公开(公告)号：US20180138615A1

公开(公告)日：2018-05-17

申请号：US15812765

申请日：2017-11-14

Applicant: Hirose Electric Co., Ltd.

Inventor： Teppei MATSUMOTO

IPC: H01R12/72 ,  H05K1/02 ,  H01R12/75 ,  H01R12/70 ,  H05K1/18 ,  H01R13/646 ,  H05K3/18 ,  H05K3/30 ,  H01P5/08

CPC classification number: H01R12/722 ,  H01P5/085 ,  H01R9/0515 ,  H01R12/7047 ,  H01R12/75 ,  H01R13/646 ,  H05K1/0242 ,  H05K1/0253 ,  H05K1/18 ,  H05K1/181 ,  H05K3/18 ,  H05K3/301 ,  H05K2201/0919 ,  H05K2201/093 ,  H05K2201/10189 ,  H05K2201/10409

Abstract: A structure that includes a board and a connector secured to an end portion of the board. The board has a first dielectric layer, a signal pattern that is provided on the top face of the first dielectric layer, a first ground layer that is provided under the first dielectric layer and forms part of a signal transmission circuit in conjunction with the signal pattern, and a plating film formed on an end face of the end portion of the board in an area located directly under the signal pattern and includes an end face of the first ground layer. The connector has a center conductor, an outer conductor, and securing portions that secure the connector to an end portion of the board. When the connector is secured, the center conductor comes in contact with the signal pattern and the plating film comes in contact with the outer conductor.