公开(公告)号：US20080135394A1

公开(公告)日：2008-06-12

申请号：US11567862

申请日：2006-12-07

Applicant: Robert Wayne Walker

Inventor： Robert Wayne Walker

IPC: H01H1/14

CPC classification number: H01H1/403 ,  H05K3/222 ,  H05K3/308 ,  H05K2201/10053 ,  H05K2201/10787

Abstract: A switch system for use with a printed circuit board is provided. The switch system includes: a switch base; an anti-overstress member or feature formed in the switch base; a plurality of retention legs formed in the base for retaining a printed circuit board, wherein a first via is in electrical communication with one of the plurality of retention legs; a spring-loaded contact formed in the base for contacting the anti-overstress feature, and wherein a second via is in electrical communication with the spring-loaded contact. A printed circuit board may be mounted in and attached to the plurality of retention legs.

Abstract translation: 提供了一种与印刷电路板一起使用的开关系统。 开关系统包括：开关座; 形成在开关基座中的防过度构件或特征; 形成在所述基座中用于保持印刷电路板的多个保持腿，其中第一通孔与所述多个保持腿中的一个电连通; 形成在所述基座中用于接触所述防过载特征的弹簧加载的触点，并且其中第二通孔与所述弹簧加载的触点电连通。 印刷电路板可以安装在多个保持腿中并附接到多个保持腿。

公开(公告)号：US20070057361A1

公开(公告)日：2007-03-15

申请号：US11552803

申请日：2006-10-25

Applicant: Bernhard Lange ,  William Boyd

Inventor： Bernhard Lange ,  William Boyd

IPC: H01L23/48 ,  H01L21/00

CPC classification number: H05K3/308 ,  H01L23/49555 ,  H01L24/49 ,  H01L2224/49175 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01079 ,  H01L2924/14 ,  H05K2201/10689 ,  H05K2201/10787 ,  H05K2201/10871 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: An integrated circuit (IC) package that comprises a lead frame. The lead frame has a downset portion and leads. The downset portion has an exterior surface that is configured to face away from a mounting board, and an interior surface that is configured to face towards the mounting board. The leads are bent away from the exterior surface, and each of the leads have a first end coupled to an IC and a second end configured to pass through one of a plurality of mounting holes extending through the mounting board. The IC is coupled to the interior surface.

Abstract translation: 一种包括引线框架的集成电路（IC）封装。 引线框架具有欠压部分和引线。 凹陷部分具有被配置为远离安装板的外表面和被配置为面向安装板的内表面。 引线从外表面弯曲，并且每个引线具有联接到IC的第一端和被配置为穿过延伸穿过安装板的多个安装孔中的一个的第二端。 IC耦合到内表面。

公开(公告)号：USRE39272E1

公开(公告)日：2006-09-12

申请号：US10235051

申请日：2002-09-05

Applicant: Josef Loibl ,  Ulf Scheuerer ,  Frank Franzen

Inventor： Josef Loibl ,  Ulf Scheuerer ,  Frank Franzen

IPC: H05K5/06

CPC classification number: H05K5/0082 ,  H05K1/0393 ,  H05K3/0061 ,  H05K3/308 ,  H05K3/326 ,  H05K2201/091 ,  H05K2201/1059 ,  H05K2201/10787

Abstract: A controller for a motor vehicle has a base plate, a conductor track substrate fitted on the base plate, an electronic circuit and a housing cover which is connected to the base plate in a contact region and is made of plastic. The housing cover furthermore encases electrical conductors. One conductor end of an electrical conductor projects out of the housing cover in a contact region and projects into an opening in the base plate, by which an electrical connection is produced with the conductor track substrate.

Abstract translation: 用于机动车辆的控制器具有基板，安装在基板上的导体轨道基板，电子电路和壳体盖，其在接触区域中与基板连接并由塑料制成。 外壳盖还包括电导体。 电导体的一个导体端部在接触区域中突出到外壳盖之外并突出到基板中的开口中，通过该开口与导体轨道基板一起产生电连接。

公开(公告)号：US20050130463A1

公开(公告)日：2005-06-16

申请号：US10968066

申请日：2004-10-20

Applicant: Hiromichi Watanabe ,  Yoshifumi Fukatsu ,  Yasuo Nishioka

Inventor： Hiromichi Watanabe ,  Yoshifumi Fukatsu ,  Yasuo Nishioka

IPC: H01R4/18 ,  H01R12/00 ,  H01R43/16 ,  H05K3/30

CPC classification number: H01R12/58 ,  H05K3/308 ,  H05K2201/0979 ,  H05K2201/1059 ,  H05K2201/10787

Abstract: A pressfit terminal is to be inserted into a through hole defined in a substrate for electrically contacting with the through hole. The pressfit terminal includes a terminal main body and at least three protrusion portions. The at least three protrusion portions protrude outwardly from a surface of the terminal main body. At least part of the protrusion portions are arranged at intervals in a direction intersecting with an insertion direction of the terminal main body.

