公开(公告)号：US20150115433A1

公开(公告)日：2015-04-30

申请号：US14449201

申请日：2014-08-01

Applicant: Bridge Semiconductor Corporation

Inventor： Charles W.C. LIN ,  Chia-Chung WANG

IPC: H01L23/00 ,  H01L23/34

CPC classification number: H01L23/34 ,  H01L21/50 ,  H01L23/13 ,  H01L23/147 ,  H01L23/36 ,  H01L23/3675 ,  H01L23/42 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49833 ,  H01L23/5389 ,  H01L23/552 ,  H01L24/13 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L24/97 ,  H01L2224/0401 ,  H01L2224/131 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/81203 ,  H01L2224/81207 ,  H01L2224/81815 ,  H01L2224/8314 ,  H01L2224/83192 ,  H01L2224/92125 ,  H01L2224/92225 ,  H01L2224/97 ,  H01L2924/12042 ,  H01L2924/15192 ,  H01L2924/1531 ,  H01L2924/157 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/15793 ,  H01L2924/16235 ,  H01L2924/16251 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00012 ,  H01L2224/83 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/014

Abstract: The present invention relates to a method of making a semiconductor device having a chip embedded in a heat spreader and electrically connected to a hybrid substrate. In accordance with a preferred embodiment, the method is characterized by the step of attaching a chip-on-interposer subassembly on a heat spreader using an adhesive with the chip inserted into a cavity of the heat spreader. The heat spreader provides thermal dissipation and the interposer provides a CTE-matched interface and primary fan-out routing for the chip.

Abstract translation: 本发明涉及一种制造半导体器件的方法，所述半导体器件具有嵌入在散热器中并电连接到混合基板的芯片。 根据优选实施例，该方法的特征在于：使用粘合剂将插入芯片插入件子组件安装在散热器上的步骤，其中芯片插入散热器的空腔中。 散热器提供散热，插入器为芯片提供了CTE匹配接口和主扇出路由。

公开(公告)号：US20140175633A1

公开(公告)日：2014-06-26

申请号：US14190457

申请日：2014-02-26

Applicant: Bridge Semiconductor Corporation

Inventor： Charles W.C. LIN ,  Chia-Chung WANG

IPC: H01L23/367 ,  H01L23/00

CPC classification number: H01L24/97 ,  H01L21/50 ,  H01L23/13 ,  H01L23/147 ,  H01L23/36 ,  H01L23/49827 ,  H01L23/49833 ,  H01L23/5389 ,  H01L24/13 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/81203 ,  H01L2224/81207 ,  H01L2224/81815 ,  H01L2224/8314 ,  H01L2224/92125 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00012 ,  H01L2224/83 ,  H01L2224/81 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: The present invention relates to a method of making a thermally conductive semiconductor assembly. In accordance with a preferred embodiment, the method includes: providing a chip; providing an interposer that includes a through via, a first contact pad on a first surface and a second contact pad on an opposite second surface; electrically coupling the chip to the first contact pad of the interposer by a conductive bump or a wire; providing a heat sink with a cavity; then attaching the chip and the interposer on the heat sink using an adhesive with the chip inserted into the cavity; and then forming a build-up circuitry on the second surface of the interposer. Accordingly, the heat sink can provide essential thermal dissipation for the embedded chip, and the interposer and build-up circuitry can respectively provide first and second level fan-out routing/interconnection for the embedded chip.

Abstract translation: 本发明涉及一种制造导热半导体组件的方法。 根据优选实施例，该方法包括：提供芯片; 提供内插器，其包括通孔，第一表面上的第一接触焊盘和相对的第二表面上的第二接触焊盘; 通过导电凸块或导线将芯片电连接到插入器的第一接触焊盘; 提供具有空腔的散热器; 然后使用粘合剂将芯片和插入件安装在散热器上，芯片插入腔体中; 然后在插入器的第二表面上形成积聚电路。 因此，散热器可以为嵌入式芯片提供必要的散热，并且插入器和建立电路可以分别为嵌入式芯片提供第一级和第二级扇出路由/互连。

