公开(公告)号：US20110176279A1

公开(公告)日：2011-07-21

申请号：US12827354

申请日：2010-06-30

Applicant: Sam Ziqun Zhao ,  Calvin Wong

Inventor： Sam Ziqun Zhao ,  Calvin Wong

IPC: H05K7/20 ,  H05K3/10

CPC classification number: H05K9/0022 ,  H01L21/4878 ,  H01L23/3675 ,  H01L23/4093 ,  H01L23/552 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H05K1/0203 ,  H05K1/0218 ,  H05K2201/10371 ,  Y10T29/49128 ,  H01L2924/00

Abstract: A printed circuit board (PCB) assembly is provided that includes a PCB, an integrated circuit package, an electromagnetic interference (EMI) shield ring, and a heat sink lid. A first surface of the package is mounted to a first surface of the PCB. The EMI shield ring is mounted to the first surface of the PCB in a ring around the package. A first surface of the heat sink lid includes a recessed region and first and second supporting portions separated by the recessed region. The heat sink lid is mated with the EMI shield ring such that the package is positioned in an enclosure formed by the EMI shield ring and the recessed region of the heat sink lid. A second surface of the package may interface with a surface of the recessed region.

Abstract translation: 提供了一种印刷电路板（PCB）组件，其包括PCB，集成电路封装，电磁干扰（EMI）屏蔽环和散热器盖。 封装的第一表面安装到PCB的第一表面。 EMI屏蔽环以围绕封装的环安​​装到PCB的第一表面。 散热器盖的第一表面包括凹陷区域和由凹陷区域分开的第一和第二支撑部分。 散热器盖与EMI屏蔽环配合，使得封装被定位在由EMI屏蔽环和散热器盖的凹陷区域形成的外壳中。 封装的第二表面可以与凹陷区域的表面相接触。

公开(公告)号：US20110090664A1

公开(公告)日：2011-04-21

申请号：US12995696

申请日：2009-04-28

Applicant: Yukihiro Sumida ,  Toshiteru Nakawaki

Inventor： Yukihiro Sumida ,  Toshiteru Nakawaki

IPC: H05K9/00

CPC classification number: H05K9/0026 ,  H05K1/111 ,  H05K3/341 ,  H05K2201/094 ,  H05K2201/10371 ,  Y02P70/611 ,  Y02P70/613

Abstract: In a shield case mounting substrate, a downwardly extending portion of a shield case is solder-bonded to a first land pattern and a second land pattern which are provided on the surface of a substrate. The width of the first land pattern in the thickness direction of the downwardly extending portion is greater than the width of the second land pattern in the thickness direction of the downwardly extending portion. Consequently, the high bonding strength between the shield case and the substrate can be ensured, and the positioning accuracy of the shield case on the substrate can also be ensured.

Abstract translation: 在屏蔽壳体安装基板中，屏蔽壳体的向下延伸部分焊接到设置在基板表面上的第一焊盘图案和第二焊盘图案。 第一焊盘图案在向下延伸部分的厚度方向上的宽度大于第二焊盘图案在向下延伸部分的厚度方向上的宽度。 因此，可以确保屏蔽壳与基板之间的高粘合强度，并且还可以确保屏蔽壳在基板上的定位精度。

公开(公告)号：US07902656B2

公开(公告)日：2011-03-08

申请号：US12769207

申请日：2010-04-28

Applicant: Shinji Moriyama ,  Tomio Yamada

Inventor： Shinji Moriyama ,  Tomio Yamada

IPC: H01L23/52 ,  H01L23/48 ,  H01L23/04 ,  H01L23/053 ,  H01L23/12 ,  H01L29/40 ,  H01L29/76 ,  H01L29/94 ,  H01L31/062 ,  H01L31/113 ,  H01L31/119 ,  H01L27/10 ,  H01L29/73

