公开(公告)号：US20070091704A1

公开(公告)日：2007-04-26

申请号：US11437846

申请日：2006-05-19

Applicant: Siva RaghuRam ,  Josef Schuster ,  Simon Muff ,  Abdallah Bacha

Inventor： Siva RaghuRam ,  Josef Schuster ,  Simon Muff ,  Abdallah Bacha

IPC: G11C7/00

CPC classification number: H05K1/181 ,  G11C5/04 ,  G11C5/063 ,  H05K2201/09409 ,  H05K2201/09418 ,  Y02P70/611

Abstract: In a first embodiment, the invention provides a memory module having an electronic printed circuit board and a plurality of semiconductor chips of the same type that are mounted on at least one outer face of the printed circuit board. The printed circuit board has a connector strip, which runs at a first edge of the at least one outer face in a first direction and has a multiplicity of electrical contacts that are lined up in the first direction. The printed circuit board extends in the first direction between two opposite second edges. At least nine of the semiconductor chips of the same type are respectively mounted next to one another on the outer face of the printed circuit board between the center of the printed circuit board and the respective second edge of the printed circuit board. The semiconductor chips of the same type respectively have a smaller dimension and, in the direction perpendicular to the smaller dimension, a larger dimension that is larger than the smaller dimension. A respective first group of four of the semiconductor chips of the same type, which are oriented so as to have their shorter dimension parallel to the connector strip, is arranged at the respective second edge of the printed circuit board. A second group of five semiconductor chips of the same type is respectively arranged between the first group of semiconductor chips and the center of the printed circuit board. The first group of semiconductor chips and the second group of semiconductor chips are actuated by two separate line buses whose conductor tracks branch toward all the semiconductor chips in the respective group of semiconductor chips.

Abstract translation: 在第一实施例中，本发明提供一种具有电子印刷电路板和安装在印刷电路板的至少一个外表面上的相同类型的多个半导体芯片的存储模块。 印刷电路板具有一个连接器条，其在第一方向的至少一个外表面的第一边缘处延伸，并且具有在第一方向上排列的多个电触点。 印刷电路板沿第一方向在两个相对的第二边缘之间延伸。 在印刷电路板的中心和印刷电路板的相应第二边缘之间，相同类型的至少九个半导体芯片分别彼此相邻地安装在印刷电路板的外表面上。 相同类型的半导体芯片分别具有较小的尺寸，并且在垂直于较小尺寸的方向上具有大于较小尺寸的较大尺寸。 在印刷电路板的相应第二边缘处布置相同类型的四个半导体芯片的相应的第一组，其被定向成具有与连接器条平行的较短尺寸。 第一组相同类型的五个半导体芯片分别布置在第一组半导体芯片和印刷电路板的中心之间。 第一组半导体芯片和第二组半导体芯片由两条单独的线路总线驱动，其导体轨迹分支到相应的半导体芯片组中的所有半导体芯片。

公开(公告)号：US20070158827A1

公开(公告)日：2007-07-12

申请号：US11640465

申请日：2006-12-15

Applicant: Josef Schuster

Inventor： Josef Schuster

IPC: H01L23/34

CPC classification number: H05K1/181 ,  G11C5/04 ,  G11C5/063 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2924/01068 ,  H05K1/023 ,  H05K2201/09709 ,  H05K2201/10545 ,  H05K2201/10734 ,  Y02P70/611

Abstract: An electronic device is provided, in which semiconductor components are structurally identical among one another and have two groups of contact connections arranged on opposite main areas on a printed circuit board. Components are arranged in a manner laterally offset in a direction parallel to the printed circuit board area in such a way that, on opposite main areas, a group of first contact connections of a semiconductor component fitted on one main area is in each case arranged in the same region of the printed circuit board as a group of first contact connections of a semiconductor chip arranged on the opposite main area. Likewise, the groups of second contact connections of the semiconductor chips arranged on opposite main areas in each case attain congruence.

Abstract translation: 提供了一种电子器件，其中半导体部件在结构上彼此相同并且具有布置在印刷电路板上的相对主要区域上的两组接触连接。 组件以与印刷电路板区域平行的方向横向偏移地布置，使得在相对的主要区域上，安装在一个主区域上的半导体部件的一组第一接触连接分别布置在 作为布置在相对主区域上的半导体芯片的一组第一接触连接的印刷电路板的相同区域。 类似地，布置在相对主要区域上的半导体芯片的第二接触连接组在每种情况下都达到一致。

公开(公告)号：US20100034965A1

公开(公告)日：2010-02-11

申请号：US12186727

申请日：2008-08-06

Applicant: Richard C. Retallick ,  Werner Rau ,  Josef Schuster

Inventor： Richard C. Retallick ,  Werner Rau ,  Josef Schuster

IPC: H05K3/00

CPC classification number: H05K3/424 ,  H05K3/427 ,  H05K2201/0323 ,  H05K2203/0143 ,  H05K2203/082