公开(公告)号：US20140048326A1

公开(公告)日：2014-02-20

申请号：US13962991

申请日：2013-08-09

Applicant: Bridge Semiconductor Corporation

Inventor： Charles W.C. LIN ,  Chia-Chung WANG

IPC: H05K9/00

CPC classification number: H05K9/00 ,  H01L23/552 ,  H01L24/73 ,  H01L25/16 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/26175 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/8314 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/3025 ,  H05K1/0206 ,  H05K1/0216 ,  H05K1/186 ,  H05K3/284 ,  H05K3/4697 ,  H05K2201/0715 ,  H05K2201/09781 ,  H05K2201/10515 ,  H05K2201/10553 ,  H05K2201/10674 ,  H05K2201/10969 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/00014

Abstract: A multi-cavity wiring board includes a coreless substrate, an adhesive, and a stiffener having a plurality of apertures with lateral shielding sidewalls. The coreless substrate covers the stiffener and includes electrical pads exposed from the apertures of the stiffener as electrical contacts for semiconductor devices packaged within the apertures. The aperture sidewalls of the stiffener can serve as effective lateral electromagnetic shields for the semiconductor devices within the apertures.

Abstract translation: 多空腔布线板包括无芯基板，粘合剂和具有多个具有横向屏蔽侧壁的孔的加强件。 无芯基板覆盖加强件并且包括从加强件的孔暴露的电焊盘，作为封装在孔内的半导体器件的电触点。 加强件的开口侧壁可以用作孔内的半导体器件的有效横向电磁屏蔽。

公开(公告)号：US20140048319A1

公开(公告)日：2014-02-20

申请号：US13963001

申请日：2013-08-09

Applicant: Bridge Semiconductor Corporation

Inventor： Wei-Kuang PAN ,  Charles W.C. LIN ,  Chia-Chung WANG

IPC: H05K1/02

CPC classification number: H05K1/0216 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/15311 ,  H05K1/0251 ,  H05K3/445 ,  H05K3/4608 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A wiring board with built-in metal slugs includes a dielectric hybrid core and build-up circuitries. The metal slugs extend into apertures of a stiffener of the hybrid core and are electrically connected to the build-up circuitry. The build-up circuitry covers the metal slugs and the stiffener and provides signal routing. The metal slugs can serve as power and ground planes for the wiring board.

Abstract translation: 具有内置金属块的布线板包括电介质混合芯和堆积电路。 金属块塞延伸到混合铁芯的加强件的孔中，并且电连接到积聚电路。 积聚电路覆盖金属块和加强筋并提供信号路由。 金属块可用作接线板的电源和接地层。

公开(公告)号：US20140291001A1

公开(公告)日：2014-10-02

申请号：US13888434

申请日：2013-05-07

Applicant: BRIDGE SEMICONDUCTOR CORPORATION

Inventor： Charles W.C. LIN ,  Chia-Chung WANG

IPC: H05K3/42 ,  H05K1/11

CPC classification number: H01L21/56 ,  H01L23/3121 ,  H01L23/49827 ,  H01L23/49833 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/20 ,  H01L24/24 ,  H01L24/82 ,  H01L25/105 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/06181 ,  H01L2224/1132 ,  H01L2224/1146 ,  H01L2224/11849 ,  H01L2224/12105 ,  H01L2224/131 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/19 ,  H01L2224/2101 ,  H01L2224/211 ,  H01L2224/215 ,  H01L2224/221 ,  H01L2224/24101 ,  H01L2224/24221 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/73267 ,  H01L2224/82106 ,  H01L2224/83192 ,  H01L2224/83862 ,  H01L2224/92244 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/0001 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/18162 ,  H01L2924/3511 ,  H05K1/141 ,  H05K1/183 ,  H05K3/4694 ,  H05K2201/048 ,  H05K2203/0152 ,  Y10T29/49165 ,  H01L2224/13099 ,  H01L2924/00

Abstract: The present invention relates to a method of making a hybrid wiring board. In accordance with a preferred embodiment, the method includes: preparing a dielectric layer and a supporting board including a stiffener, a bump/flange sacrificial carrier and an adhesive, wherein the adhesive bonds the stiffener to the sacrificial carrier and the dielectric layer covers the supporting board; then removing the bump and a portion of the flange to form a cavity and expose the dielectric layer; then mounting an interposer into the cavity; and then forming a build-up circuitry that includes a first conductive via in direct contact with the interposer and provides signal routing for the interposer. Accordingly, the direct electrical connection between the interposer and the build-up circuitry is advantageous to high I/O and high performance, and the stiffener can provide adequate mechanical support for the build-up circuitry and the interposer.