CPC classification number: H01L23/13 ,  H01L23/10 ,  H01L23/3121 ,  H01L23/3677 ,  H01L23/49811 ,  H01L23/49838 ,  H01L23/49894 ,  H01L23/50 ,  H01L23/66 ,  H01L24/48 ,  H01L24/73 ,  H01L25/165 ,  H01L2224/32225 ,  H01L2224/451 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/09701 ,  H01L2924/1305 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/3025 ,  H03G3/3042 ,  H05K1/0263 ,  H05K1/141 ,  H05K1/183 ,  H05K3/3405 ,  H05K3/3436 ,  H05K3/3452 ,  H05K2201/099 ,  H05K2201/09909 ,  H05K2201/10371 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

Abstract: A hybrid integrated circuit device having high mount reliability comprises a module substrate which is a ceramic wiring substrate, a plurality of electronic component parts laid out on the main surface of the module substrate, a plurality of electrode terminals laid out on the rear surface of the module substrate, and a cap which is fixed to the module substrate to cover the main surface of the module substrate. The electrode terminals include a plurality of electrode terminals which are aligned along the edges of the module substrate and power voltage supply terminals which are located inner than these electrode terminals. The electrode terminals aligned along the substrate edges are coated, at least in their portions close to the substrate edge, with a protection film having a thickness of several tens micrometers or less. Connection reinforcing terminals consist of a plurality of divided terminals which are independent of each other, and are ground terminals.

Abstract translation: 具有高安装可靠性的混合集成电路装置包括：模块基板，其是陶瓷布线基板，布置在模块基板的主表面上的多个电子部件部件，布置在模块基板的后表面上的多个电极端子 模块基板和固定到模块基板以覆盖模块基板的主表面的盖。 电极端子包括沿着模块基板的边缘排列的多个电极端子和位于内部的电源电压端子。 沿着基板边缘排列的电极端子至少在其靠近基板边缘的部分中涂覆有几十微米或更小的厚度的保护膜。 连接加强端子由彼此独立的多个分开的端子组成，并且是接地端子。

公开(公告)号：US20110028191A1

公开(公告)日：2011-02-03

申请号：US12533119

申请日：2009-07-31

Applicant: Qian Huang ,  Rongrong Zhang ,  Yihong Qi ,  Perry Jarmuszewski

Inventor： Qian Huang ,  Rongrong Zhang ,  Yihong Qi ,  Perry Jarmuszewski

IPC: H04M1/00

CPC classification number: H04R1/08 ,  H01Q1/243 ,  H01Q1/44 ,  H01Q9/0421 ,  H04M1/03 ,  H04M1/035 ,  H05K1/0259 ,  H05K2201/10083 ,  H05K2201/10371

Abstract: A mobile communications device having an antenna partly formed from an electrostatic discharge shield covering a microphone. The antenna includes a radiator arm extending from the electrostatic discharge shield and includes a feed element connecting the electrostatic discharge shield to a signal trace. To the extent the microphone employs an acoustic tube to form an acoustic pathway between the device casing and the microphone, the radiator arm of the antenna may be arranged over the acoustic tube.

Abstract translation: 一种移动通信设备，其具有由覆盖麦克风的静电放电屏蔽部分地形成的天线。 天线包括从静电放电屏蔽延伸的散热器臂，并且包括将静电放电屏蔽连接到信号迹线的馈电元件。 在麦克风采用声管以在器件壳体和麦克风之间形成声学路径的程度上，天线的辐射臂可以布置在声管上。

公开(公告)号：US20100319948A1

公开(公告)日：2010-12-23

申请号：US12487784

申请日：2009-06-19

Applicant: Benjamin Jon Vander Ploeg ,  Meredith Marie Steenwyk ,  Danny Weldon Coxon ,  Paul James Horton ,  John Jay Streyle

Inventor： Benjamin Jon Vander Ploeg ,  Meredith Marie Steenwyk ,  Danny Weldon Coxon ,  Paul James Horton ,  John Jay Streyle

IPC: H02G13/00

CPC classification number: H05K9/0045 ,  H02G13/00 ,  H05K7/20545 ,  H05K9/0062 ,  H05K9/0084 ,  H05K2201/10371

Abstract: An avionics chassis comprises a composite housing, a radio wave shield, and a lightning strike conductive path, wherein the radio wave shield attenuates electromagnetic interference entering and leaving the housing, and the lightning strike conductive path directs the current from a lightning strike away from an interior of the housing.