Abstract translation: 压接端子被插入到限定在基板中的通孔中，以与通孔电接触。 压配端子包括端子主体和至少三个突出部。 所述至少三个突起部从所述端子主体的表面向外突出。 突出部的至少一部分在与端子主体的插入方向相交的方向上间隔地配置。

公开(公告)号：US06677707B1

公开(公告)日：2004-01-13

申请号：US09612163

申请日：2000-07-08

Applicant: Thomas Dietiker

Inventor： Thomas Dietiker

IPC: H01L3300

CPC classification number: H05K3/3426 ,  H01L33/62 ,  H01L2224/48095 ,  H01L2224/48247 ,  H01L2924/01012 ,  H01L2924/01077 ,  H01L2924/12041 ,  H01L2924/181 ,  H05K2201/10106 ,  H05K2201/10462 ,  H05K2201/10651 ,  H05K2201/10787 ,  Y02P70/613 ,  Y10S362/80 ,  H01L2924/00012

Abstract: A unique side mounted LED and side sensing photo-transistor with free-end contacts, useful for thin profile side and back lighting and low-profile touch screen photo-circuits, and a method of manufacturing the side mounted side emitting or sensing photo circuit components.

Abstract translation: 独特的侧面安装的LED和具有自由端触点的侧面感测光电晶体管，用于薄型侧面和背面照明以及低调触摸屏光电路，以及制造侧面安装侧发射或感测光电路部件的方法 。

公开(公告)号：US06593523B2

公开(公告)日：2003-07-15

申请号：US09883946

申请日：2001-06-20

Applicant: Masaaki Okada ,  Hitoshi Matsudaira

Inventor： Masaaki Okada ,  Hitoshi Matsudaira

IPC: H05K900

CPC classification number: H05K9/0028 ,  H05K3/341 ,  H05K2201/10371 ,  H05K2201/10787 ,  H05K2201/10795 ,  Y02P70/613 ,  Y10S174/35

Abstract: The invention provides a shield structure that allows an easy installment of a shield case on a circuit board with more strength and firmness even if the shield case is warped or distorted. The proposed shield case includes a frame member consisting of four sidewalls and a cover member covering a farther end of the frame member from the circuit board. The frame member comprises a supporting member for sustaining the frame member on the circuit board and end faces confronting the circuit board. The supporting member comprises three projections protruding from the end face toward the circuit board.

Abstract translation: 本发明提供了一种屏蔽结构，即使屏蔽壳体翘曲或变形，也能够在电路板上容易地安装屏蔽壳体，并具有更强的强度和坚固性。 所提出的屏蔽壳包括由四个侧壁构成的框架构件和覆盖框架构件与电路板的更远端的盖构件。 框架构件包括用于维持电路板上的框架构件的支撑构件和面对电路板的端面。 支撑构件包括从端面朝向电路板突出的三个突起。

公开(公告)号：US06543676B2

公开(公告)日：2003-04-08

申请号：US09873616

申请日：2001-06-04

Applicant: I-Chung Tung ,  Shih-Ping Hsu

Inventor： I-Chung Tung ,  Shih-Ping Hsu

IPC: B23K3102

CPC classification number: H05K3/3421 ,  H01L21/4853 ,  H01L23/49811 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/49109 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15312 ,  H01L2924/1532 ,  H01L2924/181 ,  H05K3/3426 ,  H05K3/3452 ,  H05K2201/09036 ,  H05K2201/09472 ,  H05K2201/0989 ,  H05K2201/10318 ,  H05K2201/10787 ,  Y02P70/613 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A pin attachment method for mounting the pins on a wiring substrate for fabricating a pin grid array package is disclosed. There is provided an organic wiring board including a surface bearing electrical circuitry which includes at least one contact pad for receiving a pin. A solder mask layer which is placed on the board surface and patterned to expose the pad. The solder mask layer which does not cover any portion of the pad and forms a well by the perimeter of the solder mask layer around the pad. Subsequently, a pin and a solder material which are placed over said pad in the well. The pin which is soldered to the pad by a temperature sufficient to melt the solder material.

公开(公告)号：US5552951A

公开(公告)日：1996-09-03

申请号：US461133

申请日：1995-06-05

Applicant: Nicholas F. Pasch ,  William Gascoyne

Inventor： Nicholas F. Pasch ,  William Gascoyne

IPC: H01L23/60 ,  H01T4/08 ,  H05K1/02 ,  H05K3/30 ,  H02H3/22

CPC classification number: H01L23/60 ,  H01T4/08 ,  H05K1/026 ,  H01L2924/0002 ,  H05K2201/10689 ,  H05K2201/10787 ,  H05K3/308

Abstract: A semiconductor circuit package includes features forming an electrostatic charge distribution network having nodes which are defined by the electrical contact leads of the package for the semiconductor circuit, and which are effectively connected with one another by spark-gaps. In one embodiment electrical leads of the package are provided with pointed protrusions lying in the plane of the electrical leads. Accordingly, an inadvertent electrostatic discharge is distributed throughout the semiconductor circuit at safe voltage levels determined by the characteristics of the spark gaps of the charge distribution network.

