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    METHODS TO PREVENT FILLER ENTRAPMENT IN MICROELECTRONIC DEVICE TO MICROELECTRONIC SUBSTRATE INTERCONNECTION STRUCTURES
    4.
    发明申请
    METHODS TO PREVENT FILLER ENTRAPMENT IN MICROELECTRONIC DEVICE TO MICROELECTRONIC SUBSTRATE INTERCONNECTION STRUCTURES 审中-公开
    防止微电子器件填充微电子基板互连结构的方法

    公开(公告)号：US20150179479A1

    公开(公告)日：2015-06-25

    申请号：US14638328

    申请日：2015-03-04

    Applicant: INTEL CORPORATION

    Inventor： Manish Dubey ,  Rajendra C. Dias ,  Yonghao Xiu ,  Arjun Krishnan ,  Yiqun Bai ,  Purushothan Kaushik Muthur Srinath

    IPC: H01L21/56

    CPC classification number: H01L21/563 ,  H01L23/00 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: Embodiments of the present description include methods for attaching a microelectronic device to a microelectronic substrate with interconnection structures after disposing of an underfill material on the microelectronic device, wherein filler particless within the underfill material may be repelled away from the interconnection structures prior to connecting the microelectronic device to the microelectronic structure. These methods may include inducing a charge on the interconnection structures and may include placing the interconnection structures between opposing plates and producing a bias between the opposing plates after depositing the underfill material on the interconnection structures.

    Abstract translation: 本说明书的实施例包括在微电子器件上处理底部填充材料之后将微电子器件附着到具有互连结构的微电子衬底的方法，其中，在将微电子器件连接到微电子器件之前，底部填充材料内的填料颗粒可能被排除离开互连结构 器件到微电子结构。 这些方法可以包括在互连结构上引入电荷，并且可以包括将互连结构放置在相对的板之间，并且在将底部填充材料沉积在互连结构上之后在相对的板之间产生偏压。

    PROCESSES AND METHODS FOR APPLYING UNDERFILL TO SINGULATED DIE
    6.
    发明申请
    PROCESSES AND METHODS FOR APPLYING UNDERFILL TO SINGULATED DIE 审中-公开

    公开(公告)号：US20180286704A1

    公开(公告)日：2018-10-04

    申请号：US15477053

    申请日：2017-04-01

    Applicant: Intel Corporation

    Inventor： Elizabeth M. Nofen ,  Arjun Krishnan ,  James C. Matayabas, JR. ,  Venmathy McMahan ,  Nisha Ananthakrishnan ,  Yonghao Xiu

    IPC: H01L21/56 ,  H01L21/66 ,  H01L21/67 ,  H01L21/782 ,  H01L21/82

    Abstract: A process for applying an underfill material to a die is disclosed. A wafer is diced into a plurality of dies (without having any underfill film thereon) such that the dies have exposed bumps prior to an underfill process. Thus, the dies can be tested about their bump-sides because the bumps are entirely exposed for testing. The dies are then reconstituted bump-side up on a carrier panel in an array such that the dies are separated from each other by a gap. Underfill material (e.g., epoxy flux film) is then vacuum laminated to the carrier panel and the plurality of dies to encapsulate the dies. The underfill material is then cut between adjacent dies such that a portion of the underfill material covers at least one side edge of each die. The encapsulated dies are then removed from the carrier panel, thereby being prepared for a thermal bonding process to a substrate. Associated devices are provided.

    STIFFENER TAPE FOR ELECTRONIC ASSEMBLY
    8.
    发明申请
    STIFFENER TAPE FOR ELECTRONIC ASSEMBLY 有权
    电子组装用强化胶带

    公开(公告)号：US20160172229A1

    公开(公告)日：2016-06-16

    申请号：US14568552

    申请日：2014-12-12

    Applicant: Intel Corporation

    Inventor： Xavier Brun ,  Arjun Krishnan ,  Mohit Mamodia ,  Dingying Xu

    IPC: H01L21/683 ,  H01L21/304 ,  H01L21/78

    CPC classification number: H01L21/6836 ,  H01L21/304 ,  H01L21/78 ,  H01L23/562 ,  H01L2221/68327 ,  H01L2221/68331 ,  H01L2221/6834 ,  H01L2221/68377 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: Some example forms relate to a stiffener tape for a wafer. The stiffener tape includes a mounting tape and a stiffener removably attached to the mounting tape. The stiffener tape further includes a die attach film attached to the stiffener. Other example forms relate to an electronic assembly that includes a wafer and a stiffener tape attached to the wafer. The stiffener tape includes a die attach film mounted to the wafer. A stiffener is attached to the die attach film and a mounting tape is removably attached to the stiffener. Still other example forms relate to a method that includes forming a stiffener tape which includes a mounting tape, a stiffener removably attached to the mounting tape and a die attach film attached to the stiffener.

    Abstract translation: 一些示例性形式涉及用于晶片的加强带。 加强筋包括可拆卸地附接到安装带的安装带和加强件。 加强筋还包括附着在加强件上的管芯附着膜。 其他示例性形式涉及包括晶片和附接到晶片的加强筋的电子组件。 加强筋包括安装在晶片上的管芯附着膜。 加强件附接到管芯附着膜，并且安装带可拆卸地附接到加强件。 另一个示例形式涉及一种方法，其包括形成加强带，该加强带包括安装带，可移除地附接到安装带的加强件和附接到加强件的管芯附着膜。

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