公开(公告)号：US20130192884A1

公开(公告)日：2013-08-01

申请号：US13685777

申请日：2012-11-27

Applicant: IBIDEN Co., Ltd.

Inventor： Toshiki FURUTANI ,  Yukinobu MIKADO ,  Mitsuhiro TOMIKAWA

IPC: H05K1/18

CPC classification number: H05K1/181 ,  H01L24/19 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16227 ,  H01L2924/15311 ,  H01L2924/3511 ,  H05K1/0231 ,  H05K1/185 ,  H05K3/4697 ,  H05K2201/09527 ,  H05K2201/096

Abstract: A printed wiring board includes a core substrate, an electronic component accommodated in the substrate, a first buildup structure formed on surface of the substrate and including an interlayer insulation layer, and a second buildup structure formed on the opposing surface of the substrate and including an interlayer insulation layer. The substrate includes a core material portion including multiple resin layers, a first conductive layer formed on first surface of the core portion and a second conductive layer formed on second surface of the core portion, the core portion has opening through the resin layers and accommodating the component, the insulation layer of the first structure is positioned such that the opening of the core portion is covered on the first surface, and the insulation layer of the second structure is positioned such that the opening of the core portion is covered on the second surface.

Abstract translation: 印刷电路板包括芯基板，容纳在基板中的电子部件，形成在基板的表面上并且包括层间绝缘层的第一累积结构和形成在基板的相对表面上的第二累积结构， 层间绝缘层。 基板包括具有多个树脂层的芯材部分，形成在芯部的第一表面上的第一导电层和形成在芯部的第二表面上的第二导电层，芯部具有通过树脂层的开口并容纳 第一结构的绝缘层被定位成使得芯部的开口被覆盖在第一表面上，并且第二结构的绝缘层被定位成使得芯部的开口被覆盖在第二表面上 。

公开(公告)号：US20160143134A1

公开(公告)日：2016-05-19

申请号：US14943340

申请日：2015-11-17

Applicant: IBIDEN CO., LTD.

Inventor： Mitsuhiro TOMIKAWA ,  Koji ASANO ,  Kotaro TAKAGI

IPC: H05K1/03 ,  H05K3/00 ,  H05K3/40 ,  H05K1/11

CPC classification number: H05K1/0204 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K1/0206 ,  H05K1/181 ,  H05K1/185 ,  H05K3/3436 ,  H05K3/4644 ,  H05K3/4697 ,  H05K2201/094 ,  H05K2201/10015 ,  H05K2201/10416 ,  H05K2201/10515 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: A wiring board with built-in metal block includes a substrate having a cavity penetrating through the substrate, a metal block accommodated in the cavity and having first surface, second surface, and side surface connecting outer edges of the first and second surface, filling resin filling gap between inner side surface of the substrate in the cavity and the side surface of the block, a first build-up layer laminated on first surface of the substrate and including an insulating layer such that the first layer is covering the cavity and the first surface of the block, and a second build-up layer laminated on second surface of the substrate and including an insulating layer such that the second layer is covering the cavity and the second surface of the block. The side surface of the block is recessed such that the side surface of the block is forming a groove shape.

Abstract translation: 具有内置金属块的布线板包括具有穿透基板的空腔的基板，容纳在空腔中的金属块，并且具有连接第一和第二表面的外边缘的第一表面，第二表面和侧表面，填充树脂 填充空腔中的基板的内侧表面和块的侧表面之间的间隙，层压在基板的第一表面上的第一堆积层，并且包括绝缘层，使得第一层覆盖空腔和第一 所述块的表面以及层压在所述基板的第二表面上的第二堆积层，并且包括绝缘层，使得所述第二层覆盖所述空腔和所述块的所述第二表面。 块体的侧表面凹陷，使得块体的侧表面形成凹槽形状。

公开(公告)号：US20160007468A1

公开(公告)日：2016-01-07

申请号：US14791735

申请日：2015-07-06

Applicant: IBIDEN CO., LTD.

Inventor： Mitsuhiro TOMIKAWA ,  Koji ASANO

IPC: H05K1/18 ,  H05K3/40 ,  H05K3/00 ,  H05K1/11

CPC classification number: H05K1/183 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/181 ,  H05K1/0204 ,  H05K1/0206 ,  H05K1/115 ,  H05K3/0014 ,  H05K3/4046 ,  H05K3/4084 ,  H05K3/4602 ,  H05K3/4697 ,  H05K2201/10416 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: A circuit substrate includes a core substrate having cavity, metal blocks in the cavity, first and second build-up layers including insulating layers and laminated on first and second sides of the core substrate such that the insulating layers are covering the cavity, and a filling resin filling gap formed between the cavity and metal blocks in the cavity. The cavity is penetrating through the core substrate, the core substrate has an intracavity projection structure projecting from one or more side surfaces of the cavity such that the projection structure is positioned between the metal blocks and separating the metal blocks from contacting each other in the cavity, the first build-up layer has first conductors connected to the metal blocks such that each first conductor conducts electricity or heat, and the second build-up layer has second conductors connected to the metal blocks such that each second conductor conducts electricity or heat.