公开(公告)号：US5240422A

公开(公告)日：1993-08-31

申请号：US904977

申请日：1992-06-26

Applicant: Tetsuya Kobayashi ,  Kenjirou Katabuchi ,  Toshinori Yoshino

Inventor： Tetsuya Kobayashi ,  Kenjirou Katabuchi ,  Toshinori Yoshino

IPC: H01R13/40 ,  H01R12/55 ,  H01R13/41 ,  H05K1/11 ,  H05K3/30

CPC classification number: H05K3/308 ,  H01R13/41 ,  H01R12/585 ,  H01R12/716 ,  H05K1/115 ,  H05K2201/09709 ,  H05K2201/10189 ,  H05K2201/10757 ,  H05K2201/10787 ,  H05K2201/10878

Abstract: A connector including an insulating main body through which numerous holes are formed in three arrays, the main body having numerous contactor pins inserted through the holes. The contactor pins are either first cranked pins whose folded portions are relatively long or second cranked pins whose folded portions are relatively short. In the first and third arrays, the first and second pins are alternately arranged, and all the pins in each of these arrays lie on the side of each array opposite the second array. The second array includes only the second pins and they are located in the second array arranged so that the folded portions of the pins alternately lie at the side of the first and third arrays. Even if the pitch of the holes of each array is reduced, an array of rectilinear portions of the second pins of increased pitch can be formed on both sides of the second array. The connector can be used with a socket having a standard contactor member when it is used in a back harness arrangement.

Abstract translation: 一种连接器，包括绝缘主体，多个孔以三个阵列形成，主体具有穿过孔插入的多个接触销。 接触器销是折叠部分相对较长的第一曲柄销或折叠部分相对较短的第二曲柄销。 在第一和第三阵列中，第一和第二引脚交替布置，并且这些阵列中的每一个中的所有引脚位于与第二阵列相对的每个阵列的一侧。 第二阵列仅包括第二引脚，并且它们位于第二阵列中，其布置成使得引脚的折叠部分交替地位于第一和第三阵列的侧面。 即使每个阵列的孔的间距减小，可以在第二阵列的两侧上形成增加间距的第二销的直线部分的阵列。 当连接器用于背带安排时，该连接器可以与具有标准接触器构件的插座一起使用。

公开(公告)号：US4951124A

公开(公告)日：1990-08-21

申请号：US346353

申请日：1989-04-28

Applicant: Hiromichi Sawaya

Inventor： Hiromichi Sawaya

IPC: H01L23/50 ,  H01L23/34 ,  H01L23/433 ,  H01L23/495 ,  H05K1/02 ,  H05K1/18 ,  H05K3/30 ,  H05K3/34 ,  H05K7/20

CPC classification number: H01L23/49548 ,  H01L23/4334 ,  H05K3/308 ,  H01L2924/0002 ,  H05K1/0201 ,  H05K2201/066 ,  H05K2201/09709 ,  H05K2201/0979 ,  H05K2201/10696 ,  H05K2201/10787 ,  H05K2201/10856 ,  H05K2201/10871 ,  H05K3/3447

Abstract: A single in line type semiconductor device is disclosed which has a plurality of lead-in wires extending from a package. In this semiconductor device, a heat sink is embedded in one surface of the package and an appropriate number of lead-in wires are bent on the other surface side of the package, to provide an offset array of the lead-in wires arranged in two rows. A projection is formed on the above appropriate number of lead-in wires on one surface side of the package, such that it extends in a direction perpendicular to that in which the lead-in wires extend. In this semi-conductor device, when the external lead-in wires are inserted into, and joined by means of soldering to a printed circuit board, the package is prevented from being inclined toward the heat sink side by the projection of the external lead-in wire, so that it may be set upright relative to the printed circuit board.

Abstract translation: 公开了一种在线型半导体器件，其具有从封装延伸的多个引入线。 在该半导体器件中，散热器嵌入在封装的一个表面中，并且适当数量的引入线在封装的另一个表面侧弯曲，以提供布置在两个中的引入线的偏移阵列 行。 在包装的一个表面侧的上述合适数量的引入线上形成突起，使得其沿与引入线延伸的方向垂直的方向延伸。 在这种半导体器件中，当外部引入线插入印刷电路板并通过焊接连接到印刷电路板时，通过外部引线装置的突出部防止封装向散热器侧倾斜， 在线中，使得其可以相对于印刷电路板竖立。