公开(公告)号：US20070119911A1

公开(公告)日：2007-05-31

申请号：US11287962

申请日：2005-11-28

Applicant: Su Chan ,  Binghua Pan ,  Cheng Cheok ,  Chih Nah ,  Robert Schofield ,  Mahesh Chengalva

Inventor： Su Chan ,  Binghua Pan ,  Cheng Cheok ,  Chih Nah ,  Robert Schofield ,  Mahesh Chengalva

IPC: B23K31/00 ,  B23K31/02

CPC classification number: H05K3/303 ,  H05K1/0266 ,  H05K3/3452 ,  H05K2201/09909 ,  H05K2201/09936 ,  H05K2201/10727 ,  H05K2201/2036 ,  Y02P70/613

Abstract: A composite standoff is formed on a circuit board during the processing of the circuit board while an array of electrical circuit traces including contact pads are formed, portions of the electrical circuit traces are covered by a solder mask, and legend ink is applied to the circuit board for locating electronic components on the circuit board without any need for an additional step.

Abstract translation: 在电路板的处理期间在电路板上形成复合隔板，同时形成包括接触焊盘的电路迹线阵列，电路迹线的一部分被焊接掩模覆盖，并且传说墨水被施加到电路 用于在电路板上定位电子元件，而无需额外的步骤。

公开(公告)号：US20050163966A1

公开(公告)日：2005-07-28

申请号：US10763833

申请日：2004-01-23

Applicant: Mahesh Chengalva ,  Suresh Chengalva ,  Rick Snyder

Inventor： Mahesh Chengalva ,  Suresh Chengalva ,  Rick Snyder

IPC: H05K1/02 ,  H05K1/11 ,  H05K3/46 ,  B32B3/10

CPC classification number: H05K1/112 ,  H01L2224/16225 ,  H05K1/0271 ,  H05K3/4644 ,  H05K3/4688 ,  H05K2201/0133 ,  H05K2201/10636 ,  H05K2201/10674 ,  H05K2201/10727 ,  Y02P70/611 ,  Y10T428/24273

Abstract: Surface mounting of components includes providing a substrate that has a first surface and a second surface. A portion of the first surface is coupled to a conductive layer that is patterned. A compliant layer is introduced to the first surface of the substrate and to the conductive layer. At least one aperture is formed in the compliant layer which extends to the surface of the conductive layer. Conductive material is introduced into the aperture(s). Solder couples the surface mount component to the compliant layer.

Abstract translation: 部件的表面安装包括提供具有第一表面和第二表面的基底。 第一表面的一部分被耦合到被图案化的导电层。 将柔性层引入衬底的第一表面和导电层。 在柔性层中形成至少一个孔，其延伸到导电层的表面。 将导电材料引入孔中。 焊接将表面安装部件耦合到柔性层。

公开(公告)号：US20050085101A1

公开(公告)日：2005-04-21

申请号：US10971847

申请日：2004-10-22

Applicant: Mahesh Chengalva

Inventor： Mahesh Chengalva

IPC: H01R13/719 ,  H05K3/32 ,  H05K1/00 ,  H01R12/00

CPC classification number: H05K3/326 ,  H01R12/58 ,  H01R13/719 ,  H05K2201/0382 ,  H05K2201/1059

Abstract: A filter insert for a terminal connector includes a rigid substrate and low-cost interference fit connections between the filter insert circuitry and the connector terminals. In a first embodiment, the insert includes a flexible circuit bonded to the rigid substrate, and the substrate is provided with over-sized openings that the terminals pass through without interference. A second embodiment is like the first, except that the filter circuit traces are formed directly on the rigid substrate, and the substrate material backing the terminal connection sites is removed to form the over-sized openings.

Abstract translation: 用于端子连接器的过滤器插件包括刚性基板和过滤器插入电路与连接器端子之间的低成本干涉配合连接。 在第一实施例中，插入件包括结合到刚性基板的柔性电路，并且基板设置有超大尺寸的开口，端子通过而没有干涉。 第二实施例类似于第一实施例，除了滤波器电路迹线直接形成在刚性衬底上，并且去除衬底端子连接位置的衬底材料以形成超大尺寸的开口。