公开(公告)号：US20180158709A1

公开(公告)日：2018-06-07

申请号：US15370834

申请日：2016-12-06

Applicant: ASM IP Holding B.V.

Inventor： Naoto TSUJI ,  Takuya SUGURI ,  Yozo IKEDO

IPC: H01L21/683 ,  H02H7/00 ,  C23C16/448 ,  C23C16/50

CPC classification number: C23C16/50 ,  C23C16/503 ,  H01J37/00 ,  H01L21/6833

Abstract: A substrate treatment apparatus includes a lower electrode, an upper electrode, a first AC power supply that is connected to the upper electrode and supplies AC power at a first frequency, a second AC power supply that is connected to the upper electrode and supplies AC power at a second frequency which is lower than the first frequency, an internal electrode provided in the lower electrode, a filter circuit connected to the internal electrode, and a DC power supply connected to the internal electrode via the filter circuit. The filter circuit includes a first filter circuit that becomes low impedance with respect to AC power at the first frequency compared to AC power at the second frequency, and a second filter circuit that becomes low impedance with respect to AC power at the second frequency compared to AC power at the first frequency.

公开(公告)号：US20160222513A1

公开(公告)日：2016-08-04

申请号：US14609758

申请日：2015-01-30

Applicant: ASM IP Holding B.V.

Inventor： Yuya NONAKA ,  Yozo IKEDO

IPC: C23C16/455 ,  C23C16/50

CPC classification number: C23C16/45578 ,  C23C16/50

Abstract: A film forming apparatus includes a chamber having a processing space, a stage provided in the processing space and having a substrate placed thereon, a diffusion tube connected to the chamber so that a diffusion space communicating with the processing space is provided right above the stage, and a gas supply tube extending from the outside of the diffusion tube into the diffusion space through a portion of the diffusion tube and having a gas supply orifice in a portion thereof inside of the diffusion space. The gas supply orifice is formed so as to eject a material gas in a direction away from the stage.

Abstract translation: 一种成膜装置包括具有处理空间的室，设置在处理空间中并具有放置在其上的基板的台，连接到室的扩散管，使得与处理空间连通的扩散空间设置在载物台的正上方， 以及气体供给管，其从扩散管的外部延伸通过扩散管的一部分扩散空间，并且在扩散空间的内部具有气体供给孔。 气体供给孔形成为在离开载物台的方向喷出原料气体。