公开(公告)号：US20250071889A1

公开(公告)日：2025-02-27

申请号：US18789994

申请日：2024-07-31

Applicant: CHIPBOND TECHNOLOGY CORPORATION

Inventor： Kung-Tzu Tu ,  Gwo-Shyan Sheu ,  Hsin-Hao Huang ,  Pei-Wen Wang ,  Yu-Chen Ma ,  Erh-Shun Chuang

IPC: H05K1/02 ,  G01R1/073 ,  H05K1/11 ,  H05K1/18

Abstract: A flexible circuit board includes a flexible substrate, a chip, a first test area, first test pads and a circuit layer connected to the chip and the first test pads. A working area and a non-working area are defined on an upper surface of the flexible substrate. The chip is disposed on the working area, the first test area is located within the non-working area and between a third edge and the working area, the first test pads are arranged on the first test area. Flexible circuit boards with different sizes can have the first test area with the same size and can be tested using a probe card with the same specification to lower testing cost.