Abstract translation: 电路基板包括具有空腔的芯基板，空腔中的金属块，第一和第二堆积层包括绝缘层，并且层叠在芯基板的第一和第二侧上，使得绝缘层覆盖空腔，并且填充 空腔中的空腔和金属块之间形成树脂填充间隙。 空腔穿透芯基板，芯基板具有从空腔的一个或多个侧表面突出的腔内投影结构，使得突出结构位于金属块之间并且分离金属块以在空腔中彼此接触 第一累积层具有连接到金属块的第一导体，使得每个第一导体传导电或热，并且第二堆积层具有连接到金属块的第二导体，使得每个第二导体导电或加热。

公开(公告)号：US20160021753A1

公开(公告)日：2016-01-21

申请号：US14802139

申请日：2015-07-17

Applicant: IBIDEN CO., LTD.

Inventor： Mitsuhiro TOMIKAWA ,  Koji ASANO

IPC: H05K1/18 ,  H05K3/00 ,  H05K3/30 ,  H05K3/46 ,  H05K1/02 ,  H05K1/11

CPC classification number: H05K3/4697 ,  H01L21/568 ,  H01L2224/04105 ,  H01L2224/16227 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2225/1023 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2225/1094 ,  H01L2924/15311 ,  H01L2924/15331 ,  H05K1/0206 ,  H05K1/162 ,  H05K1/185 ,  H05K3/3436 ,  H05K3/4644 ,  H05K2201/10 ,  H05K2201/10045 ,  H05K2201/10416 ,  H01L2924/00014

Abstract: A circuit substrate includes a core substrate having a cavity penetrating through the substrate, a combined component accommodated in the cavity of the substrate, a first build-up layer laminated on first surface of the substrate and including an insulating layer such that the insulating layer is covering the cavity, a second build-up layer laminated on second surface of the substrate and including an insulating layer such that the insulating layer is covering the cavity, and a filling resin filling gap formed between the cavity and combined component accommodated in the cavity of the substrate. The combined component includes an electronic component and a metal block, the electronic component has terminal surface on side facing the first surface of the substrate, and the metal block is superposed to surface of the electronic component on the opposite side of the electronic component with respect to the terminal surface.

Abstract translation: 电路基板包括具有穿透基板的空腔的芯基板，容纳在基板的空腔中的组合部件，层叠在基板的第一表面上并且包括绝缘层的第一累积层，使得绝缘层为 覆盖空腔，层叠在基板的第二表面上的第二堆叠层，并且包括绝缘层，使得绝缘层覆盖空腔;以及填充树脂填充间隙，其形成在容纳在空腔中的空腔和组合部件之间 底物。 组合部件包括电子部件和金属块，电子部件具有面向基板的第一表面的端面，并且金属块与电子部件的相对侧的电子部件的表面重叠 到终端表面。

公开(公告)号：US20160007451A1

公开(公告)日：2016-01-07

申请号：US14791641

申请日：2015-07-06

Applicant: IBIDEN CO., LTD.

Inventor： Mitsuhiro TOMIKAWA ,  Koji ASANO

IPC: H05K1/02 ,  H05K3/46 ,  H05K1/11 ,  H05K3/44 ,  H05K1/18 ,  H05K3/30 ,  H05K3/42

CPC classification number: H05K3/4602 ,  H01L21/568 ,  H01L23/3735 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L24/19 ,  H01L24/25 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L25/105 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16227 ,  H01L2224/2518 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1094 ,  H01L2924/00014 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/19105 ,  H05K1/0204 ,  H05K1/0298 ,  H05K1/115 ,  H05K1/185 ,  H05K3/30 ,  H05K3/429 ,  H05K3/445 ,  H05K3/4644 ,  H05K2201/0187 ,  H05K2201/09536 ,  H05K2201/09827 ,  H05K2201/09854 ,  H05K2201/10416 ,  H05K2201/10734 ,  H05K2203/0307 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/85399 ,  H01L2224/05599

Abstract: A circuit substrate includes a core substrate having cavity penetrating through the core substrate, a metal block accommodated in the cavity of the core substrate, a first build-up layer including an insulating layer and laminated on first side of the core substrate such that the first build-up layer is covering the cavity on the first side of the core substrate, and a second build-up layer including an insulating layer and laminated on second side of the core substrate such that the second build-up layer is covering the cavity on the second side of the core substrate, and a filling resin filling gap formed between the cavity and block positioned in the cavity of the core substrate. The block has roughened surfaces such that the roughened surfaces are in contact with the insulating layers in the first and second build-up layers on the first and second sides of the core substrate.

