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公开(公告)号:US20130344292A1
公开(公告)日:2013-12-26
申请号:US13948364
申请日:2013-07-23
Applicant: FEI Company
Inventor: Cliff Bugge , Greg Clark , Todd Hanson , Scott Edward Fuller , Jason Donald
IPC: H01J37/30
CPC classification number: H01J37/30 , H01J37/28 , H01J37/3045 , H01J2237/2811 , H01J2237/31732 , H01J2237/31745 , H01J2237/31749 , Y10T428/24488 , Y10T428/24802
Abstract: A method and system for forming and using a fiducial on a sample to locate an area of interest on the sample, the method comprising forming a fiducial by depositing a block of material on a sample proximal to an area of interest on the sample, the block of material extending from the surface of the sample to a detectable extent above the surface of the sample; and milling, using a charged particle beam, a predetermined pattern into at least two exposed faces of the block of material; subsequent to forming the fiducial, detecting the location of the area of interest by detecting the location of the fiducial; and subsequent to detecting the location of the area of interest, imaging or milling the area of interest with a charged particle beam.
Abstract translation: 一种用于在样品上形成和使用基准以定位样品上的感兴趣区域的方法和系统,所述方法包括通过在样品上靠近感兴趣区域的样品上沉积材料块形成基准,所述块 的材料从样品的表面延伸到样品表面上方的可检测范围; 并使用带电粒子束将预定图案研磨成材料块的至少两个暴露面; 在形成基准之后,通过检测基准的位置来检测感兴趣区域的位置; 并且随后检测感兴趣区域的位置,用带电粒子束成像或研磨感兴趣区域。
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公开(公告)号:US11069509B1
公开(公告)日:2021-07-20
申请号:US16819945
申请日:2020-03-16
Applicant: FEI Company
Inventor: James Clarke , Brian Routh, Jr. , Micah LeDoux , Cliff Bugge
IPC: H01J37/304 , H01J37/305 , G01N1/32 , G01N23/2202 , H01J37/22 , H01J37/28 , G01N23/2251
Abstract: The backside of a planar view lamella is prepared from a sample extracted from a workpiece. The sample includes multiple device layers and a substrate layer. After removing at least a part of the substrate layer covering a final device layer to obtain a sample surface, a region of interest (ROI) relative to the sample surface is alternately scanned with an electron beam and spontaneously etched until the final device layer within the ROI is exposed. One or more device layers may be removed from the sample backside after the final device layer is exposed to obtain the backside of the planar view lamella.
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公开(公告)号:US09378925B2
公开(公告)日:2016-06-28
申请号:US14869553
申请日:2015-09-29
Applicant: FEI Company
Inventor: Jeffrey Blackwood , Matthew Bray , Corey Senowitz , Cliff Bugge
IPC: H01J37/00 , H01J37/305 , G01N1/28 , H01J37/26
CPC classification number: H01J37/3056 , G01N1/286 , G01N2001/2886 , H01J37/261 , H01J2237/31745
Abstract: An improved method of preparing ultra-thin TEM samples that combines backside thinning with an additional cleaning step to remove surface defects on the FIB-facing substrate surface. This additional step results in the creation of a cleaned, uniform “hardmask” that controls the ultimate results of the sample thinning, and allows for reliable and robust preparation of samples having thicknesses down to the 10 nm range.
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公开(公告)号:US12165832B2
公开(公告)日:2024-12-10
申请号:US17566894
申请日:2021-12-31
Applicant: FEI Company
Inventor: Adam Stokes , Cliff Bugge , Brandon Van Leer , Valerie Brogden , Chengge Jiao , Letian Li , David Donnet
IPC: H01J37/20 , H01J37/244 , H01J37/28
Abstract: Methods and systems for performing sample lift-out and protective cap placement for highly reactive materials within charged particle microscopy systems are disclosed herein. Methods include preparing a nesting void in a support structure, translating at least a portion of a sample into the nesting void, and milling material from a region of the support structure that defines the nesting void. The material from the region of the support structure is milled such that at least some of the removed material redeposits to form an attachment bond between the sample and a remaining portion of the support structure. In various embodiments, the sample can then be investigated using one or more of serial sectioning tomography on the sample, enhanced insertable backscatter detector (CBS) analysis on the sample, and electron backscatter diffraction (EBSD) analysis on the sample.
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公开(公告)号:US20160020069A1
公开(公告)日:2016-01-21
申请号:US14869553
申请日:2015-09-29
Applicant: FEI Company
Inventor: Jeffrey Blackwood , Matthew Bray , Corey Senowitz , Cliff Bugge
IPC: H01J37/305 , G01N1/28 , H01J37/26
CPC classification number: H01J37/3056 , G01N1/286 , G01N2001/2886 , H01J37/261 , H01J2237/31745
Abstract: An improved method of preparing ultra-thin TEM samples that combines backside thinning with an additional cleaning step to remove surface defects on the FIB-facing substrate surface. This additional step results in the creation of a cleaned, uniform “hardmask” that controls the ultimate results of the sample thinning, and allows for reliable and robust preparation of samples having thicknesses down to the 10 nm range.
