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    Package structure
    4.
    发明授权
    Package structure 有权

    公开(公告)号：US11239146B2

    公开(公告)日：2022-02-01

    申请号：US16923554

    申请日：2020-07-08

    Applicant: Industrial Technology Research Institute

    Inventor： Chien-Min Hsu ,  Chih-Ming Shen

    IPC: H01L23/498 ,  H01L23/31 ,  H01L23/00

    Abstract: A package structure is provided. The package structure includes a substrate. The package structure also includes a hybrid pad disposed on the substrate. The hybrid pad includes a metal layer and a buffer layer connected to the metal layer. The Young's modulus of the buffer layer is less than the Young's modulus of the metal layer. The package structure further includes an electrically connecting structure disposed on the hybrid pad. The package structure includes a chip layer electrically connected to the electrically connecting structure. The package structure also includes a bonding pad disposed between the electrically connecting structure and the chip layer.

    Multi-layer circuit structure
    5.
    发明授权
    Multi-layer circuit structure 有权

    公开(公告)号：US10129974B2

    公开(公告)日：2018-11-13

    申请号：US15245202

    申请日：2016-08-24

    Applicant: Industrial Technology Research Institute ,  First Hi-tec Enterprise Co., Ltd. ,  NEXCOM International Co., Ltd.

    Inventor： Chien-Min Hsu ,  Min-Lin Lee ,  Huey-Ru Chang ,  Hung-I Liu ,  Ching-shan Chang

    IPC: H01P3/08 ,  H05K1/02 ,  H05K1/11

    Abstract: A multi-layer circuit structure includes a differential transmission line pair and at least one conductive pattern. The differential transmission line pair includes first and second transmission lines disposed side by side. Each of the first and second transmission lines includes first and second segments connected to each other. An spacing between the two first segments is non-fixed, and an spacing between the two second segments is fixed. A first zone is located between the two first segments, a second zone is opposite to the first zone and located outside the first segment of the first transmission line, and a third zone is opposite to the first zone and located outside the first segment of the second transmission line. The conductive pattern is coplanar with the differential transmission line pair and disposed on at least one of the first, second and third zones. The conductive pattern is electrically connected to a reference potential and electrically insulated from the differential transmission line pair.

    Embedded capacitor module
    6.
    发明授权
    Embedded capacitor module 有权
    嵌入式电容器模块

    公开(公告)号：US09013893B2

    公开(公告)日：2015-04-21

    申请号：US13896436

    申请日：2013-05-17

    Applicant: Industrial Technology Research Institute

    Inventor： Chien-Min Hsu ,  Min-Lin Lee ,  Cheng-Liang Cheng ,  Li-Duan Tsai

    IPC: H05K1/18 ,  H01L23/498 ,  H01L23/64 ,  H05K1/02 ,  H05K1/16 ,  H01L23/50 ,  H01L23/00 ,  H05K3/46 ,  H01G4/33

    CPC classification number: H05K1/185 ,  H01G4/33 ,  H01L23/49822 ,  H01L23/50 ,  H01L23/642 ,  H01L24/16 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2924/14 ,  H01L2924/19041 ,  H05K1/0231 ,  H05K1/162 ,  H05K3/4608 ,  H05K2201/0116 ,  H05K2201/0187 ,  H05K2201/09309 ,  H05K2203/0315

    Abstract: An embedded capacitor module includes an electrode lead-out portion and at least one solid electrolytic capacitor portion adjacently disposed with the electrode lead-out portion. The electrode lead-out portion comprises a first substrate, a second substrate, a first insulating material disposed between the first substrate and the second substrate, a first porous layer formed on at least one surface of the first substrate, and a first oxide layer disposed on the first porous layer. The solid electrolytic capacitor portion comprises the first substrate, the second substrate, the first porous layer, the first oxide layer, all of which are extended from the electrode lead-out portion, a first conductive polymer layer disposed on the first oxide layer, a first carbon layer disposed on the first conductive polymer layer, and a first conductive adhesive layer disposed on the first carbon layer.