Abstract translation: 本发明涉及一种制造混合布线板的方法。 根据优选实施例，该方法包括：制备介电层和包括加强件，凸块/凸缘牺牲载体和粘合剂的支撑板，其中粘合剂将加强件粘合到牺牲载体上，并且介电层覆盖支撑 板; 然后去除所述凸块和所述凸缘的一部分以形成空腔并暴露所述介电层; 然后将插入件安装到空腔中; 然后形成一个积累电路，其包括与插入器直接接触的第一导电通孔，并为插入器提供信号路由。 因此，插入器和积聚电路之间的直接电连接对于高I / O和高性能是有利的，并且加强件可以为积聚电路和插入器提供足够的机械支撑。

公开(公告)号：US20140251658A1

公开(公告)日：2014-09-11

申请号：US13788144

申请日：2013-03-07

Applicant: BRIDGE SEMICONDUCTOR CORPORATION

Inventor： Charles W.C. LIN ,  Chia-Chung WANG

IPC: H05K1/02

CPC classification number: H05K1/0271 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K1/0206 ,  H05K3/3436 ,  H05K3/4652 ,  H05K3/4697 ,  H05K2201/10416 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A thermally enhanced wiring board includes a heat sink, a stiffener and a build-up circuitry. The heat sink extends into an aperture of the stiffener and is thermally connected to the build-up circuitry. The build-up circuitry covers the heat sink and the stiffener and provides signal routing for the stiffener. The stiffener provides signal routing and mechanical support for the build-up circuitry.

Abstract translation: 热增强布线板包括散热器，加强件和堆积电路。 散热器延伸到加强件的孔中，并且热连接到积聚电路。 积聚电路覆盖散热器和加强件，并为加强件提供信号路由。 加强筋为积聚电路提供信号路由和机械支持。

公开(公告)号：US20140061877A1

公开(公告)日：2014-03-06

申请号：US14043933

申请日：2013-10-02

Applicant: Bridge Semiconductor Corporation

Inventor： Charles W.C. LIN ,  Chia-Chung WANG ,  Cheng-Chung CHEN

IPC: H01L23/552

CPC classification number: H01L23/552 ,  H01L24/19 ,  H01L24/82 ,  H01L24/83 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2224/82132 ,  H01L2224/8314 ,  H01L2224/92144 ,  H01L2224/92244 ,  H01L2924/12042 ,  H01L2924/00

Abstract: In a preferred embodiment, a wiring board with embedded device, built-in stopper and electromagnetic shielding includes a stopper, a semiconductor device, a stiffener with shielding sidewalls, a first build-up circuitry and a second build-up circuitry with a shielding lid. The first and second build-up circuitries cover the semiconductor device, the stopper and the stiffener in the opposite vertical directions. The shielding sidewalls and the shielding lid are electrically connected to at least one ground contact pad of the semiconductor device by the first build-up circuitry and can respectively serve as effective horizontal and vertical electromagnetic shields for the semiconductor device within the aperture of the stiffener.

Abstract translation: 在优选实施例中，具有嵌入式装置，内置止动器和电磁屏蔽的布线板包括止动器，半导体装置，具有屏蔽侧壁的加强件，第一积聚电路和具有屏蔽盖的第二积聚电路 。 第一和第二堆叠电路在相反的垂直方向上覆盖半导体器件，止动器和加强件。 屏蔽侧壁和屏蔽盖通过第一聚集电路电连接到半导体器件的至少一个接地焊盘，并且可以分别用作加强板的孔内的半导体器件的有效水平和垂直电磁屏蔽。

公开(公告)号：US20140048951A1

公开(公告)日：2014-02-20

申请号：US13917776

申请日：2013-06-14

Applicant: Bridge Semiconductor Corporation

Inventor： Charles W.C. LIN ,  Chia-Chung WANG

IPC: H01L23/48

CPC classification number: H01L23/481 ,  H01L21/4857 ,  H01L23/16 ,  H01L23/24 ,  H01L23/3128 ,  H01L23/36 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49833 ,  H01L25/0657 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/19107 ,  H01L2924/00014

