公开(公告)号：US20210027908A1

公开(公告)日：2021-01-28

申请号：US17041074

申请日：2019-03-25

Applicant: AI SILK CORPORATION

Inventor： Hideo Okano ,  Asuka Oikawa

IPC: H01B1/12 ,  C09D5/24 ,  C09D165/00 ,  C09D7/20 ,  C08G61/12 ,  D06M15/63

Abstract: To provide a conductive polymer conductor that enables improvement of wash durability and conductivity and a method for manufacturing the same. A conductive polymer conductor has a conductive polymer adhered to a substrate and can be used, for example, as a conductive polymer electrode. Poly(3,4-ethylenedioxythiophene) can be cited as a preferable example of the conductive polymer. The conductive polymer is low-crystalline with low crystallinity and is thereby made capable of being adhered uniformly to the substrate and improving adhesion to the substrate.

公开(公告)号：US20170283646A1

公开(公告)日：2017-10-05

申请号：US15392293

申请日：2016-12-28

Applicant: AI SILK CORPORATION

Inventor： Hideo Okano ,  Satoshi Watanabe

IPC: C09D165/00 ,  B05D3/02 ,  B05C9/12 ,  B05B9/01 ,  B05C9/10 ,  C09D5/24 ,  B05D3/10

CPC classification number: C09D165/00 ,  A61B5/00 ,  B05B9/01 ,  B05C9/10 ,  B05C9/12 ,  B05D1/26 ,  B05D1/36 ,  B05D3/0218 ,  B05D3/104 ,  B05D3/107 ,  B05D5/12 ,  B05D2401/10 ,  B05D2401/31 ,  B41J11/0015 ,  C09D5/24 ,  D06M15/15 ,  H01B1/12

Abstract: A problem is to provide a method and a device for producing a conductive polymer conductor according to which a conductive polymer cm be easily adhered to a base material with high accuracy. A solution is a production device 10 equipped with a heating means 11 for heating a base material 22, a raw material application means 12 for applying, to the base material 22, a raw material solution containing a monomer of the conductive polymer, and a producing solution application means 13 for applying, to the base material 22, a producing solution containing an oxidizing agent for promoting polymerization of the monomer, a dopant for developing electrical conductivity in the conductive polymer, and a viscosity improver for improving viscosity. The raw material solution is applied thereto after heating the base material 22 or while heating the base material 22, and then the producing solution is applied thereto.