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公开(公告)号：US20090044838A1
公开(公告)日：2009-02-19
申请号：US12249954
申请日：2008-10-12
Applicant: Bruce Willing , Daniel P. Forster , David Datong Huo , Robert D. Tolles , Christopher L. Haynes , Steven T. Mear , David Paul , William M. Evans
Inventor： Bruce Willing , Daniel P. Forster , David Datong Huo , Robert D. Tolles , Christopher L. Haynes , Steven T. Mear , David Paul , William M. Evans
IPC: B08B3/08
CPC classification number: B08B3/04 , B08B3/08 , B08B2203/005 , C02F1/78 , C02F9/005 , C02F2103/02 , C02F2201/782 , C11D11/0047 , G03F7/423 , H01L21/6704
Abstract: In a first aspect, an apparatus adapted to clean a semiconductor device manufacturing component is provided. The apparatus includes an ozone module adapted to (1) obtain Ozone; (2) combine the Ozone with a fluid to generate ozonated fluid; and (3) deliver the ozonated fluid to the semiconductor device manufacturing component so as to clean the semiconductor device manufacturing component. Numerous other aspects are provided.
Abstract translation: 在第一方面，提供一种适于清洁半导体器件制造部件的装置。 该装置包括适于（1）获得臭氧的臭氧模块; （2）将臭氧与流体混合以产生臭氧化流体; 和（3）将臭氧化流体输送到半导体器件制造部件以清洁半导体器件制造部件。 提供了许多其他方面。
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公开(公告)号：US07547243B2
公开(公告)日：2009-06-16
申请号：US11840499
申请日：2007-08-17
Applicant: Andreas Norbert Wiswesser , Ramiel Oshana , Kerry F. Hughes , Jay Rohde , David Datong Huo , Dominic J. Benvegnu
Inventor： Andreas Norbert Wiswesser , Ramiel Oshana , Kerry F. Hughes , Jay Rohde , David Datong Huo , Dominic J. Benvegnu
IPC: B24B49/12
CPC classification number: B24B37/205 , B24B37/013 , B24B49/12
Abstract: A polishing layer of a polishing has a window member with a top surface positioned a predetermined distance below the polishing surface. A transparent layer can be positioned below the polishing layer and supporting the window member.
Abstract translation: 研磨抛光层具有窗构件，其顶表面位于抛光表面下方预定的距离处。 透明层可以位于抛光层下方并支撑窗构件。
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3.发明授权Method and apparatus for baking out a gate valve in a semiconductor processing system 失效在半导体处理系统中烘烤闸阀的方法和装置公开(公告)号：US06274854B1
公开(公告)日：2001-08-14
申请号：US09371804
申请日：1999-08-10
Applicant: Timothy Joseph Franklin , David Datong Huo
Inventor： Timothy Joseph Franklin , David Datong Huo
IPC: H05B302
CPC classification number: F16K51/02 , F04B37/08 , F16K49/002 , Y10T137/6606
Abstract: A device for achieving vacuum conditions more quickly in a semiconductor processing system having a vacuum pump, a gate valve and a chamber includes a rigid body containing heating elements that contact the surface of the gate valve. The device may include a U-shaped retainer clip for holding the device to the gate valve. A method for heating a gate valve to drive off contaminants involves heating the lower portion of the gate valve to drive contaminants towards the vacuum pump.
Abstract translation: 在具有真空泵，闸阀和室的半导体处理系统中，能够更快地实现真空条件的装置包括刚性体，其包含接触闸阀表面的加热元件。 该装置可以包括用于将装置保持在闸阀上的U形保持夹。 用于加热闸阀以驱除污染物的方法包括加热闸阀的下部以将污染物驱动到真空泵。
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公开(公告)号：US07264536B2
公开(公告)日：2007-09-04
申请号：US10669544
申请日：2003-09-23
Applicant: Andreas Norbert Wiswesser , Ramiel Oshana , Kerry F. Hughes , Jay Rohde , David Datong Huo , Dominic J. Benvegnu
Inventor： Andreas Norbert Wiswesser , Ramiel Oshana , Kerry F. Hughes , Jay Rohde , David Datong Huo , Dominic J. Benvegnu
IPC: B24B49/12
CPC classification number: B24B37/205 , B24B37/013 , B24B49/12
Abstract: A polishing layer of a polishing has a window member with a top surface positioned a predetermined distance below the polishing surface. A transparent layer can be positioned below the polishing layer and supporting the window member.
Abstract translation: 研磨抛光层具有窗构件，其顶表面位于抛光表面下方预定的距离处。 透明层可以位于抛光层下方并支撑窗构件。
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公开(公告)号：US6162297A
公开(公告)日：2000-12-19
申请号：US924205
申请日：1997-09-05
Applicant: Donald M. Mintz , Anantha Subramani , Lolita Sharp , David Datong Huo
Inventor： Donald M. Mintz , Anantha Subramani , Lolita Sharp , David Datong Huo
CPC classification number: C23C16/4404 , C23C14/564
Abstract: A semiconductor fabrication equipment component which is exposed to a film layer fabrication environment exhibits a surface which is embossed with a pattern to provide an enhanced surface area for particle retention. The component is fabricatable using numerous embossing techniques, including knurling. The embossed surface provides the enhanced surface area without imposing a particle load on the treated part.
