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公开(公告)号：US12269061B2
公开(公告)日：2025-04-08
申请号：US18376598
申请日：2023-10-04
Applicant: BFLY OPERATIONS, INC.
Inventor： Lingyun Miao , Jianwei Liu
Abstract: An ultrasound transducer device includes an electrode, a membrane separated from the electrode by a cavity between the membrane and the electrode, a patterned membrane support layer that defines a size and shape of the cavity and that is disposed between the electrode and the membrane, and vias that electrically connect the electrode to a substrate. The vias are disposed in the ultrasound transducer device such that less than 50% of the vias overlap with a support surface of the patterned membrane support layer, in a plan view.
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公开(公告)号：US12246348B2
公开(公告)日：2025-03-11
申请号：US17686045
申请日：2022-03-03
Applicant: BFLY OPERATIONS, INC.
Inventor： Lingyun Miao , Sarp Satir
Abstract: An ultrasound device is described. The ultrasound device comprises a capacitive micromachined ultrasonic transducer (CMUT). The CMUT comprises a membrane, a substrate, a cavity disposed between the membrane and the substrate, wherein the cavity comprises a bottom surface adjacent to the substrate, and non-uniform pedestals protruding from the bottom surface of the cavity into the cavity and towards the membrane.
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公开(公告)号：US11571711B2
公开(公告)日：2023-02-07
申请号：US16683652
申请日：2019-11-14
Applicant: BFLY OPERATIONS, INC.
Inventor： Lingyun Miao , Keith G. Fife , Jianwei Liu , Jonathan M. Rothberg
Abstract: A method of forming an ultrasonic transducer device includes forming an insulating layer having topographic features over a lower transducer electrode layer of a substrate; forming a conformal, anti-stiction layer over the insulating layer such that the conformal layer also has the topographic features; defining a cavity in a support layer formed over the anti-stiction layer; and bonding a membrane to the support layer.
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公开(公告)号：US20250128290A1
公开(公告)日：2025-04-24
申请号：US18990023
申请日：2024-12-20
Applicant: BFLY Operations, Inc
Inventor： Jianwei Liu , Lingyun Miao , Victor L. Pushparaj , Nikhil Apte
Abstract: An ultrasonic transducer is described. The ultrasonic transducer comprises a membrane and a substrate disposed opposite the membrane such that a cavity is formed therebetween. The substrate comprises an electrode region and pedestals protruding from a surface of the substrate and having a height greater than a height of the electrode region, the pedestals being electrically isolated from the electrode region.
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公开(公告)号：US12172188B2
公开(公告)日：2024-12-24
申请号：US17685991
申请日：2022-03-03
Applicant: BFLY OPERATIONS, INC.
Inventor： Jianwei Liu , Lingyun Miao , Victor L. Pushparaj , Nikhil Apte
Abstract: An ultrasonic transducer is described. The ultrasonic transducer comprises a membrane and a substrate disposed opposite the membrane such that a cavity is formed therebetween. The substrate comprises an electrode region and pedestals protruding from a surface of the substrate and having a height greater than a height of the electrode region, the pedestals being electrically isolated from the electrode region.
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Patent Agency Ranking
公开(公告)号：US11883845B2
公开(公告)日：2024-01-30
申请号：US18093701
申请日：2023-01-05
Applicant: BFLY OPERATIONS, INC.
Inventor： Lingyun Miao , Keith G. Fife , Jianwei Liu , Jonathan M. Rothberg
CPC classification number: B06B1/0292 , B81B3/001 , B81C1/00984 , B81B2203/0127 , B81B2203/0315 , B81B2203/0392 , B81C2201/0109 , B81C2201/0125 , B81C2201/0176
Abstract: A method of forming an ultrasonic transducer device involves depositing a first layer on a substrate, depositing a second layer on the first layer, patterning the second layer at a region corresponding to a location of a transducer cavity, depositing a third layer that refills regions created by patterning the second layer, planarizing the third layer to a top surface of the second layer, removing the second layer, conformally depositing a fourth layer over the first layer and the third layer, defining the transducer cavity in a support layer formed over the fourth layer; and bonding a membrane to the support layer.