Abstract translation: 电路基板包括具有穿透芯基板的空腔的芯基板，容纳在芯基板的空腔中的金属块，第一堆积层，其包括绝缘层，并且层压在芯基板的第一侧上，使得第一 堆积层覆盖芯基板的第一侧上的空腔，以及第二堆积层，其包括绝缘层，层压在芯基板的第二侧上，使得第二堆积层覆盖在芯 芯基板的第二侧，以及形成在位于芯基板的空腔内的空腔和块之间的填充树脂填充间隙。 该块具有粗糙化的表面，使得粗糙表面与芯基板的第一和第二侧上的第一和第二堆积层中的绝缘层接触。

公开(公告)号：US20160105957A1

公开(公告)日：2016-04-14

申请号：US14878096

申请日：2015-10-08

Applicant: IBIDEN CO., LTD.

Inventor： Mitsuhiro TOMIKAWA ,  Kota NODA ,  Nobuhisa KURODA ,  Haruhiko MORITA

IPC: H05K1/02 ,  H01G4/012 ,  H01G4/12 ,  H01G4/248 ,  H01G4/228 ,  H05K3/18 ,  H05K1/11 ,  H05K3/46 ,  H05K3/42 ,  H05K3/40 ,  H05K3/32 ,  H01G4/30 ,  H05K1/18

CPC classification number: H05K3/4697 ,  H01G2/06 ,  H01G4/12 ,  H01G4/232 ,  H01G4/30 ,  H01L23/3128 ,  H01L2224/16227 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73267 ,  H01L2225/1058 ,  H01L2924/15331 ,  H05K1/115 ,  H05K3/429 ,  H05K3/4644 ,  H05K2201/09545 ,  H05K2201/09827 ,  H05K2201/10015

Abstract: A wiring board with a built-in electronic component includes a substrate having a cavity, an interlayer insulating layer formed on the substrate such that the interlayer insulating layer is covering the cavity of the substrate, a conductor layer formed on the interlayer insulating layer, an electronic component accommodated in the cavity of the substrate and including a rectangular cuboid body and three terminal electrodes such that each of the three terminal electrodes has a metal film form formed on an outer surface of the rectangular cuboid body, and via conductors formed in the interlayer insulating layer such that the via conductors are connecting the conductor layer and the three terminal electrodes of the electronic component. The three terminal electrodes are arrayed in parallel on the outer surface of the rectangular cuboid body such that adjacent terminal electrodes have the opposite polarities.

Abstract translation: 具有内置电子部件的布线基板包括具有空腔的基板，形成在基板上的层间绝缘层，使得层间绝缘层覆盖基板的空腔，形成在层间绝缘层上的导体层， 电子部件容纳在基板的空腔中，并且包括矩形立方体和三个端子电极，使得三个端子电极中的每一个具有形成在矩形立方体的外表面上的金属膜形式，以及形成在中间层中的通孔导体 绝缘层，使得通孔导体连接电子部件的导体层和三个端子电极。 三个端子电极平行地排列在矩形立方体的外表面上，使得相邻的端子电极具有相反的极性。

公开(公告)号：US20160105966A1

公开(公告)日：2016-04-14

申请号：US14878072

申请日：2015-10-08

Applicant: IBIDEN CO., LTD.

Inventor： Mitsuhiro TOMIKAWA ,  Kota NODA ,  Nobuhisa KURODA ,  Haruhiko MORITA

IPC: H05K1/18 ,  H05K3/10 ,  H05K3/32 ,  H05K3/40 ,  H05K1/11 ,  H05K1/02

CPC classification number: H05K3/4697 ,  H01L2224/16227 ,  H01L2224/16265 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H05K1/141 ,  H05K1/185 ,  H05K3/0038 ,  H05K3/427 ,  H05K3/4602 ,  H05K3/4644 ,  H05K2201/10015 ,  H05K2203/1476 ,  H01L2924/00014 ,  H01L2224/32225 ,  H01L2924/00012

Abstract: A wiring board with a built-in electronic component includes a substrate having cavity, an insulating layer formed on the substrate such that the insulating layer is covering the cavity, a conductor layer formed on the insulating layer, and an electronic component accommodated in the cavity and including a rectangular cuboid body and terminal electrodes such that each electrode has a metal film form formed on outer surface of the body, and via conductors formed in the insulating layer such that the via conductors are connecting the conductor layer and electrodes. The electrodes are arrayed in a matrix having rows and columns such that adjacent electrodes in row and column directions have the opposite polarities, and the conductor layer includes a line pattern shunting first group of the electrodes in one polarity and a solid pattern shunting second group of the electrodes in the other polarity.

Abstract translation: 具有内置电子部件的布线基板包括具有空腔的基板，形成在基板上的绝缘层，使得绝缘层覆盖空腔，形成在绝缘层上的导体层和容纳在该空腔中的电子部件 并且包括矩形立方体和端子电极，使得每个电极具有形成在主体的外表面上的金属膜形式，以及形成在绝缘层中的通孔导体，使得通孔导体连接导体层和电极。 电极排列成具有列和列的矩阵，使得行和列方向上的相邻电极具有相反的极性，并且导体层包括以一个极性分流第一组电极的线图案和分离第二组的固体图案 电极处于另一极性。