公开(公告)号：US12272659B2

公开(公告)日：2025-04-08

申请号：US17944596

申请日：2022-09-14

Applicant: Applied Materials, Inc.

Inventor： Yi Xu ,  Yu Lei ,  Zhimin Qi ,  Aixi Zhang ,  Xianyuan Zhao ,  Wei Lei ,  Xingyao Gao ,  Shirish A. Pethe ,  Tao Huang ,  Xiang Chang ,  Patrick Po-Chun Li ,  Geraldine Vasquez ,  Dien-yeh Wu ,  Rongjun Wang

IPC: H01L23/00

Abstract: Methods for reducing resistivity of metal gapfill include depositing a conformal layer in an opening of a feature and on a field of a substrate with a first thickness of the conformal layer of approximately 10 microns or less, depositing a non-conformal metal layer directly on the conformal layer at a bottom of the opening and directly on the field using an anisotropic deposition process. A second thickness of the non-conformal metal layer on the field and on the bottom of the feature is approximately 30 microns or greater. And depositing a metal gapfill material in the opening of the feature and on the field where the metal gapfill material completely fills the opening without any voids.

公开(公告)号：US20240222192A1

公开(公告)日：2024-07-04

申请号：US18149829

申请日：2023-01-04

Applicant: Applied Materials, Inc.

Inventor： Yi Xu ,  Yu Lei ,  Zhimin Qi ,  Aixi Zhang ,  Xianyuan Zhao

IPC: H01L21/768 ,  C23C16/04 ,  C23C16/40 ,  H01J37/32 ,  H01L23/532

CPC classification number: H01L21/76877 ,  C23C16/045 ,  C23C16/405 ,  H01J37/32146 ,  H01L23/53238 ,  H01L23/53266 ,  H01J2237/3321 ,  H01J2237/335

Abstract: Embodiments of the disclosure are directed to methods of removing metal oxide from a substrate surface by exposing the substrate surface to a hydrogen (H2) plasma and pulses of RF. In some embodiments, the substrate surface has at least one feature thereon, the at least one feature defining a trench having a top surface, a bottom surface, and two opposed sidewalls. The hydrogen (H2) plasma and pulses of RF remove substantially all of the metal oxide, e.g., tungsten oxide (WOx), molybdenum oxide (MoOx), or ruthenium oxide (RuOx), from the substrate surface, without damaging the dielectric and/or critical dimension (CD)/profile of the structure. A metal fill can then be selectively deposited in the trench.