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公开(公告)号：US11766696B2
公开(公告)日：2023-09-26
申请号：US16784186
申请日：2020-02-06
Applicant: BFLY Operations, Inc.
Inventor： Lingyun Miao , Jianwei Liu , Jonathan M. Rothberg
CPC classification number: B06B1/0292 , H10N30/06 , B81B2201/0271 , B81B2203/0315 , B81B2203/04 , B81C2201/0101 , B81C2201/013 , B81C2201/0147 , B81C2201/0174 , B81C2203/0714
Abstract: A method of forming an ultrasonic transducer device includes forming a patterned metal electrode layer over a substrate, the patterned metal electrode layer comprising a lower layer and an upper layer formed on the lower layer; forming an insulation layer over the patterned metal electrode layer; and planarizing the insulation layer to the upper layer of the patterned metal electrode layer, wherein the upper layer comprises a electrically conductive material that serves as a chemical mechanical polishing (CMP) stop layer that has CMP selectivity with respect to the insulation layer and the lower layer, and wherein the upper layer has a CMP removal rate slower than that of the insulation layer.
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公开(公告)号：US12263506B2
公开(公告)日：2025-04-01
申请号：US18530629
申请日：2023-12-06
Applicant: BFLY OPERATIONS, INC.
Inventor： Lingyun Miao , Keith G. Fife , Jianwei Liu , Jonathan M. Rothberg
Abstract: An ultrasound transducer device made by a process that includes the steps of forming depositing a first layer on a substrate, depositing a second layer on the first layer, patterning the second layer at a region corresponding to a location of a transducer cavity, depositing a third layer that refills regions created by patterning the second layer, planarizing the third layer to a top surface of the second layer, removing the second layer, conformally depositing a fourth layer over the first layer and the third layer, defining the transducer cavity in a support layer formed over the fourth layer; and bonding a membrane to the support layer.
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公开(公告)号：US20240416385A1
公开(公告)日：2024-12-19
申请号：US18813377
申请日：2024-08-23
Applicant: BFLY Operations, Inc
Inventor： Lingyun Miao , Jianwei Liu , Keith G. Fife
Abstract: A method of forming an ultrasonic transducer device includes forming and patterning a film stack over a substrate, the film stack comprising a metal electrode layer and a chemical mechanical polishing (CMP) stop layer formed over the metal electrode layer; forming an insulation layer over the patterned film stack; planarizing the insulation layer to the CMP stop layer; measuring a remaining thickness of the CMP stop layer; and forming a membrane support layer over the patterned film stack, wherein the membrane support layer is formed at thickness dependent upon the measured remaining thickness of the CMP stop layer, such that a combined thickness of the CMP stop layer and the membrane support layer corresponds to a desired transducer cavity depth.
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公开(公告)号：US20240100566A1
公开(公告)日：2024-03-28
申请号：US18530629
申请日：2023-12-06
Applicant: BFLY OPERATIONS, INC.
Inventor： Lingyun Miao , Keith G. Fife , Jianwei Liu , Jonathan M. Rothberg
CPC classification number: B06B1/0292 , B81B3/001 , B81C1/00984 , B81B2203/0127 , B81B2203/0315 , B81B2203/0392 , B81C2201/0109 , B81C2201/0125 , B81C2201/0176
Abstract: An ultrasound transducer device made by a process that includes the steps of forming depositing a first layer on a substrate, depositing a second layer on the first layer, patterning the second layer at a region corresponding to a location of a transducer cavity, depositing a third layer that refills regions created by patterning the second layer, planarizing the third layer to a top surface of the second layer, removing the second layer, conformally depositing a fourth layer over the first layer and the third layer, defining the transducer cavity in a support layer formed over the fourth layer; and bonding a membrane to the support layer.
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