公开(公告)号：US20040113239A1

公开(公告)日：2004-06-17

申请号：US10321874

申请日：2002-12-17

Applicant: Intel Corporation

Inventor： Victor Prokofiev ,  Henning Braunisch

IPC: H01L029/80 ,  H01L031/112 ,  H01L039/00

CPC classification number: H01L23/66 ,  H01L23/48 ,  H01L23/5225 ,  H01L24/81 ,  H01L24/85 ,  H01L2223/6627 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/81801 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2924/12044 ,  H01L2924/1903 ,  H01L2924/19033 ,  H01L2924/3011 ,  H01L2224/48 ,  H01L2224/05599 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

Abstract: A contact-less high-speed signaling interface and method provide for the communication of high-speed signals across an interface, such as a die-substrate interface or die-die interface. The interface includes a transmission-line structure disposed on a dielectric medium to carry a high-speed forward incident signal, and another transmission-line structure disposed on another dielectric medium and substantially aligned with the other transmission-line structure to generate a coupled high-speed signal in a direction opposite to the incident signal.

Abstract translation: 无接触式高速信号接口和方法提供跨接口的高速信号的通信，诸如管芯基板接口或管芯接口。 该接口包括布置在电介质上以传送高速正向入射信号的传输线结构，以及另一传输线结构，其设置在另一介质介质上并基本上与另一传输线结构对准， 速度信号在与入射信号相反的方向上。

公开(公告)号：US20030045083A1

公开(公告)日：2003-03-06

申请号：US09946749

申请日：2001-09-05

Applicant: Intel Corporation

Inventor： Steven Towle ,  John Tang ,  John S. Cuendet ,  Henning Braunisch ,  Thomas S. Dory

IPC: H01L021/44

CPC classification number: H01L23/5389 ,  H01L23/49838 ,  H01L24/19 ,  H01L24/82 ,  H01L2224/04105 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01058 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/15173 ,  H01L2924/18162 ,  H01L2924/19041 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/00

Abstract: A low cost microelectronic circuit package includes a single build up metallization layer above a microelectronic die. At least one die is fixed within a package core using, for example, an encapsulation material. A single metallization layer is then built up over the die/core assembly. The metallization layer includes a number of landing pads having a pitch that allows the microelectronic device to be directly mounted to an external circuit board. In one embodiment, the metallization layer includes a number of signal landing pads within a peripheral region of the layer and at least one power landing pad and one ground landing pad toward a central region of the layer.

Abstract translation: 低成本微电子电路封装包括在微电子管芯上方的单个堆积金属化层。 使用例如封装材料将至少一个管芯固定在封装芯内。 然后在模具/芯组件上构建单个金属化层。 金属化层包括许多具有允许微电子器件直接安装到外部电路板的间距的着陆焊盘。 在一个实施例中，金属化层包括在该层的外围区域内的多个信号着陆焊盘以及朝向该层的中心区域的至少一个电源着陆焊盘和一个接地焊盘。