Abstract: An improved method of providing a carbon dispersion coating on surfaces of a substrate in a direct metallization process, wherein the substrate comprises conductive and non-conductive portions. The method comprises the steps of contacting the substrate with the carbon dispersion to coat the substrate with the carbon-containing dispersion and at least one of moving a non-absorbent roller over at least a portion of a substantially planar surface of the substrate to remove excess carbon dispersion from the substantially planar surface of the substrate and passing the substrate through a vacuum extraction chamber to extract excess carbon dispersion remaining on surfaces of the substrate. The method provides cleaner copper surfaces to minimize the microetch requirement and also prevents the carbon dispersion from undesirably redepositing on surfaces of the substrate.

Abstract translation: 一种在直接金属化工艺中在基底的表面上提供碳分散体涂层的改进方法，其中所述基底包括导电部分和非导电部分。 该方法包括以下步骤：使基底与碳分散体接触以将基底与含碳分散体一起涂覆，以及将非吸收性辊移动到基材的基本平坦表面的至少一部分上的至少一种以除去过量的 从基底的基本上平坦的表面上分离出碳，并使基底通过真空提取室，以提取留在基底表面上的多余的碳分散体。 该方法提供更清洁的铜表面以最小化微蚀刻需要，并且还防止碳分散体不希望地重新沉积在基底表面上。

公开(公告)号：US20070096302A1

公开(公告)日：2007-05-03

申请号：US11439443

申请日：2006-05-24

Applicant: Josef Schuster

Inventor： Josef Schuster

IPC: H01L23/34

CPC classification number: H05K1/181 ,  G11C5/00 ,  H01L2924/0002 ,  H05K2201/09409 ,  H05K2201/097 ,  Y02P70/611 ,  Y10T29/49133 ,  H01L2924/00

Abstract: A semiconductor memory module includes an electronic printed circuit board with a contact strip and a plurality of semiconductor memory chips of identical type that are mounted on at least one external area of the printed circuit board. The semiconductor memory chips are rectangular in shape and are arranged, in at least two rows with the adjacent chips being oriented perpendicular to one another, such that the area used on the PC board is optimized.

Abstract translation: 半导体存储器模块包括具有接触条的电子印刷电路板和安装在印刷电路板的至少一个外部区域上的相同类型的多个半导体存储器芯片。 半导体存储器芯片的形状为矩形，并且布置成至少两行，其中相邻的芯片彼此垂直定向，使得在PC板上使用的区域被优化。

公开(公告)号：US08758537B2

公开(公告)日：2014-06-24

申请号：US13087431

申请日：2011-04-15

Applicant: Hans Oelkrug ,  Josef Schuster

Inventor： Hans Oelkrug ,  Josef Schuster

IPC: B32B37/00

CPC classification number: C30B33/06 ,  Y10T156/1052

Abstract: A method for producing a plurality of semiconductor wafers includes processing a single crystal. The single crystal is provided in a grown state and has a central longitudinal axis with an orientation that deviates from a sought orientation of a crystal lattice of the semiconductor wafers. A block is sliced from the single crystal along cutting planes perpendicular to a crystallographic axis corresponding to the sought orientation of the crystal lattice of the semiconductor wafers. A lateral surface of the block is ground around the crystallographic axis. A plurality of semiconductor wafers are then sliced from the ground block along cutting planes perpendicular to the crystallographic axis.

Abstract translation: 用于制造多个半导体晶片的方法包括处理单晶。 单晶以生长状态提供，并且具有偏离半导体晶片的晶格的所要求取向的取向的中心纵轴。 沿着垂直于对应于半导体晶片的晶格的所需取向的结晶轴的切割平面将单块切割成单晶。 块的侧表面围绕结晶轴研磨。 然后从垂直于结晶轴的切割平面从接地块切割多个半导体晶片。

公开(公告)号：US07315454B2

公开(公告)日：2008-01-01

申请号：US11439443

申请日：2006-05-24

Applicant: Josef Schuster

Inventor： Josef Schuster

IPC: H05K7/02

CPC classification number: H05K1/181 ,  G11C5/00 ,  H01L2924/0002 ,  H05K2201/09409 ,  H05K2201/097 ,  Y02P70/611 ,  Y10T29/49133 ,  H01L2924/00

Abstract: A semiconductor memory module includes an electronic printed circuit board with a contact strip and a plurality of semiconductor memory chips of identical type that are mounted on at least one external area of the printed circuit board. The semiconductor memory chips are rectangular in shape and are arranged, in at least two rows with the adjacent chips being oriented perpendicular to one another, such that the area used on the PC board is optimized.

