公开(公告)号：US20240401192A1

公开(公告)日：2024-12-05

申请号：US18675851

申请日：2024-05-28

Applicant: ASM IP Holding B.V.

Inventor： Eric James Shero ,  Paul Ma ,  Jereld Lee Winkler ,  Todd Robert Dunn ,  Shuaidi Zhang ,  Jacqueline Wrench ,  Shubham Garg ,  Jonathan Bakke

IPC: C23C16/448 ,  C23C16/455 ,  C23C16/52

Abstract: Various examples of the present disclosure relate to methods, systems, and apparatus for coupling a delivery vessel disposed at a first location on a substrate processing platform to a remote refill vessel disposed in a second location remote from the substrate processing platform, storing a chemical in the remote refill vessel in a first phase, changing the chemical in the remote refill vessel to a second phase, transporting the chemical in the second phase, to the delivery vessel, maintaining a temperature gradient within an inner volume of the delivery vessel, and returning the chemical to the first phase within the inner volume.

公开(公告)号：US20240218506A1

公开(公告)日：2024-07-04

申请号：US18395801

申请日：2023-12-26

Applicant: ASM IP Holding B.V.

Inventor： Eric James Shero ,  Jonathan Bakke ,  Arjav Prafulkumar Vashi ,  Todd Robert Dunn ,  Paul Ma ,  Jacqueline Wrench ,  Jereld Lee Winkler ,  Shuaidi Zhang ,  Shubham Garg ,  YoungChol Byun

IPC: C23C16/448 ,  C23C16/455 ,  C23C16/52

CPC classification number: C23C16/448 ,  C23C16/45557 ,  C23C16/45561 ,  C23C16/52

Abstract: The substrate processing system includes a delivery vessel having a first inner volume, disposed in a first location on a substrate processing platform, a remote refill vessel in fluid communication with the delivery vessel via a chemical delivery line, the remote refill vessel comprising a second inner volume greater than the first inner volume and disposed in a second location remote from the substrate processing platform, and a first heating device or a first pressurizing device, or a combination thereof, proximate the remote refill vessel, operable to heat or pressurize, or a combination thereof, a chemical disposed in the remote refill vessel sufficient to change a phase of the chemical from a first phase to a second phase.

公开(公告)号：US20230352332A1

公开(公告)日：2023-11-02

申请号：US18138776

申请日：2023-04-25

Applicant: ASM IP Holding B.V.

Inventor： Shubham Garg ,  Jaeyong Cho ,  Amit Mishra ,  Akshay Phadnis

IPC: H01L21/683

CPC classification number: H01L21/6833 ,  H05B3/283

Abstract: An electrostatic chuck (ESC) pedestal heater that includes a pedestal body and a surface on the pedestal body for receiving a substrate such as a high bow wafer. An electrode is embedded in the pedestal body to selectively generate an electrostatic force. The ESC pedestal heater includes a substrate contact surface that is raised to a height above the surface on the pedestal body and includes an inner seal band, an intermediate seal band, and an outer seal band extending. In the substrate contact surface, main spokes are provided that extend outward from the inner seal band to the outer seal band, and ancillary spokes may be provided between the main spokes in the region between the intermediate and outer seal bands. Additionally, contact areas or dots are provided in the substrate contact surface in the spaces between the bands and spokes.

公开(公告)号：US20240401194A1

公开(公告)日：2024-12-05

申请号：US18676023

申请日：2024-05-28

Applicant: ASM IP Holding B.V.

Inventor： Shuaidi Zhang ,  Mustafa Muhammad ,  Moataz Bellah Mousa ,  Paul Ma ,  Jonathan Bakke ,  Todd Robert Dunn ,  Eric James Shero ,  Jereld Lee Winkler ,  YoungChol Byun ,  Shubham Garg ,  Jacqueline Wrench

IPC: C23C16/448 ,  C23C16/455 ,  C23C16/52 ,  H01L21/67

Abstract: The current disclosure relates to example method, system and apparatus for coupling a delivery vessel disposed at a first location on a substrate processing platform to a remote refill vessel disposed in a second location remote from the substrate processing platform via a first chemical delivery line, storing a chemical in the remote refill vessel in a first phase, changing the chemical in the remote refill vessel to a second phase, transporting the chemical in the second phase, to the delivery vessel via the first chemical delivery line, heating the first chemical delivery line to a first temperature equal to or above a phase change temperature of the chemical, and coupling the delivery vessel to an accumulator via a second chemical delivery line.

公开(公告)号：US20240254629A1

公开(公告)日：2024-08-01

申请号：US18631858

申请日：2024-04-10

Applicant: ASM IP Holding B.V.

Inventor： Ankit Kimtee ,  Rohan Vijay Rane ,  Herbert Terhorst ,  Eric James Shero ,  Jereld Lee Winkler ,  Michael Schmotzer ,  Shuyang Zhang ,  Todd Robert Dunn ,  Shubham Garg

IPC: C23C16/458 ,  C23C16/46

CPC classification number: C23C16/4586 ,  C23C16/46

Abstract: A susceptor assembly includes a heater pedestal and a cap coupled to the heater pedestal. The cap can include one or mor through holes to facilitate purging and/or reduce dead volumes associated with the susceptor assemblies. Reactor systems including such assemblies are also disclosed.

