公开(公告)号：US20130256882A1

公开(公告)日：2013-10-03

申请号：US13903447

申请日：2013-05-28

Applicant: CHIPBOND TECHNOLOGY CORPORATION

Inventor： Cheng-Hung Shih ,  Yung-Wei Hsieh ,  Shu-Chen Lin ,  Cheng-Fan Lin ,  Hua-An Dai

IPC: H01L23/58 ,  H01L23/498

CPC classification number: H01L23/58 ,  H01L23/49811 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/034 ,  H01L2224/03912 ,  H01L2224/0401 ,  H01L2224/05022 ,  H01L2224/05099 ,  H01L2224/05572 ,  H01L2224/05666 ,  H01L2224/1147 ,  H01L2224/11472 ,  H01L2224/11906 ,  H01L2224/13082 ,  H01L2224/13147 ,  H01L2224/13562 ,  H01L2224/13564 ,  H01L2224/13582 ,  H01L2224/13583 ,  H01L2224/13644 ,  H01L2224/13655 ,  H01L2224/13664 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2224/05599 ,  H01L2224/05552

Abstract: A method for manufacturing fine-pitch bumps comprises providing a silicon substrate; forming a titanium-containing metal layer having a plurality of first zones and a plurality of second zones on the silicon substrate; forming a photoresist layer on the titanium-containing metal layer; patterning the photoresist layer; forming a plurality of copper bumps having a plurality of first top surfaces and a plurality of first ring surfaces; heating the photoresist layer to form a plurality of body portions and removable portions; etching the photoresist layer; forming a plurality of bump protection layers on the titanium-containing metal layer, the first top surface and the first ring surface, each of the bump protection layers comprises a bump coverage portion; plating a plurality of gold layers at the bump coverage portion; eventually, removing the second zones to enable each of the first zones to form an under bump metallurgy layer.

公开(公告)号：US20130249089A1

公开(公告)日：2013-09-26

申请号：US13893623

申请日：2013-05-14

Applicant: CHIPBOND TECHNOLOGY CORPORATION

Inventor： Cheng-Hung Shih ,  Yung-Wei Hsieh ,  Shu-Chen Lin ,  Cheng-Fan Lin ,  Hua-An Dai

IPC: H01L23/498

CPC classification number: H01L23/49811 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/034 ,  H01L2224/03912 ,  H01L2224/0401 ,  H01L2224/05022 ,  H01L2224/05571 ,  H01L2224/05666 ,  H01L2224/11472 ,  H01L2224/11906 ,  H01L2224/13007 ,  H01L2224/13147 ,  H01L2224/13562 ,  H01L2224/13582 ,  H01L2224/13644 ,  H01L2224/13655 ,  H01L2224/13664 ,  H01L2924/00014 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01029 ,  H01L2224/05552

Abstract: A method for manufacturing fine-pitch bumps comprises the steps of providing a silicon substrate; forming a titanium-containing metal layer on the silicon substrate, wherein the titanium-containing metal layer comprises a plurality of first zones and a plurality of second zones; forming a photoresist layer on the titanium-containing metal layer; patterning the photoresist layer to form a plurality of opening slots; forming a plurality of copper bumps at the opening slots, wherein each of the copper bumps comprises a first top surface and a ring surface; heating the photoresist layer to form a plurality of body portions and a plurality of removable portions; etching the photoresist layer; and removing the second zones to enable each of the first zones to form an under bump metallurgy layer having a bearing portion and an extending portion.

Abstract translation: 制造细间距凸块的方法包括以下步骤：提供硅衬底; 在所述硅衬底上形成含钛金属层，其中所述含钛金属层包括多个第一区和多个第二区; 在含钛金属层上形成光致抗蚀剂层; 图案化光致抗蚀剂层以形成多个开口槽; 在开口槽处形成多个铜凸块，其中每个铜凸块包括第一顶表面和环表面; 加热光致抗蚀剂层以形成多个主体部分和多个可移除部分; 蚀刻光致抗蚀剂层; 以及移除所述第二区域以使得所述第一区域中的每一个能够形成具有轴承部分和延伸部分的凸起下金属层。