Abstract: A semiconductor assembly includes a semiconductor device, a through-via interposer, a coreless substrate and a stiffener. The semiconductor device is flip mounted on the interposer, and the interposer is affixed on the coreless substrate by adhesive and extends into an aperture of a stiffener which provides mechanical support for the coreless substrate. The electrically connection between the interposer and the coreless substrate includes bond wire and conductive micro-via. The coreless substrate can provide fan-out routing for the interposer.

Abstract translation: 半导体组件包括半导体器件，通孔插入器，无芯衬底和加强件。 将半导体器件翻转安装在插入器上，并且插入器通过粘合剂固定在无芯衬底上，并延伸到为无芯衬底提供机械支撑的加强件的孔中。 插入器和无芯基板之间的电连接包括接合线和导电微通孔。 无芯衬底可以为插入器提供扇出路由。

公开(公告)号：US20140048916A1

公开(公告)日：2014-02-20

申请号：US14053950

申请日：2013-10-15

Applicant: Bridge Semiconductor Corporation

Inventor： Charles W.C. LIN ,  Chia-Chung WANG

IPC: H01L23/552

CPC classification number: H01L23/552 ,  H01L24/19 ,  H01L24/24 ,  H01L24/82 ,  H01L2224/04105 ,  H01L2224/24226 ,  H01L2224/26175 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2224/8314 ,  H01L2224/92144 ,  H01L2224/92244 ,  H01L2924/12042 ,  H01L2924/00

Abstract: In a preferred embodiment, a wiring board with embedded device and electromagnetic shielding includes a semiconductor device, a core layer, a shielding lid, shielding slots and build-up circuitry. The build-up circuitry covers the semiconductor device and the core layer. The shielding slots and the shielding lid are electrically connected to at least one ground contact pad of the semiconductor device by the build-up circuitry and can respectively serve as effective horizontal and vertical electromagnetic shields for the semiconductor devices.

Abstract translation: 在优选实施例中，具有嵌入式装置和电磁屏蔽的布线板包括半导体器件，芯层，屏蔽盖，屏蔽槽和积聚电路。 积聚电路覆盖半导体器件和核心层。 屏蔽槽和屏蔽盖通过积聚电路电连接到半导体器件的至少一个接地焊盘，并且可以分别用作半导体器件的有效的水平和垂直电磁屏蔽。

公开(公告)号：US20140048914A1

公开(公告)日：2014-02-20

申请号：US13969641

申请日：2013-08-19

Applicant: Bridge Semiconductor Corporation

Inventor： Charles W.C. LIN ,  Chia-Chung WANG

IPC: H01L23/552

CPC classification number: H01L23/552 ,  H01L24/19 ,  H01L2224/04105 ,  H01L2224/26175 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2224/8314 ,  H01L2224/92144 ,  H01L2224/92244 ,  H01L2924/12042 ,  H01L2924/00

Abstract: In a preferred embodiment, a wiring board with embedded device and electromagnetic shielding includes a shielding frame, a semiconductor device, a stiffener, a first build-up circuitry and a second build-up circuitry with a shielding lid. The first and second build-up circuitries cover the semiconductor device, the shielding frame and the stiffener in the opposite vertical directions. The shielding frame and the shielding lid are electrically connected to at least one ground contact pad of the semiconductor device by the first build-up circuitry and can respectively serve as effective horizontal and vertical electromagnetic shields for the semiconductor devices within the aperture of the stiffener.

Abstract translation: 在优选实施例中，具有嵌入式装置和电磁屏蔽的布线板包括屏蔽框架，半导体器件，加强件，第一堆叠电路和具有屏蔽盖的第二叠层电路。 第一和第二堆叠电路在相反的垂直方向上覆盖半导体器件，屏蔽框架和加强件。 屏蔽框架和屏蔽盖通过第一聚集电路电连接到半导体器件的至少一个接地焊盘，并且可以分别用作加强件的孔内的半导体器件的有效的水平和垂直电磁屏蔽。