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公开(公告)号:US08822957B2
公开(公告)日:2014-09-02
申请号:US13948364
申请日:2013-07-23
Applicant: FEI Company
Inventor: Cliff Bugge , Greg Clark , Todd Hanson , Scott Edward Fuller , Jason Donald
IPC: H01J37/30
CPC classification number: H01J37/30 , H01J37/28 , H01J37/3045 , H01J2237/2811 , H01J2237/31732 , H01J2237/31745 , H01J2237/31749 , Y10T428/24488 , Y10T428/24802
Abstract: A method and system for forming and using a fiducial on a sample to locate an area of interest on the sample, the method comprising forming a fiducial by depositing a block of material on a sample proximal to an area of interest on the sample, the block of material extending from the surface of the sample to a detectable extent above the surface of the sample; and milling, using a charged particle beam, a predetermined pattern into at least two exposed faces of the block of material; subsequent to forming the fiducial, detecting the location of the area of interest by detecting the location of the fiducial; and subsequent to detecting the location of the area of interest, imaging or milling the area of interest with a charged particle beam.
Abstract translation: 一种用于在样品上形成和使用基准以定位样品上的感兴趣区域的方法和系统,所述方法包括通过在样品上靠近感兴趣区域的样品上沉积材料块形成基准,所述块 的材料从样品的表面延伸到样品表面上方的可检测范围; 并使用带电粒子束将预定图案研磨成材料块的至少两个暴露面; 在形成基准之后,通过检测基准的位置来检测感兴趣区域的位置; 并且随后检测感兴趣区域的位置,用带电粒子束成像或研磨感兴趣区域。
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公开(公告)号:US09177760B2
公开(公告)日:2015-11-03
申请号:US14502522
申请日:2014-09-30
Applicant: FEI Company
Inventor: Jeffrey Blackwood , Matthew Bray , Corey Senowitz , Cliff Bugge
IPC: H01J37/00 , H01J37/305 , G01N1/28 , H01J37/26
CPC classification number: H01J37/3056 , G01N1/286 , G01N2001/2886 , H01J37/261 , H01J2237/31745
Abstract: An improved method of preparing ultra-thin TEM samples that combines backside thinning with an additional cleaning step to remove surface defects on the FIB-facing substrate surface. This additional step results in the creation of a cleaned, uniform “hardmask” that controls the ultimate results of the sample thinning, and allows for reliable and robust preparation of samples having thicknesses down to the 10 nm range.
Abstract translation: 一种改进的制备超薄TEM样品的方法,其结合了背面变薄与额外的清洁步骤,以去除面向FIB的衬底表面上的表面缺陷。 这个额外的步骤导致创建一个清洁,统一的“硬掩模”来控制样品稀化的最终结果,并且允许对厚度低至10nm范围的样品进行可靠和鲁棒的准备。
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公开(公告)号:US20150053548A1
公开(公告)日:2015-02-26
申请号:US14502522
申请日:2014-09-30
Applicant: FEI Company
Inventor: Jeffrey Blackwood , Matthew Bray , Corey Senowitz , Cliff Bugge
IPC: H01J37/305 , H01J37/26
CPC classification number: H01J37/3056 , G01N1/286 , G01N2001/2886 , H01J37/261 , H01J2237/31745
Abstract: An improved method of preparing ultra-thin TEM samples that combines backside thinning with an additional cleaning step to remove surface defects on the FIB-facing substrate surface. This additional step results in the creation of a cleaned, uniform “hardmask” that controls the ultimate results of the sample thinning, and allows for reliable and robust preparation of samples having thicknesses down to the 10 nm range.
Abstract translation: 一种改进的制备超薄TEM样品的方法,其结合了背面变薄与额外的清洁步骤,以去除面向FIB的衬底表面上的表面缺陷。 这个额外的步骤导致创建一个清洁,统一的“硬掩模”来控制样品稀化的最终结果,并且允许对厚度低至10nm范围的样品进行可靠和鲁棒的准备。
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公开(公告)号:US20180247793A1
公开(公告)日:2018-08-30
申请号:US15903370
申请日:2018-02-23
Applicant: FEI Company
Inventor: Michael Schmidt , Cliff Bugge
IPC: H01J37/305 , H01J37/30 , G01N1/28
CPC classification number: H01J37/3053 , G01N1/286 , G01N2001/2873 , H01J37/3005 , H01J2237/31745
Abstract: Embodiments are directed to a method and charged particle beam system for forming views for an electron microscope. Embodiments include milling a first surface at least in the local area of a feature of interest using an ion beam directed at a first angle to make the first surface at least in the local area of the feature of interest substantially planar, wherein the first angle between the ion beam and the first surface is equal to or less than ten degrees; subsequent to milling the first surface, milling the sample using the ion beam directed at a second angle to expose a second surface, the second surface comprising a cross-section of the feature of interest; and forming an image of the second surface by directing an electron beam to the second surface and detecting the interaction of the electron beam with the second surface.
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