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公开(公告)号：US20230139688A1
公开(公告)日：2023-05-04
申请号：US17514430
申请日：2021-10-29
Applicant: Applied Materials, Inc.
Inventor： Daemian Raj Benjamin Raj , Kiran Garikipati , Syed A. Alam , Kurt R. Langeland
IPC: B01F5/06
Abstract: Exemplary modular gas delivery assemblies may include a plurality of modular gas blocks coupled together. Each gas block may include an upper portion and a lower portion. A first end of the upper portion may extend beyond a first end of the lower portion and a second end of the lower portion may extend beyond a second end of the upper portion. A first fluid channel may include a first fluid port, a second fluid port, and a third fluid port. The block body may define a second fluid channel that extends transversely to the first fluid channel. A first modular gas block may be coupled with a second modular gas block and a third modular gas block such that the first fluid channels of each of the first, second, and third modular gas blocks are fluidly coupled with one another.
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公开(公告)号：US12297946B2
公开(公告)日：2025-05-13
申请号：US18181959
申请日：2023-03-10
Applicant: Applied Materials, Inc.
Inventor： Daemian Raj Benjamin Raj , Kiran Garikipati , Kurt R. Langeland , Syed A. Alam
IPC: F16L41/03 , B01F25/43 , B01F101/58 , G05D11/13
Abstract: Exemplary modular gas blocks may include a body having inlet and outlet ends. The body may define a portion of a first gas path along a length of the body and may define a second gas path along a width of the body. The first gas path may include channel segments defined within the body. The inlet end may define a gas inlet that is coupled with the first gas path. The body may define first fluid ports that are coupled with the first gas path. A fluid port of the first fluid ports may be coupled with the gas inlet. The first fluid ports may be coupled with one another via a respective channel segment. An upper surface may define a lateral fluid port that is spaced apart from a first fluid port along the width and is coupled with the first fluid port via the second gas path.
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Patent Agency Ranking
公开(公告)号：US11881416B2
公开(公告)日：2024-01-23
申请号：US17120976
申请日：2020-12-14
Applicant: Applied Materials, Inc.
Inventor： Arun Chakravarthy Chakravarthy , Chahal Neema , Abhijit A. Kangude , Elizabeth Neville , Vishal S. Jamakhandi , Kurt R. Langeland , Syed A. Alam , Ming Xu , Kenneth Le
CPC classification number: H01L21/67017 , H01J37/3244 , H01J37/32357 , H01J37/32899 , H01L21/67167 , H01J2237/006
Abstract: Exemplary substrate processing systems may include a lid plate. The systems may include a gas splitter seated on the lid plate. The gas splitter may define a plurality of gas inlets and gas outlets. A number of gas outlets may be greater than a number of gas inlets. The systems may include a plurality of valve blocks that are interfaced with the gas splitter. Each valve block may define a number of gas lumens. An inlet of each of the gas lumens may be in fluid communication with one of the gas outlets. An interface between the gas splitter and each of the valve blocks may include a choke. The systems may include a plurality of output manifolds seated on the lid plate. The systems may include a plurality of output weldments that may couple an outlet of one of the gas lumens with one of the output manifolds.
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公开(公告)号：US20240043994A1
公开(公告)日：2024-02-08
申请号：US17883368
申请日：2022-08-08
Applicant: Applied Materials, Inc.
Inventor： Daemian Raj Benjamin Raj , Liliya I. Krivulina , Bharath Kumar Hanchanoor Rathnakara Gowda , Collen Leng , Syed A. Alam , Uwe P. Haller , Robert Casanova , Ryan Thomas Downey , Peter Standish
CPC classification number: C23C16/4412 , H01L21/67248 , H01L21/67253
Abstract: Exemplary semiconductor processing systems may include a gas source coupled with a number of processing chambers. The gas source may include a controller. Each chamber may include an exhaust assembly having a foreline and a pump. The systems may include at least one abatement system coupled with each pump. The systems may include a plurality of exhaust lines that extend between each pump and the abatement system. The systems may include a dilution gas source coupled with each exhaust line. The systems may include a mass flow controller coupled between the dilution gas source and each exhaust line. The systems may include a temperature sensor coupled with each exhaust line between the pump and the abatement system. The temperature sensor may be communicatively coupled with the controller of the gas source, which may control flow of a gas to a chamber based on a measurement from the temperature sensor.
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公开(公告)号：US20220189793A1
公开(公告)日：2022-06-16
申请号：US17120976
申请日：2020-12-14
Applicant: Applied Materials, Inc.
Inventor： Arun Chakravarthy Chakravarthy , Chahal Neema , Abhijit A. Kangude , Elizabeth Neville , Vishal S. Jamakhandi , Kurt R. Langeland , Syed A. Alam , Ming Xu , Kenneth Le
Abstract: Exemplary substrate processing systems may include a lid plate. The systems may include a gas splitter seated on the lid plate. The gas splitter may define a plurality of gas inlets and gas outlets. A number of gas outlets may be greater than a number of gas inlets. The systems may include a plurality of valve blocks that are interfaced with the gas splitter. Each valve block may define a number of gas lumens. An inlet of each of the gas lumens may be in fluid communication with one of the gas outlets. An interface between the gas splitter and each of the valve blocks may include a choke. The systems may include a plurality of output manifolds seated on the lid plate. The systems may include a plurality of output weldments that may couple an outlet of one of the gas lumens with one of the output manifolds.
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6.发明公开公开(公告)号：US20230369072A1
公开(公告)日：2023-11-16
申请号：US17743922
申请日：2022-05-13
Applicant: Applied Materials, Inc.
Inventor： Daemian Raj Benjamin Raj , Collen Leng , Syed A. Alam , Tianyang Li
CPC classification number: H01L21/67017 , H01J37/3244 , H01J37/32899 , H01J2237/332 , H01J2237/24585
Abstract: Exemplary fluid delivery assemblies for a semiconductor processing system may include a liquid delivery source. The assemblies may include a heater that is fluidly coupled with an outlet of the liquid delivery source. The assemblies may include a liquid flow controller that is fluidly coupled with the liquid delivery source downstream of the heater. The assemblies may include a liquid vaporizer fluidly coupled with a downstream end of the liquid flow controller. The assemblies may include a chamber delivery line coupled with an output of the liquid vaporizer.
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公开(公告)号：US20230288007A1
公开(公告)日：2023-09-14
申请号：US18181959
申请日：2023-03-10
Applicant: Applied Materials, Inc.
Inventor： Daemian Raj Benjamin Raj , Kiran Garikipati , Kurt R. Langeland , Syed A. Alam
CPC classification number: F16L41/03 , G05D11/132 , B01F25/43 , B01F2101/58
Abstract: Exemplary modular gas blocks may include a body having inlet and outlet ends. The body may define a portion of a first gas path along a length of the body and may define a second gas path along a width of the body. The first gas path may include channel segments defined within the body. The inlet end may define a gas inlet that is coupled with the first gas path. The body may define first fluid ports that are coupled with the first gas path. A fluid port of the first fluid ports may be coupled with the gas inlet. The first fluid ports may be coupled with one another via a respective channel segment. An upper surface may define a lateral fluid port that is spaced apart from a first fluid port along the width and is coupled with the first fluid port via the second gas path.
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