公开(公告)号：US20180158709A1

公开(公告)日：2018-06-07

申请号：US15370834

申请日：2016-12-06

Applicant: ASM IP Holding B.V.

Inventor： Naoto TSUJI ,  Takuya SUGURI ,  Yozo IKEDO

IPC: H01L21/683 ,  H02H7/00 ,  C23C16/448 ,  C23C16/50

CPC classification number: C23C16/50 ,  C23C16/503 ,  H01J37/00 ,  H01L21/6833

Abstract: A substrate treatment apparatus includes a lower electrode, an upper electrode, a first AC power supply that is connected to the upper electrode and supplies AC power at a first frequency, a second AC power supply that is connected to the upper electrode and supplies AC power at a second frequency which is lower than the first frequency, an internal electrode provided in the lower electrode, a filter circuit connected to the internal electrode, and a DC power supply connected to the internal electrode via the filter circuit. The filter circuit includes a first filter circuit that becomes low impedance with respect to AC power at the first frequency compared to AC power at the second frequency, and a second filter circuit that becomes low impedance with respect to AC power at the second frequency compared to AC power at the first frequency.