公开(公告)号：US20150382459A1

公开(公告)日：2015-12-31

申请号：US14751400

申请日：2015-06-26

Applicant: Shih-Chuan Tsai ,  Ching-Chang Yang

Inventor： Shih-Chuan Tsai ,  Ching-Chang Yang

IPC: H05K1/02 ,  H05K3/46 ,  H05K3/10 ,  H05K3/14 ,  H05K1/11 ,  H05K3/00

CPC classification number: H05K3/4664 ,  H05K3/125 ,  H05K3/1258 ,  H05K3/4069 ,  H05K3/4617 ,  H05K3/462 ,  H05K3/465 ,  H05K2201/09845 ,  H05K2203/1572

Abstract: The present disclosure provides a printed circuit board and a method for fabricating the same, and an apparatus for fabricating printed circuit board. The printed circuit board includes a substrate having an upper surface; a first trench in the upper surface of the substrate; a first via formed in the first trench and penetrating through the substrate; and a first conductive layer disposed in the first trench and the first via, the first trench is electrically connect to the first via. A method for fabricating the printed circuit board and an apparatus for fabricating the printed circuit board is also provided.

Abstract translation: 本公开提供了一种印刷电路板及其制造方法，以及一种用于制造印刷电路板的装置。 印刷电路板包括具有上表面的基板; 在衬底的上表面中的第一沟槽; 形成在第一沟槽中并穿透基板的第一通孔; 以及设置在所述第一沟槽和所述第一通孔中的第一导电层，所述第一沟槽电连接到所述第一通孔。 还提供了制造印刷电路板的方法和用于制造印刷电路板的装置。

公开(公告)号：US20100215875A1

公开(公告)日：2010-08-26

申请号：US12501570

申请日：2009-07-13

Applicant: Ching-Chang YANG ,  Mao-Feng Hsu ,  Yu-Chiao Chung

Inventor： Ching-Chang YANG ,  Mao-Feng Hsu ,  Yu-Chiao Chung

IPC: B32B7/04 ,  B32B37/02

CPC classification number: B41M7/0027 ,  B32B37/12 ,  B32B38/145 ,  B32B2310/0831 ,  B32B2310/0875 ,  B41M7/0081 ,  B41M7/009 ,  B41M2205/10

Abstract: Disclosed are a thermal transfer-printing film and a thermal transfer-printing method utilizing the same. The film has a carrier layer, a post dual-curable protective layer, a decorating layer, and a post dual-curable adhesive layer. The decorating layer includes a post dual-curable printing ink pattern, metal layer such as an embossed surface relief hologram pattern, or combinations thereof. After low temperature thermal transfer on an object surface, the transfer-printing film is then radiation-cured by a free radicals pathway, and optionally simultaneously radiation-cured by a cationic pathway or separately followed by thermal curing.

Abstract translation: 公开了一种热转印印刷膜和利用其的热转印印刷方法。 该膜具有载体层，柱后可固化保护层，装饰层和后双固化粘合剂层。 装饰层包括柱状双重固化印刷油墨图案，金属层，例如压花表面浮雕全息图图案或其组合。 在物体表面上低温热转印后，转印印刷膜然后通过自由基途径进行辐射固化，并且任选地通过阳离子途径同时辐照固化，或者分别进行热固化。

公开(公告)号：US20080258120A1

公开(公告)日：2008-10-23

申请号：US11976056

申请日：2007-10-19

Applicant: Ching-Chang Yang

Inventor： Ching-Chang Yang

IPC: G03C1/00 ,  B05D3/00 ,  B05D3/06

CPC classification number: B05D1/20 ,  B05D3/0209 ,  B05D3/0254 ,  B05D3/067 ,  B05D3/068 ,  B05D5/06

Abstract: Disclosed are water pressure transfer films and methods utilizing the same. The film includes a carrier layer which is soluble or swells in water, a protective layer composed of a dual-curable composition, and a decorating layer. After transferring on an object surface, the protective layer is cured by UV radiation, the carrier layer is washed out, and the protective layer is then further cured by a thermal source. Alternatively, the protective layer can be first cured by a thermal source and further cured by UV radiation. The decorating layer includes printing ink pattern, embossed surface relief hologram pattern, or combinations thereof. The active agent of the water pressure transfer film is also a dual-curable composition.

Abstract translation: 公开了水压转印膜及其利用方法。 该膜包括在水中溶解或溶胀的载体层，由双固化组合物构成的保护层和装饰层。 在物体表面上转印后，通过紫外线辐射固化保护层，洗涤载体层，然后通过热源进一步固化保护层。 或者，保护层可以首先通过热源固化并且通过UV辐射进一步固化。 装饰层包括印刷油墨图案，压花表面浮雕全息图图案或其组合。 水压转印膜的活性剂也是双重可固化组合物。