VOLTAGE REGULATOR MODULE
    1.
    发明申请

    公开(公告)号:US20220078916A1

    公开(公告)日:2022-03-10

    申请号:US17530790

    申请日:2021-11-19

    Abstract: A voltage regulator module is provided. The switch circuit assembly includes two switch circuits and an input capacitor. Respective input terminals of the two switch circuits are connected with each other in parallel. The input capacitor is electrically connected with the respective input terminals of the two switch circuits in parallel and disposed between the two switch circuits. The plurality of conductive members have a first conductive member, a second conductive member and a third conductive member. The first conductive member and the third conductive member are configured to deliver an electric energy. The second conductive member is configured to deliver a signal. One end of each conductive member is electrically connected with corresponding switch circuit, and the other end of the first conductive member and the third conductive member is electrically connected with the load. The switch circuit assembly and the magnetic assembly are stacked with each other.

    Voltage regulator module
    3.
    发明授权

    公开(公告)号:US11114946B2

    公开(公告)日:2021-09-07

    申请号:US16810544

    申请日:2020-03-05

    Abstract: A voltage regulator module includes a circuit board assembly and a magnetic core assembly. The circuit board assembly includes a printed circuit board and at least one switch element. A first concave structure is concavely formed on a second surface of the printed circuit board. At least one protrusion post is disposed within the first concave structure. A pin as a positive output terminal, a pin as a positive input terminal and a pin as a negative output terminal are disposed on the second surface of the printed circuit board. The switch element is disposed on a first surface of the printed circuit board. The magnetic core assembly is accommodated within the first concave structure, and includes at least one opening. The protrusion post is penetrated through the corresponding opening. Consequently, at least one inductor is defined by the at least one protrusion post and the magnetic core assembly collaboratively.

    VOLTAGE REGULATOR MODULE
    4.
    发明申请

    公开(公告)号:US20200305285A1

    公开(公告)日:2020-09-24

    申请号:US16810406

    申请日:2020-03-05

    Abstract: A voltage regulator module includes a circuit board assembly, a magnetic core assembly and a molding compound layer. The circuit board assembly includes a printed circuit board and at least one switch element. The switch element is disposed on a first surface of the printed circuit board. Moreover, at least one first copper post, at least one second copper post, at least one third copper post and the magnetic core assembly are disposed on a second surface of the printed circuit board. The magnetic core assembly includes at least one opening. The at least one first copper post is penetrated through the corresponding opening, so that at least one inductor is defined by the at least one first copper post and the magnetic core assembly collaboratively. The molding compound layer encapsulates the printed circuit board and the magnetic core assembly in a double-sided molding manner.

    MAGNETIC COMPONENT
    5.
    发明申请

    公开(公告)号:US20250062065A1

    公开(公告)日:2025-02-20

    申请号:US18806091

    申请日:2024-08-15

    Abstract: A magnetic component is disclosed and includes a circuit board and a magnetic core set. The circuit board includes two through holes passing through a first surface and a second surface thereof. The magnetic core set includes an upper magnetic cover and a lower magnetic cover disposed on the first surface and the second surface, respectively. The upper magnetic cover includes two magnetic columns connected to the lower magnetic cover through the two through holes. The upper magnetic cover is thermally coupled to a heat dissipation device, and a volume of the upper magnetic cover is greater than that of the lower magnetic cover. A thermal resistance defined from the upper magnetic cover to the heat dissipation device is smaller than that defined from the lower magnetic cover to the heat dissipation device. It helps to make the overall heat distribution of the magnetic component more uniform.

    SUBSTRATE-FASTENING DEVICE AND SUBSTRATE-ASSEMBLING STRUCTURE USING SAME

    公开(公告)号:US20220396038A1

    公开(公告)日:2022-12-15

    申请号:US17833676

    申请日:2022-06-06

    Abstract: A substrate-fastening device and a substrate-assembling structure are disclosed. The substrate-fastening device includes a base and a fastening component. The base correspondingly carries a substrate including a perforation. The fastening component is disposed on the base, corresponds to the perforation, and includes a supporting portion, a positioning portion, a resin-attaching portion, an end portion and a fixation resin. The supporting portion is disposed on the base to support the substrate. The positioning portion is disposed on a supporting surface of the supporting portion and extended along the perforation. The resin-attaching portion is extended along the perforation. The end portion is connected to the positioning portion through the resin-attaching portion. The fixation resin is disposed around the resin-attaching portion and connected between the end portion and the positioning portion. The fixation resin covers the second surface adjacent to the perforation, and fills the gap between the resin-attaching portion and the perforation.