Abstract translation: 航空电子底盘包括复合壳体，无线电波屏蔽和雷击导电路径，其中无线电波屏蔽减弱进入和离开壳体的电磁干扰，并且雷击导电路径将电流从雷击远离 房屋内部。

公开(公告)号：US07786721B2

公开(公告)日：2010-08-31

申请号：US12006543

申请日：2008-01-03

Applicant: Min-Gu Kim ,  Young-Soo An ,  Ho-Jeong Choi ,  Jung-Hyeon Kim

Inventor： Min-Gu Kim ,  Young-Soo An ,  Ho-Jeong Choi ,  Jung-Hyeon Kim

IPC: G01R31/28 ,  G01R31/26

CPC classification number: G01R31/2851 ,  G01R1/04 ,  H05K1/144 ,  H05K1/148 ,  H05K2201/042 ,  H05K2201/09972 ,  H05K2201/10371

Abstract: There is provided a multilayer type test board assembly for high-precision inspection. The multilayer test board assembly comprises: a plurality of test boards separated from each other according to their functions, having input/output signal terminals, and including at least one test board each having a first section where first mounting devices sensitive to an influence of electrical signals are mounted and a second section where second mounting devices insensitive to an influence of electrical signals are mounted; spacers that arrange the test boards in parallel by spacing apart the test boards by predetermined intervals; connection cables connected to the input/output signal terminals of the test boards; and a signal shielding fence formed on each of the at least one test board so as to protect the first mounting devices from electrical signals generated by the second mounting devices.

Abstract translation: 提供了一种用于高精度检测的多层型测试板组件。 多层测试板组件包括：根据功能彼此分离的多个测试板，具有输入/输出信号端子，并且包括至少一个测试板，每个测试板具有第一部分，其中第一安装装置对电气的影响敏感 信号被安装，并且第二部分安装对电信号的影响不敏感的第二安装装置; 间隔件通过以预定的间隔隔开测试板来平行布置测试板; 连接电缆连接到测试板的输入/输出信号端子; 以及形成在所述至少一个测试板中的每一个上的信号屏蔽栅栏，以便保护所述第一安装装置免受由所述第二安装装置产生的电信号。

公开(公告)号：US20100206617A1

公开(公告)日：2010-08-19

申请号：US12372147

申请日：2009-02-17

Applicant: George A. Johnson ,  Jeffrey K. Rowe ,  James S. Hong ,  Manochehr Timajchy

Inventor： George A. Johnson ,  Jeffrey K. Rowe ,  James S. Hong ,  Manochehr Timajchy

IPC: H05K1/03 ,  B05D5/12

CPC classification number: H05K1/0221 ,  H05K3/341 ,  H05K3/429 ,  H05K2201/09036 ,  H05K2201/0949 ,  H05K2201/09981 ,  H05K2201/10371

Abstract: A substrate has a first dielectric layer; a first conductive layer on the first dielectric layer; a second dielectric layer on the first conductive layer; an elongated signal conductor embedded within the second dielectric layer; a second conductive layer on the second dielectric layer; a first conductive groove and second conductive groove through the second conductive layer, the second dielectric layer, the first conductive layer and into the first dielectric layer and extending continuously along the length of and on opposing sides of the signal conductor, the grooves having conductive side walls providing an electrical connection between the first conductive layer and the second conductive layer; first and second conductive end walls joining the first groove and second groove; and at least one insulating area through at least one of the first and second conductive layers to provide conductor access.

Abstract translation: 衬底具有第一介电层; 第一介电层上的第一导电层; 在所述第一导电层上的第二电介质层; 嵌入第二电介质层内的细长信号导体; 第二介电层上的第二导电层; 通过第二导电层，第二介电层，第一导电层和第一电介质层的第一导电槽和第二导电槽，并且沿着信号导体的长度和相对侧连续延伸，沟槽具有导电侧 在第一导电层和第二导电层之间提供电连接的壁; 连接第一槽和第二槽的第一和第二导电端壁; 以及通过第一和第二导电层中的至少一个的至少一个绝缘区域以提供导体接入。

