公开(公告)号：US08572841B2

公开(公告)日：2013-11-05

申请号：US12051133

申请日：2008-03-19

Applicant: Anders P. Pedersen ,  Daniel A. Robison ,  Alan W. Mast

Inventor： Anders P. Pedersen ,  Daniel A. Robison ,  Alan W. Mast

IPC: H05K3/30

CPC classification number: H05K1/144 ,  H05K1/0219 ,  H05K1/111 ,  H05K1/117 ,  H05K1/142 ,  H05K3/301 ,  H05K3/366 ,  H05K3/403 ,  H05K2201/09145 ,  H05K2201/0919 ,  H05K2201/09481 ,  H05K2201/09809 ,  H05K2201/10446

Abstract: A method is for making a printed wiring board (PWB) assembly. The method may include forming a first PWB having a plurality of first electrically conductive pads, forming a second PWB including a plurality of electrically conductive traces having exposed ends on an edge surface of the second PWB, and covering the edge surface of the second PWB with an electrically conductive layer. The method may also include selectively removing portions of the electrically conductive layer to define a plurality of second electrically conductive pads electrically connected to corresponding ones of the exposed ends of the electrically conductive traces, and assembling the first and second PWBs together so that the first and second electrically conductive pads are electrically coupled together to define the PWB assembly.

公开(公告)号：US08217842B2

公开(公告)日：2012-07-10

申请号：US13240376

申请日：2011-09-22

Applicant: Anders P. Pedersen ,  Daniel A. Robison ,  Alan Mast

Inventor： Anders P. Pedersen ,  Daniel A. Robison ,  Alan Mast

IPC: H01Q1/38

CPC classification number: H05K3/366 ,  H01Q21/0087 ,  H01Q21/061 ,  H05K1/0219 ,  H05K3/403 ,  H05K2201/0919 ,  Y10T29/49016 ,  Y10T29/49018

Abstract: An electronic device may include a multilayer circuit board having opposing major surfaces and edge surfaces extending between the opposing major surfaces, wireless processing circuitry on at least one of the opposing major surfaces, and an antenna element on at least one of the edge surfaces. The multilayer circuit board may include a conductive trace coupling the antenna element to the wireless processing circuitry.

Abstract translation: 电子设备可以包括多层电路板，其具有相对的主表面和在相对的主表面之间延伸的边缘表面，在相对的主表面中的至少一个上的无线处理电路以及至少一个边缘表面上的天线元件。 多层电路板可以包括将天线元件耦合到无线处理电路的导电迹线。

公开(公告)号：US08044861B2

公开(公告)日：2011-10-25

申请号：US12164756

申请日：2008-06-30

Applicant: Anders P. Pedersen ,  Daniel A. Robison ,  Alan Mast

Inventor： Anders P. Pedersen ,  Daniel A. Robison ,  Alan Mast

IPC: H01Q1/38

CPC classification number: H05K3/366 ,  H01Q21/0087 ,  H01Q21/061 ,  H05K1/0219 ,  H05K3/403 ,  H05K2201/0919 ,  Y10T29/49016 ,  Y10T29/49018

Abstract: An electronic device may include a multilayer circuit board having opposing major surfaces and edge surfaces extending between the opposing major surfaces, wireless processing circuitry on at least one of the opposing major surfaces, and an antenna element on at least one of the edge surfaces. The multilayer circuit board may include a conductive trace coupling the antenna element to the wireless processing circuitry.

Abstract translation: 电子设备可以包括多层电路板，其具有相对的主表面和在相对的主表面之间延伸的边缘表面，在相对的主表面中的至少一个上的无线处理电路以及至少一个边缘表面上的天线元件。 多层电路板可以包括将天线元件耦合到无线处理电路的导电迹线。

公开(公告)号：US20120030931A1

公开(公告)日：2012-02-09

申请号：US13240376

申请日：2011-09-22

Applicant: Anders P. PEDERSEN ,  Daniel A. ROBISON ,  Alan MAST

Inventor： Anders P. PEDERSEN ,  Daniel A. ROBISON ,  Alan MAST

IPC: H01P11/00 ,  C23F1/02 ,  B05D3/10 ,  B05D5/12 ,  B05D3/06

CPC classification number: H05K3/366 ,  H01Q21/0087 ,  H01Q21/061 ,  H05K1/0219 ,  H05K3/403 ,  H05K2201/0919 ,  Y10T29/49016 ,  Y10T29/49018

