开(公告)号：US20100261499A1

公开(公告)日：2010-10-14

申请号：US12494318

申请日：2009-06-30

Applicant: KIM-YEUNG SIP

Inventor： KIM-YEUNG SIP

IPC: H04M1/00 ,  H05K7/14

CPC classification number: H05K1/0239 ,  H05K1/144 ,  H05K2201/1003 ,  H05K2201/10083 ,  H05K2201/10265

Abstract: An electronic device includes a main body and an audio module. The main body includes a first circuit board and a first coil. The first circuit board is configured for processing electrical signals. The first coil is electrically connected with the first circuit board, and configured to convert electrical signals with electromagnetic waves. The audio module includes a second circuit, a speaker, a microphone, and a second coil. The second circuit board is configured for processing electrical signals. The speaker is electrically connected with the second circuit board, and produces a sound according to electrical signals. The microphone is electrically connected with the second circuit board and configured to detect sound wave and generate electrical signals. The second coil is electrically connected with the second circuit board, and configured to convert electromagnetic waves with electrical signal.

Abstract translation: 电子设备包括主体和音频模块。 主体包括第一电路板和第一线圈。 第一个电路板被配置用于处理电信号。 第一线圈与第一电路板电连接，并且被配置为用电磁波转换电信号。 音频模块包括第二电路，扬声器，麦克风和第二线圈。 第二电路板被配置用于处理电信号。 扬声器与第二电路板电连接，并根据电信号产生声音。 麦克风与第二电路板电连接并被配置为检测声波并产生电信号。 第二线圈与第二电路板电连接，并且被配置为用电信号转换电磁波。

公开(公告)号：US20100079967A1

公开(公告)日：2010-04-01

申请号：US12412178

申请日：2009-03-26

Applicant: Yoshiaki HIRAOKA

Inventor： Yoshiaki HIRAOKA

IPC: H05K1/11

CPC classification number: H04M1/026 ,  H05K1/0233 ,  H05K1/148 ,  H05K2201/10265 ,  H05K2201/10287

Abstract: An electronic device is provided which makes it possible to reduce noise generated from a signal line around a connecting portion connecting a first body and a second body. The connecting portion has a first metallic portion. A first circuit board provided in the first body and a second circuit board provided in the second body. The signal line that electrically connects the first circuit board and the second circuit board via the connecting portion, in which the signal line is wound around the first metallic portion.

Abstract translation: 提供了一种电子设备，其可以减少由连接第一主体和第二主体的连接部分周围的信号线产生的噪音。 连接部分具有第一金属部分。 设置在第一主体中的第一电路板和设置在第二主体中的第二电路板。 所述信号线经由所述连接部分电连接所述第一电路板和所述第二电路板，其中所述信号线缠绕在所述第一金属部分上。

公开(公告)号：US07652894B2

公开(公告)日：2010-01-26

申请号：US11679177

申请日：2007-02-26

Applicant: Cheng-Lien Chiang

Inventor： Cheng-Lien Chiang

IPC: H05K7/10

CPC classification number: H05K3/32 ,  H05K1/141 ,  H05K3/308 ,  H05K3/3421 ,  H05K3/4015 ,  H05K2201/10265 ,  H05K2201/10318 ,  H05K2201/1059 ,  H05K2201/10946 ,  H05K2201/10962 ,  H05K2201/2036

Abstract: A contact lead for engaging with an aperture lead of a circuit carrier, including a substrate contact portion electrically connected to a pad on a substrate a chip contact portion extending from the substrate contact portion and forming an angle with the substrate contact portion raising from the substrate. The contact lead chip contact portion may also be of a cylindrical shape vertically extending from the substrate contact portion. The present invention also provides a module including a printed circuit board having a plurality of pad thereon ,the contact lead electrically connected to the pad, an integrated circuit carrier having a plurality of aperture leads, the aperture leads passing through the contact lead and contacting respectively thereof, and a housing structure for housing the module and providing access for the user to assemble the integrated circuit carrier.

Abstract translation: 一种用于与电路载体的孔径引线接合的接触引线，包括基板接触部分，电连接到基板上的焊盘，该芯片接触部分从基板接触部分延伸并与基板接触部分形成一角度， 。 接触引线芯片接触部分也可以是从基板接触部分垂直延伸的圆柱形形状。 本发明还提供了一种模块，其包括其上具有多个焊盘的印刷电路板，所述触点引线电连接到所述焊盘，集成电路载体，具有多个孔引线，所述孔引线分别穿过所述接触引线并分别接触 以及用于容纳模块并提供用于组装集成电路载体的接口的壳体结构。

公开(公告)号：US20090310313A1

公开(公告)日：2009-12-17

申请号：US12457522

申请日：2009-06-15

Applicant: Seong-chan HAN ,  Dong-woo SHIN ,  Hyun-jong OH ,  Nam-yong OH

Inventor： Seong-chan HAN ,  Dong-woo SHIN ,  Hyun-jong OH ,  Nam-yong OH

IPC: H05K7/20 ,  H05K7/10

CPC classification number: H05K1/0271 ,  H01L2924/0002 ,  H05K1/144 ,  H05K1/181 ,  H05K2201/0133 ,  H05K2201/10159 ,  H05K2201/10265 ,  H05K2201/10734 ,  H01L2924/00

Abstract: A semiconductor module including a module body and a shock absorbing member on an exposed surface of the module body is provided. The module body may include at least one semiconductor package on a substrate and the exposed surface of the module body may include exposed surfaces of the substrate and the at least one semiconductor package. In accordance with example embodiments, the module body may also include a heat transfer member on the at least one semiconductor package and an exposed surface of the module body may include an exposed surface of the heat transfer member.

Abstract translation: 提供了一种半导体模块，其包括在模块主体的暴露表面上的模块体和减震构件。 模块体可以包括在衬底上的至少一个半导体封装，并且模块体的暴露表面可以包括衬底和至少一个半导体封装的暴露表面。 根据示例实施例，模块主体还可以在至少一个半导体封装上包括传热构件，并且模块主体的暴露表面可以包括传热构件的暴露表面。