    POWER MODULE HAVING METALLIC HEAT-DISSIPATION SUBSTRATE

    公开(公告)号:US20210329809A1

    公开(公告)日:2021-10-21

    申请号:US17365758

    申请日:2021-07-01

    Abstract: A power module includes a power source module and a metallic heat-dissipation substrate. The power source module has an input pin and an output pin soldered on and electrically connected with a system board and includes a printed circuit board. The printed circuit board has a first surface and a second surface. At least a heat-generating component is disposed on the second surface. The metallic heat-dissipation substrate has a first surface and a second surface opposite to each other. The first surface has at least a fixing position and at least a heat-dissipating position. The fixing position is directly or indirectly connected with the second surface. A gap accumulated by tolerances is existed between the heat-dissipating position and the heat-generating component. A gap-filling material is filled into the gap. The second surface and the system board are soldered with each other. Therefore, the heat-dissipation efficiency is enhanced.

    POWER MODULE ASSEMBLY
    8.
    发明公开

    公开(公告)号:US20230397382A1

    公开(公告)日:2023-12-07

    申请号:US18203191

    申请日:2023-05-30

    CPC classification number: H05K7/209 H05K7/20463 H05K7/20509

    Abstract: A power module assembly is disposed on a substrate and dissipates heat generated through the substrate. The power module assembly includes a circuit board, a heat-generating device, a first metal block, a first filling material and a second filling material. The circuit board includes at least one plane. The heat-generating device is disposed on the plane. The first metal block includes a first side and a second side. The first side of the first metal block faces the heat-generating device, and the second side of the first metal block faces the substrate. The first filling material is disposed between the first side of the first metal block and the heat-generating device. The second filling material is disposed between the second side of the first metal block and the substrate.

    Power module having metallic heat-dissipation substrate

    公开(公告)号:US11122714B2

    公开(公告)日:2021-09-14

    申请号:US16589874

    申请日:2019-10-01

    Abstract: A power module includes a power source module and a metallic bottom heat-dissipation substrate. The power source module has an input pin and an output pin soldered on and electrically connected with a system board and includes a printed circuit board. The printed circuit board has a top surface and a bottom surface. At least a heat-generating component is disposed on the bottom surface. The metallic bottom heat-dissipation substrate has an upper surface and a lower surface opposite to each other. The upper surface has at least a fixing position and at least a heat-dissipating position. The fixing position is directly or indirectly connected with the bottom surface. A gap accumulated by tolerances is existed between the heat-dissipating position and the heat-generating component. A gap-filling material is filled into the gap. The lower surface and the system board are soldered with each other. Therefore, the heat-dissipation efficiency is enhanced.

    VOLTAGE REGULATOR MODULE
    10.
    发明申请

    公开(公告)号:US20200304036A1

    公开(公告)日:2020-09-24

    申请号:US16810544

    申请日:2020-03-05

    Abstract: A voltage regulator module includes a circuit board assembly and a magnetic core assembly. The circuit board assembly includes a printed circuit board and at least one switch element. A first concave structure is concavely formed on a second surface of the printed circuit board. At least one protrusion post is disposed within the first concave structure. A pin as a positive output terminal, a pin as a positive input terminal and a pin as a negative output terminal are disposed on the second surface of the printed circuit board. The switch element is disposed on a first surface of the printed circuit board. The magnetic core assembly is accommodated within the first concave structure, and includes at least one opening. The protrusion post is penetrated through the corresponding opening. Consequently, at least one inductor is defined by the at least one protrusion post and the magnetic core assembly collaboratively.

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