Abstract:
The present disclosure provides a printed circuit board and a method for fabricating the same, and an apparatus for fabricating printed circuit board. The printed circuit board includes a substrate having an upper surface; a first trench in the upper surface of the substrate; a first via formed in the first trench and penetrating through the substrate; and a first conductive layer disposed in the first trench and the first via, the first trench is electrically connect to the first via. A method for fabricating the printed circuit board and an apparatus for fabricating the printed circuit board is also provided.
Abstract:
Disclosed are water pressure transfer films and methods utilizing the same. The film includes a carrier layer which is soluble or swells in water, a protective layer composed of a dual-curable composition, and a decorating layer. After transferring on an object surface, the protective layer is cured by UV radiation, the carrier layer is washed out, and the protective layer is then further cured by a thermal source. Alternatively, the protective layer can be first cured by a thermal source and further cured by UV radiation. The decorating layer includes printing ink pattern, embossed surface relief hologram pattern, or combinations thereof. The active agent of the water pressure transfer film is also a dual-curable composition.