公开(公告)号：US20230245905A1

公开(公告)日：2023-08-03

申请号：US18101656

申请日：2023-01-26

Applicant: ASM IP Holding B.V.

Inventor： Joaquin Aguilar Santillan ,  Shubham Garg ,  Hong Gao ,  Todd Dunn ,  Shanker Kuttath

IPC: H01L21/67 ,  H05B3/28 ,  G01K1/02 ,  B32B18/00 ,  B32B3/26 ,  B32B3/08 ,  H01L21/683

CPC classification number: H01L21/67109 ,  H05B3/283 ,  G01K1/026 ,  B32B18/00 ,  B32B3/26 ,  B32B3/08 ,  H01L21/67248 ,  H01L21/6833 ,  H05B2203/005 ,  B32B2307/3065 ,  B32B2307/302

Abstract: A heater assembly having a laminate heater plate and a shaft. The laminate heater plate is formed from a plurality of layers, wherein one or more layers may comprise one or more of a heating element, an RF electrode, a cooling channel, and an RTD sensor.

公开(公告)号：US20230207377A1

公开(公告)日：2023-06-29

申请号：US18087871

申请日：2022-12-23

Applicant: ASM IP Holding B.V.

Inventor： Rohan Vijay Rane ,  Herbert Terhorst ,  Eric James Shero ,  Ankit Kimtee ,  Jereld Lee Winkler ,  Michael Schmotzer ,  Shuyang Zhang ,  Todd Robert Dunn ,  Shubham Garg

IPC: H01L21/687 ,  C23C16/44

CPC classification number: H01L21/68735 ,  C23C16/4408 ,  H01L21/68785

Abstract: A semiconductor processing device comprises a susceptor assembly comprising a wafer support configured to support a wafer. The wafer support comprises a wafer support body configured to support the wafer, a purge channel extending laterally from an inner portion of the wafer support body to an outer portion of the wafer support body, a first plenum channel disposed at the outer portion of the wafer support and in fluid communication with the purge channel, and an outlet to deliver purge gas to an edge of the wafer, the outlet in fluid communication with the first plenum channel, a purge gas supply hole on a surface opposite to the wafer support body. The purge gas supply hole is in fluid communication with the purge channel, and a plurality of first purge holes fluidly communicated with the first plenum channel and the purge channel.

公开(公告)号：US20250092516A1

公开(公告)日：2025-03-20

申请号：US18884515

申请日：2024-09-13

Applicant: ASM IP Holding B.V.

Inventor： Nirmal Gokuldas Waykole ,  Jereld Lee Winkler ,  Yeonsu Rhee ,  Jonathan Bakke ,  Shubham Garg ,  Arjav Prafulkumar Vashi ,  Qi Qi ,  Shuaidi Zhang ,  Joshua Tyler Aragon ,  Chen Zhang

IPC: C23C16/44 ,  C23C16/455 ,  C23C16/458

Abstract: A substrate processing apparatus includes an upper chamber space, a lower chamber space, a susceptor, and a flow control ring assembly comprising a seal ring and a flow control ring having a shape to surround the susceptor, the flow control ring assembly sealing or substantially sealing the upper chamber space from the lower chamber space while the susceptor in a first position.

公开(公告)号：US20250079223A1

公开(公告)日：2025-03-06

申请号：US18817440

申请日：2024-08-28

Applicant: ASM IP Holding B.V.

Inventor： Shubham Garg ,  Hang Zhang ,  Todd Robert Dunn ,  George B. Jackson

IPC: H01L21/683

Abstract: Various embodiments of the present technology may provide a susceptor assembly. The susceptor assembly may include a susceptor plate and a cap disposed on a surface of the susceptor plate. The cap may have electrodes embedded within it. The susceptor plate may have heating elements embedded within it. The cap may be separated from the susceptor plate by an air gap formed by a plurality of dielectric spacers. The plurality of dielectric spacers may be sized for minimal contact on the cap.

公开(公告)号：US20250034712A1

公开(公告)日：2025-01-30

申请号：US18782321

申请日：2024-07-24

Applicant: ASM IP Holding B.V.

Inventor： Anirudhan Chandrasekaran ,  Jereld Lee Winkler ,  Shubham Garg ,  Ryan Paull

IPC: C23C16/458 ,  G01B5/06

Abstract: Various embodiments of the present technology may provide in-situ metrology. A system may include a first sensor embedded within a susceptor and flush with a top surface of the susceptor. The system may also include lift pin pads having a second sensor arranged to contact a lift pin. The system may also include a third sensor arranged outside of a reaction chamber and adjacent to a view port. The system may also include a processor to receive output signals from one or more of the sensors and use the output signals to determine a film thickness on a wafer.