公开(公告)号：US20030045083A1

公开(公告)日：2003-03-06

申请号：US09946749

申请日：2001-09-05

Applicant: Intel Corporation

Inventor： Steven Towle ,  John Tang ,  John S. Cuendet ,  Henning Braunisch ,  Thomas S. Dory

IPC: H01L021/44

CPC classification number: H01L23/5389 ,  H01L23/49838 ,  H01L24/19 ,  H01L24/82 ,  H01L2224/04105 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01058 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/15173 ,  H01L2924/18162 ,  H01L2924/19041 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/00

Abstract: A low cost microelectronic circuit package includes a single build up metallization layer above a microelectronic die. At least one die is fixed within a package core using, for example, an encapsulation material. A single metallization layer is then built up over the die/core assembly. The metallization layer includes a number of landing pads having a pitch that allows the microelectronic device to be directly mounted to an external circuit board. In one embodiment, the metallization layer includes a number of signal landing pads within a peripheral region of the layer and at least one power landing pad and one ground landing pad toward a central region of the layer.

Abstract translation: 低成本微电子电路封装包括在微电子管芯上方的单个堆积金属化层。 使用例如封装材料将至少一个管芯固定在封装芯内。 然后在模具/芯组件上构建单个金属化层。 金属化层包括许多具有允许微电子器件直接安装到外部电路板的间距的着陆焊盘。 在一个实施例中，金属化层包括在该层的外围区域内的多个信号着陆焊盘以及朝向该层的中心区域的至少一个电源着陆焊盘和一个接地焊盘。