公开(公告)号：US20240043994A1

公开(公告)日：2024-02-08

申请号：US17883368

申请日：2022-08-08

Applicant: Applied Materials, Inc.

Inventor： Daemian Raj Benjamin Raj ,  Liliya I. Krivulina ,  Bharath Kumar Hanchanoor Rathnakara Gowda ,  Collen Leng ,  Syed A. Alam ,  Uwe P. Haller ,  Robert Casanova ,  Ryan Thomas Downey ,  Peter Standish

IPC: C23C16/44 ,  H01L21/67

CPC classification number: C23C16/4412 ,  H01L21/67248 ,  H01L21/67253

Abstract: Exemplary semiconductor processing systems may include a gas source coupled with a number of processing chambers. The gas source may include a controller. Each chamber may include an exhaust assembly having a foreline and a pump. The systems may include at least one abatement system coupled with each pump. The systems may include a plurality of exhaust lines that extend between each pump and the abatement system. The systems may include a dilution gas source coupled with each exhaust line. The systems may include a mass flow controller coupled between the dilution gas source and each exhaust line. The systems may include a temperature sensor coupled with each exhaust line between the pump and the abatement system. The temperature sensor may be communicatively coupled with the controller of the gas source, which may control flow of a gas to a chamber based on a measurement from the temperature sensor.

公开(公告)号：US20230369072A1

公开(公告)日：2023-11-16

申请号：US17743922

申请日：2022-05-13

Applicant: Applied Materials, Inc.

Inventor： Daemian Raj Benjamin Raj ,  Collen Leng ,  Syed A. Alam ,  Tianyang Li

IPC: H01L21/67 ,  H01J37/32

CPC classification number: H01L21/67017 ,  H01J37/3244 ,  H01J37/32899 ,  H01J2237/332 ,  H01J2237/24585

Abstract: Exemplary fluid delivery assemblies for a semiconductor processing system may include a liquid delivery source. The assemblies may include a heater that is fluidly coupled with an outlet of the liquid delivery source. The assemblies may include a liquid flow controller that is fluidly coupled with the liquid delivery source downstream of the heater. The assemblies may include a liquid vaporizer fluidly coupled with a downstream end of the liquid flow controller. The assemblies may include a chamber delivery line coupled with an output of the liquid vaporizer.