Abstract: An electronic device may include a multilayer circuit board having opposing major surfaces and edge surfaces extending between the opposing major surfaces, wireless processing circuitry on at least one of the opposing major surfaces, and an antenna element on at least one of the edge surfaces. The multilayer circuit board may include a conductive trace coupling the antenna element to the wireless processing circuitry.

Abstract translation: 电子设备可以包括多层电路板，其具有相对的主表面和在相对的主表面之间延伸的边缘表面，在相对的主表面中的至少一个上的无线处理电路以及至少一个边缘表面上的天线元件。 多层电路板可以包括将天线元件耦合到无线处理电路的导电迹线。

公开(公告)号：US20090322620A1

公开(公告)日：2009-12-31

申请号：US12164756

申请日：2008-06-30

Applicant: Anders P. Pedersen ,  Daniel A. Robison ,  Alan Mast

Inventor： Anders P. Pedersen ,  Daniel A. Robison ,  Alan Mast

IPC: H01Q1/24 ,  H01Q1/38

CPC classification number: H05K3/366 ,  H01Q21/0087 ,  H01Q21/061 ,  H05K1/0219 ,  H05K3/403 ,  H05K2201/0919 ,  Y10T29/49016 ,  Y10T29/49018

Abstract: An electronic device may include a multilayer circuit board having opposing major surfaces and edge surfaces extending between the opposing major surfaces, wireless processing circuitry on at least one of the opposing major surfaces, and an antenna element on at least one of the edge surfaces. The multilayer circuit board may include a conductive trace coupling the antenna element to the wireless processing circuitry.

Abstract translation: 电子设备可以包括多层电路板，其具有相对的主表面和在相对的主表面之间延伸的边缘表面，在相对的主表面中的至少一个上的无线处理电路以及至少一个边缘表面上的天线元件。 多层电路板可以包括将天线元件耦合到无线处理电路的导电迹线。

公开(公告)号：US20090236139A1

公开(公告)日：2009-09-24

申请号：US12051133

申请日：2008-03-19

Applicant: Anders P. PEDERSEN ,  Daniel A. ROBISON

Inventor： Anders P. PEDERSEN ,  Daniel A. ROBISON

IPC: H05K1/11 ,  H05K3/36

CPC classification number: H05K1/144 ,  H05K1/0219 ,  H05K1/111 ,  H05K1/117 ,  H05K1/142 ,  H05K3/301 ,  H05K3/366 ,  H05K3/403 ,  H05K2201/09145 ,  H05K2201/0919 ,  H05K2201/09481 ,  H05K2201/09809 ,  H05K2201/10446

Abstract: A method is for making a printed wiring board (PWB) assembly. The method may include forming a first PWB having a plurality of first electrically conductive pads, forming a second PWB including a plurality of electrically conductive traces having exposed ends on an edge surface of the second PWB, and covering the edge surface of the second PWB with an electrically conductive layer. The method may also include selectively removing portions of the electrically conductive layer to define a plurality of second electrically conductive pads electrically connected to corresponding ones of the exposed ends of the electrically conductive traces, and assembling the first and second PWBs together so that the first and second electrically conductive pads are electrically coupled together to define the PWB assembly.

Abstract translation: 一种制造印刷电路板（PWB）组件的方法。 该方法可以包括形成具有多个第一导电焊盘的第一PWB，形成第二PWB，第二PWB包括在第二PWB的边缘表面上具有暴露端的多个导电迹线，并且用第二PWB的边缘表面覆盖第二PWB的边缘表面 导电层。 该方法还可以包括选择性地去除导电层的部分以限定电连接到导电迹线的相应的暴露端的多个第二导电焊盘，以及将第一和第二PWB组合在一起，使得第一和 第二导电焊盘电耦合在一起以限定PWB组件。