公开(公告)号：US20230250532A1

公开(公告)日：2023-08-10

申请号：US18105275

申请日：2023-02-03

Applicant: ASM IP Holding B.V.

Inventor： Rohan Vijay Rane ,  Jianqiu Huang ,  Jason Burgad ,  Yingzong Bu

IPC: C23C16/46 ,  F28F1/12 ,  C23C16/455

CPC classification number: C23C16/463 ,  F28F1/12 ,  C23C16/45565 ,  F28F2275/04

Abstract: Cooling systems for the cooling of various sections of a gas phase reactor system, including a gas distribution sections and lower chamber sections, are disclosed. Exemplary cooling systems include cooling plates to regulate the temperature of the gas phase reactor system.

公开(公告)号：US20240249971A1

公开(公告)日：2024-07-25

申请号：US18417655

申请日：2024-01-19

Applicant: ASM IP Holding B.V.

Inventor： Rohan Vijay Rane ,  Ankit Kimtee ,  Todd Robert Dunn ,  Akshay Phadnis ,  Kyle Fondurulia ,  Sudhanshu Biyani ,  Mun Peow Wong

IPC: H01L21/687

CPC classification number: H01L21/68742

Abstract: Weighted lift pin constructions as disclosed may be used with a semiconductor fabrication processing apparatus. The weighted lift pin constructions comprise a lift pin and a weight element disposed along an end of the lift pin. The weight element is removably retained on the lift pin by a retaining element that may be a clip element, an O-ring element, and differently configured lift pin and weight element threaded sections. When the clip element or O-ring element used, the weight element includes a collar adjacent an end of an opening in the weight element to accommodate placement of the clip or O-ring element therein as retained on the lift pin to thereby maintain axial placement of the lift pin relative to the weight element. Such maintained axial placement may also be achieved by interference locked engagement between differently configured lift pin and weighted element threaded sections.

公开(公告)号：US20240254629A1

公开(公告)日：2024-08-01

申请号：US18631858

申请日：2024-04-10

Applicant: ASM IP Holding B.V.

Inventor： Ankit Kimtee ,  Rohan Vijay Rane ,  Herbert Terhorst ,  Eric James Shero ,  Jereld Lee Winkler ,  Michael Schmotzer ,  Shuyang Zhang ,  Todd Robert Dunn ,  Shubham Garg

IPC: C23C16/458 ,  C23C16/46

CPC classification number: C23C16/4586 ,  C23C16/46

Abstract: A susceptor assembly includes a heater pedestal and a cap coupled to the heater pedestal. The cap can include one or mor through holes to facilitate purging and/or reduce dead volumes associated with the susceptor assemblies. Reactor systems including such assemblies are also disclosed.

公开(公告)号：US20230207377A1

公开(公告)日：2023-06-29

申请号：US18087871

申请日：2022-12-23

Applicant: ASM IP Holding B.V.

Inventor： Rohan Vijay Rane ,  Herbert Terhorst ,  Eric James Shero ,  Ankit Kimtee ,  Jereld Lee Winkler ,  Michael Schmotzer ,  Shuyang Zhang ,  Todd Robert Dunn ,  Shubham Garg

IPC: H01L21/687 ,  C23C16/44

CPC classification number: H01L21/68735 ,  C23C16/4408 ,  H01L21/68785

Abstract: A semiconductor processing device comprises a susceptor assembly comprising a wafer support configured to support a wafer. The wafer support comprises a wafer support body configured to support the wafer, a purge channel extending laterally from an inner portion of the wafer support body to an outer portion of the wafer support body, a first plenum channel disposed at the outer portion of the wafer support and in fluid communication with the purge channel, and an outlet to deliver purge gas to an edge of the wafer, the outlet in fluid communication with the first plenum channel, a purge gas supply hole on a surface opposite to the wafer support body. The purge gas supply hole is in fluid communication with the purge channel, and a plurality of first purge holes fluidly communicated with the first plenum channel and the purge channel.