Abstract translation: 暴露于膜层制造环境的半导体制造设备部件表现出压花图案的表面，以提供用于颗粒保留的增强的表面积。 该组件可使用许多压花技术制造，包括滚花。 压花表面提供增强的表面积，而不会在处理的部件上施加颗粒负荷。
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Patent Agency Ranking
公开(公告)号：US07503837B2
公开(公告)日：2009-03-17
申请号：US11682257
申请日：2007-03-05
Applicant: Jeonghoon Oh , Hung Chih Chen , Thomas B. Brezoczky , Douglas R. McAllister , David Datong Huo
Inventor： Jeonghoon Oh , Hung Chih Chen , Thomas B. Brezoczky , Douglas R. McAllister , David Datong Huo
IPC: B24B29/00
CPC classification number: B24B37/32
Abstract: A two part retaining ring is described that has a lower ring and an upper ring. The lower ring contacts a polishing surface during chemical mechanical polishing. The upper surface and the lower surface of the lower ring have thick and thin subportions to increase the flexibility of the lower ring.
Abstract translation: 描述了具有下环和上环的两部分保持环。 在化学机械抛光期间，下环接触抛光表面。 下环的上表面和下表面具有厚而薄的子部分，以增加下环的柔性。
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公开(公告)号：US07186171B2
公开(公告)日：2007-03-06
申请号：US11407695
申请日：2006-04-19
Applicant: Jeonghoon Oh , Hung Chih Chen , Thomas B. Brezoczky , Douglas R. McAllister , David Datong Huo
Inventor： Jeonghoon Oh , Hung Chih Chen , Thomas B. Brezoczky , Douglas R. McAllister , David Datong Huo
IPC: B24B29/00
CPC classification number: B24B37/32
Abstract: A two part retaining ring is described that has a lower ring and an upper ring. The lower ring contacts a polishing surface during chemical mechanical polishing. The upper surface and the lower surface of the lower ring have matching grooves formed therein to increase the flexibility of the lower ring.
Abstract translation: 描述了具有下环和上环的两部分保持环。 在化学机械抛光期间，下环接触抛光表面。 下环的上表面和下表面具有形成在其中的匹配凹槽，以增加下环的柔性。
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8.发明授权Method and apparatus for positioning a restrictor shield of a pump in response to an electric signal 失效响应于电信号定位泵的限流器屏蔽的方法和装置
公开(公告)号：US6000415A
公开(公告)日：1999-12-14
申请号：US855827
申请日：1997-05-12
Applicant: David Datong Huo , Bret W. Adams , John Jarvis
Inventor： David Datong Huo , Bret W. Adams , John Jarvis
CPC classification number: F16K51/00 , F04B37/08 , F04B2205/08 , Y10T137/0318
Abstract: Apparatus, positioned at an inlet port to a pump, for shielding the pump from a process chamber of a semiconductor wafer processing system, where the apparatus has a controllably variable effective throughput area, and method for electrically controlling the size of the effective throughput area. Specifically, the apparatus is a controllable restrictor shield supported by an actuator, having a first effective throughput area and a second effective throughput area, where the first effective throughput area is typically less than the second effective throughput area. The size of the effective throughput area is directly responsive to an electric signal that controls the actuator.
Abstract translation: 装置，位于泵的入口处，用于将泵从半导体晶片处理系统的处理室屏蔽，其中该装置具有可控制的有效吞吐量面积，以及用于电控制有效吞吐量区域的尺寸的方法。 具体地，该装置是由致动器支撑的可控制的限制器屏蔽物，其具有第一有效吞吐量区域和第二有效吞吐量区域，其中第一有效吞吐量区域通常小于第二有效吞吐量区域。 有效吞吐量区域的大小直接响应于控制致动器的电信号。
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9.发明授权Method and apparatus for baking out a gate valve in a semiconductor processing system 失效在半导体处理系统中烘烤闸阀的方法和装置
公开(公告)号：US5965046A
公开(公告)日：1999-10-12
申请号：US635094
申请日：1996-04-17
Applicant: Timothy Joseph Franklin , David Datong Huo
Inventor： Timothy Joseph Franklin , David Datong Huo
CPC classification number: F16K51/02 , F04B37/08 , F16K49/002 , Y10T137/6606
Abstract: A device for achieving vacuum conditions more quickly in a semiconductor processing system having a vacuum pump, a gate valve and a chamber includes a rigid body containing heating elements that contact the surface of the gate valve. The device may include a U-shaped retainer clip for holding the device to the gate valve. A method for heating a gate valve to drive off contaminants involves heating the lower portion of the gate valve to drive contaminants towards the vacuum pump.
Abstract translation: 在具有真空泵，闸阀和室的半导体处理系统中，能够更快地实现真空条件的装置包括刚性体，其包含接触闸阀表面的加热元件。 该装置可以包括用于将装置保持在闸阀上的U形保持夹。 用于加热闸阀以驱除污染物的方法包括加热闸阀的下部以将污染物驱动到真空泵。
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公开(公告)号：US5901751A
公开(公告)日：1999-05-11
申请号：US612651
申请日：1996-03-08
Applicant: David Datong Huo
Inventor： David Datong Huo
CPC classification number: F04B37/08 , C23C14/564 , F16K31/002
Abstract: Apparatus, positioned at an inlet port to a pump, for shielding the pump from a process chamber of a semiconductor wafer processing system, where the apparatus has a variable effective throughput area. Specifically, the apparatus is a restrictor shield having a first effective throughput area during processing and a second effective throughput area during bakeout, where the first effective throughput area is typically less than the second effective throughput area. The selection of the effective throughput area is directly responsive to the temperature within the process chamber.
Abstract translation: 设备位于泵的入口处，用于将泵从半导体晶片处理系统的处理室屏蔽，其中该设备具有可变的有效吞吐量区域。 具体地，该设备是在处理期间具有第一有效吞吐量区域的限制器屏蔽和在烘烤期间的第二有效吞吐量区域，其中第一有效吞吐量区域通常小于第二有效吞吐量区域。 有效吞吐量区域的选择直接响应于处理室内的温度。
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