公开(公告)号：US20100183181A1

公开(公告)日：2010-07-22

申请号：US12689283

申请日：2010-01-19

Applicant: Yunlong Wang

Inventor： Yunlong Wang

IPC: H04R1/02 ,  H01R43/00

CPC classification number: H04R19/005 ,  H01L2924/15151 ,  H01L2924/16151 ,  H05K1/0243 ,  H05K3/341 ,  H05K2201/10083 ,  H05K2201/10371 ,  H05K2201/10969 ,  Y10T29/49117

Abstract: MEMS microphone packages and fabrication methods thereof are disclosed. A MEMS microphone package includes a cavity that houses a MEMS sensing element, an IC chip and other passive elements supported by a common substrate. The cavity is formed by a top cover member, a housing wall surrounds and supports the top cover member and the common substrate supports the housing wall. A conductive casing encloses and surrounds the cavity, and is electrically connected to a common analog ground lead on a PCB board. The top cover member and the housing wall are non-conductive. And the conductive casing is not connected directly to the ground leads of the package. An acoustic absorption layer is sandwiched between the conductive casing and the cavity which is formed by the top cover member, the housing wall and the substrate.

Abstract translation: 公开了MEMS麦克风封装及其制造方法。 MEMS麦克风封装包括容纳MEMS感测元件，IC芯片和由公共基板支撑的其它无源元件的空腔。 空腔由顶盖构件形成，壳体壁围绕并支撑顶盖构件，并且公共衬底支撑壳体壁。 导电外壳包围并围绕空腔，并且电连接到PCB板上的公共模拟接地引线。 顶盖构件和外壳壁不导电。 并且导电套管不直接连接到封装的接地引线。 声吸收层被夹在导电壳体和由顶盖构件，壳体壁和基底形成的空腔之间。

公开(公告)号：US20100155125A1

公开(公告)日：2010-06-24

申请号：US12641934

申请日：2009-12-18

Applicant: Masato Harikae

Inventor： Masato Harikae

IPC: H05K1/18 ,  H05K9/00

CPC classification number: H05K3/305 ,  H01L21/563 ,  H01L23/3114 ,  H01L23/552 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01057 ,  H04M1/0277 ,  H05K3/3436 ,  H05K2201/10371 ,  H05K2201/10734 ,  H05K2201/10977 ,  H05K2203/1178 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2224/0401

Abstract: An electronic circuit device comprising an attaching material between an electronic component and a circuit board is disclosed. A bonding resin is situated on a side of an electronic component and flowed between the electronic component and a circuit board. The flow action may be facilitated by thermoplasticity and capillary action.

Abstract translation: 公开了一种电子电路装置，其包括在电子部件和电路板之间的附接材料。 接合树脂位于电子部件的一侧，并且在电子部件和电路板之间流动。 可以通过热塑性和毛细作用促进流动作用。

公开(公告)号：US07729131B2

公开(公告)日：2010-06-01

申请号：US11650122

申请日：2007-01-05

Applicant: Erik L. Wang ,  Louie Sangunietti

Inventor： Erik L. Wang ,  Louie Sangunietti

IPC: H05K9/00

CPC classification number: H05K1/144 ,  H05K1/18 ,  H05K7/1417 ,  H05K9/005 ,  H05K2201/042 ,  H05K2201/10371 ,  H05K2201/2018

Abstract: Electronic devices can be provided with at least one first circuit component coupled to a first circuit board, at least one second circuit component coupled to a second circuit board, and a mating assembly coupled to the boards for holding them in a vertical stack. The first circuit components can face the second circuit components in the stack. One or more of the first circuit components can be horizontally offset from one or more of the second circuit components in the stack to reduce the thickness of the mated circuit boards. Portions of the circuit boards and the mating assembly can shield the circuit components of the stack from electromagnetic interference.

Abstract translation: 电子设备可以设置有耦合到第一电路板的至少一个第一电路部件，耦合到第二电路板的至少一个第二电路部件，以及耦合到板的配合组件，用于将它们保持在垂直堆叠中。 第一个电路组件可以面对堆叠中的第二个电路组件。 第一电路部件中的一个或多个可以与堆叠中的一个或多个第二电路部件水平地偏移，以减小配对电路板的厚度。 电路板和配对组件的部分可以屏蔽堆叠的电路部件免受电磁干扰。