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公开(公告)号:US20170338130A1
公开(公告)日:2017-11-23
申请号:US15522499
申请日:2015-10-29
Applicant: ENTEGRIS, INC.
Inventor: Karl W. OLANDER , Ying TANG , Barry Lewis CHAMBERS , Steven E. BISHOP
IPC: H01L21/67 , H01L21/66 , C23C14/48 , H01J37/317 , H01L21/265
CPC classification number: H01L21/67017 , C23C14/48 , H01J37/3171 , H01J2237/006 , H01J2237/1825 , H01J2237/31701 , H01L21/26513 , H01L21/67253 , H01L22/20
Abstract: An ion implantation system is described, including: an ion implanter comprising a housing defining an enclosed volume in which is positioned a gas box configured to hold one or more gas supply vessels, the gas box being in restricted gas flow communication with gas in the enclosed volume that is outside the gas box; a first ventilation assembly configured to flow ventilation gas through the housing and to exhaust the ventilation gas from the housing to an ambient environment of the ion implanter; a second ventilation assembly configured to exhaust gas from the gas box to a treatment apparatus that is adapted to at least partially remove contaminants from the gas box exhaust gas, or that is adapted to dilute the gas box exhaust gas, to produce a treated effluent gas, the second ventilation assembly comprising a variable flow control device for modulating flow rate of the gas box exhaust gas between a relatively lower gas box exhaust gas flow rate and a relatively higher gas box exhaust gas flow rate, and a motive fluid driver adapted to flow the gas box exhaust gas through the variable flow control device to the treatment apparatus; and a monitoring and control assembly configured to monitor operation of the ion implanter for occurrence of a gas hazard event, and thereupon to responsively prevent gas-dispensing operation of the one or more gas supply vessels, and to modulate the variable flow control device to the relatively higher gas box exhaust gas flow rate so that the motive fluid driver flows the gas box exhaust gas to the treatment apparatus at the relatively higher gas box exhaust gas flow rate. Preferably, in a gas hazard event, the shell exhaust discharge from the housing is also terminated, to facilitate exhausting all gas within the housing, outside as well as inside the gas box, to the treatment unit.
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公开(公告)号:US20220108863A1
公开(公告)日:2022-04-07
申请号:US17492089
申请日:2021-10-01
Applicant: Entegris, Inc.
Inventor: Ying TANG , Joe R. DESPRES , Joseph D. SWEENEY , Oleg BYL , Barry Lewis CHAMBERS
Abstract: Described are ion implantation devices, systems, and methods, and in particular to an ion source that is useful for generating an aluminum ion beam.
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公开(公告)号:US20180119888A1
公开(公告)日:2018-05-03
申请号:US15573020
申请日:2016-05-11
Applicant: ENTEGRIS, INC.
Inventor: Daneil ELZER , Ying TANG , Barry Lewis CHAMBERS , Joseph D. SWEENEY , Shaun M. WILSON , Steven ULANECKI , Steven E. BISHOP , James V. MCMANUS , Karl W. OLANDER , Edward E. JONES , Oleg BYL , Joseph R. DESPRES , Christopher SCANNELL
IPC: F17C13/04
CPC classification number: F17C13/04 , F17C11/00 , F17C2201/0114 , F17C2201/0119 , F17C2201/058 , F17C2203/0617 , F17C2205/0308 , F17C2205/0329 , F17C2205/0335 , F17C2205/0338 , F17C2205/0385 , F17C2205/0391
Abstract: Fluid dispensing assemblies are disclosed, for use in fluid supply packages in which such fluid dispensing assemblies as coupled to fluid supply vessels, for dispensing of fluids such as semiconductor manufacturing fluids. The fluid dispensing assemblies in specific implementations are configured to prevent application of excessive force to valve elements in the fluid dispensing assemblies, and/or for avoiding inadvertent or accidental open conditions of vessels that may result in leakage of toxic or otherwise hazardous or valuable gas. Also described are alignment devices for assisting coupling of coupling elements, e.g., coupling elements of fluid supply packages of the foregoing type, so that damage to such couplings as a result of misalignment is avoided.
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公开(公告)号:US20180149315A1
公开(公告)日:2018-05-31
申请号:US15574617
申请日:2016-05-16
Applicant: ENTEGRIS, INC.
Inventor: Joseph R. DESPRES , Barry Lewis CHAMBERS , Joseph D. Sweeney , Richard S. RAY , Steven E. BISHOP
CPC classification number: F17C7/00 , F17C11/00 , F17C13/00 , F17C13/025 , F17C13/026 , F17C13/084 , F17C2205/0107 , F17C2205/0142 , F17C2205/0176 , F17C2221/03 , F17C2223/0123 , F17C2225/0123 , F17C2227/0107 , F17C2227/042 , F17C2250/032 , F17C2250/043 , F17C2250/0439 , F17C2250/0443 , F17C2250/0447 , F17C2250/0626 , F17C2250/0631 , F17C2270/0518 , H01L21/67 , H01L21/67017
Abstract: Gas supply systems and methods are described for delivery of gas to gas-utilizing process tools, e.g., gas-utilizing tools for manufacturing of semiconductor products, flat-panel displays, solar panels, etc. The gas supply systems may comprise gas cabinets that are arranged with adsorbent-based and/or interiorly pressure-regulated gas supply vessels therein, and a gas mixing manifold is described, which may be disposed in the gas cabinet or operated in a standalone fashion. In one aspect, gas supply systems are described in which vessels susceptible to cooling involving diminution of gas supply pressure are processed after pressure-controlled termination of dispensing operation, for dispensing operation achieving utilization of gas remaining in the vessel after such termination.
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