    Abstract translation: 嵌入式电容器模块包括电极引出部分和与电极引出部分相邻设置的至少一个固体电解电容器部分。 电极引出部包括第一基板，第二基板，设置在第一基板和第二基板之间的第一绝缘材料，形成在第一基板的至少一个表面上的第一多孔层和设置在第一基板 在第一多孔层上。 固体电解电容器部分包括第一衬底，第二衬底，第一多孔层，第一氧化物层，它们全部从电极引出部分延伸出来，第一导电聚合物层设置在第一氧化物层上， 设置在第一导电聚合物层上的第一碳层和设置在第一碳层上的第一导电粘合剂层。

    EMBEDDED CAPACITOR MODULE
    8.
    发明申请
    EMBEDDED CAPACITOR MODULE 有权
    嵌入式电容器模块

    公开(公告)号：US20130248235A1

    公开(公告)日：2013-09-26

    申请号：US13896436

    申请日：2013-05-17

    Applicant: Industrial Technology Research Institute

    Inventor： Chien-Min Hsu ,  Min-Lin Lee ,  Cheng-Liang Cheng ,  Li-Duan Tsai

    IPC: H05K1/18

    CPC classification number: H05K1/185 ,  H01G4/33 ,  H01L23/49822 ,  H01L23/50 ,  H01L23/642 ,  H01L24/16 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2924/14 ,  H01L2924/19041 ,  H05K1/0231 ,  H05K1/162 ,  H05K3/4608 ,  H05K2201/0116 ,  H05K2201/0187 ,  H05K2201/09309 ,  H05K2203/0315

    Abstract: An embedded capacitor module includes an electrode lead-out portion and at least one solid electrolytic capacitor portion adjacently disposed with the electrode lead-out portion. The electrode lead-out portion comprises a first substrate, a second substrate, a first insulating material disposed between the first substrate and the second substrate, a first porous layer formed on at least one surface of the first substrate, and a first oxide layer disposed on the first porous layer. The solid electrolytic capacitor portion comprises the first substrate, the second substrate, the first porous layer, the first oxide layer, all of which are extended from the electrode lead-out portion, a first conductive polymer layer disposed on the first oxide layer, a first carbon layer disposed on the first conductive polymer layer, and a first conductive adhesive layer disposed on the first carbon layer.

    Abstract translation: 嵌入式电容器模块包括电极引出部分和与电极引出部分相邻设置的至少一个固体电解电容器部分。 电极引出部包括第一基板，第二基板，设置在第一基板和第二基板之间的第一绝缘材料，形成在第一基板的至少一个表面上的第一多孔层和设置在第一基板 在第一多孔层上。 固体电解电容器部分包括第一衬底，第二衬底，第一多孔层，第一氧化物层，它们全部从电极引出部分延伸出来，第一导电聚合物层设置在第一氧化物层上， 设置在第一导电聚合物层上的第一碳层和设置在第一碳层上的第一导电粘合剂层。

    Reconfigurable data bus system and method thereof
    10.
    发明授权
    Reconfigurable data bus system and method thereof 有权

    公开(公告)号：US11061694B2

    公开(公告)日：2021-07-13

    申请号：US16677301

    申请日：2019-11-07

    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

    Inventor： Chien-Min Hsu ,  Shih-Hsien Wu

    IPC: G06F9/445 ,  G06N3/08 ,  G06N3/04 ,  G06F13/20 ,  G06N3/063 ,  G06F13/40

    Abstract: A reconfigurable data bus system comprises a driver, a receiver, a data bus and a detector. The driver stores an electrical parameter data base. The electrical parameter data base includes a plurality of different signal-to-ground ratios and a plurality of signal quality parameters corresponding to the signal-to-ground ratios. The data bus includes a plurality of signal lines electrically connected between the driver and the receiver. The detector is electrically connected to the data bus and the driver. The detector is configured to detect a current signal quality parameter of the data bus and transmit the current signal quality parameter to the driver. The driver is selectively reconfigured a current signal-to-ground ratio according to a current signal quality parameter of the data bus and the electrical parameter database.

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