Abstract translation: 半导体存储器模块包括具有接触条的电子印刷电路板和安装在印刷电路板的至少一个外部区域上的相同类型的多个半导体存储器芯片。 半导体存储器芯片的形状为矩形，并且布置成至少两行，其中相邻的芯片彼此垂直定向，使得在PC板上使用的区域被优化。

公开(公告)号：US06837924B2

公开(公告)日：2005-01-04

申请号：US10328635

申请日：2002-12-24

Applicant: Johann Breindl ,  Heinrich Schnorrer ,  Josef Eichhammer ,  Josef Schuster ,  Heidi Hummel

Inventor： Johann Breindl ,  Heinrich Schnorrer ,  Josef Eichhammer ,  Josef Schuster ,  Heidi Hummel

IPC: C08K5/00 ,  C08K7/22 ,  C08L91/08

CPC classification number: C08K5/0041 ,  C08K7/22 ,  C08L91/06

Abstract: A modeling composition consisting of a wax-based and oil-based binder, a filler, and a coloring agent, wherein the filler is substantially a light filler comprised of hollow microbeads. The binder is comprised of solid wax, pasty wax, and a liquid component of a wax base, an oil base, or a wax and oil base. The binder is present in the modeling composition in an amount of 45 to 90% by weight. The modeling composition can be used as play dough for children or as a therapeutic composition in the medical field for training and rehabilitation.

Abstract translation: 由蜡基和油基粘合剂，填料和着色剂组成的建模组合物，其中填料基本上是由中空微珠组成的轻填料。 粘合剂由固体蜡，糊状蜡和蜡基，油基或蜡和油基的液体组分组成。 粘合剂以45〜90重量％的量存在于建模组合物中。 该模型组合物可用作儿童游乐面，或作为医疗领域的治疗组合用于训练和康复。

公开(公告)号：US08282761B2

公开(公告)日：2012-10-09

申请号：US12579127

申请日：2009-10-14

Applicant: Alexander Rieger ,  Hans Oelkrug ,  Josef Schuster

Inventor： Alexander Rieger ,  Hans Oelkrug ,  Josef Schuster

IPC: B28D1/02 ,  B32B38/04

CPC classification number: B28D5/0082 ,  B28D5/045 ,  Y10T83/0405 ,  Y10T156/1052 ,  Y10T428/192

Abstract: A method for simultaneously cutting a compound rod of semiconductor material into a multiplicity of wafers. The method includes selecting a first workpiece and a second workpiece, each having two end surfaces; grinding at least one of the two end surfaces of each workpiece so as to create a ground end surface on each workpiece; cementing the ground end surface of the first workpiece to the ground end surface of second workpiece using a fastener so as to produce a compound rod piece having a longitudinal axis, wherein the fastener is disposed between the workpieces so as create a distance between the workpieces; fixing the compound rod piece in a longitudinal direction on a mounting plate; clamping the mounting plate with the compound rod piece in a wire saw; and cutting the compound rod piece perpendicularly to the longitudinal axis using the wire saw.

Abstract translation: 一种同时将半导体材料的复合棒切割成多个晶片的方法。 该方法包括：选择具有两个端面的第一工件和第二工件; 研磨每个工件的两个端面中的至少一个，以在每个工件上形成接地端面; 使用紧固件将第一工件的接地端面固定到第二工件的接地端面，以便制造具有纵向轴线的复合杆件，其中紧固件设置在工件之间，以便在工件之间产生距离; 将复合杆件沿长度方向固定在安装板上; 将复合杆件的安装板夹在线锯中; 并使用线锯将复合杆件垂直于纵向轴线切割。

公开(公告)号：US20110265940A1

公开(公告)日：2011-11-03

申请号：US13087431

申请日：2011-04-15

Applicant: Hans Oelkrug ,  Josef Schuster

Inventor： Hans Oelkrug ,  Josef Schuster

IPC: B32B38/10 ,  B24B1/00

CPC classification number: C30B33/06 ,  Y10T156/1052

Abstract: A method for producing a plurality of semiconductor wafers includes processing a single crystal. The single crystal is provided in a grown state and has a central longitudinal axis with an orientation that deviates from a sought orientation of a crystal lattice of the semiconductor wafers. A block is sliced from the single crystal along cutting planes perpendicular to a crystallographic axis corresponding to the sought orientation of the crystal lattice of the semiconductor wafers. A lateral surface of the block is ground around the crystallographic axis. A plurality of semiconductor wafers are then sliced from the ground block along cutting planes perpendicular to the crystallographic axis.

Abstract translation: 用于制造多个半导体晶片的方法包括处理单晶。 单晶以生长状态提供，并且具有偏离半导体晶片的晶格的所要求取向的取向的中心纵轴。 沿着垂直于对应于半导体晶片的晶格的所需取向的结晶轴的切割平面将单块切割成单晶。 块的侧表面围绕结晶轴研磨。 然后从垂直于结晶轴的切割平面从接地块切割多个半导体晶片。

公开(公告)号：US20100089209A1

公开(公告)日：2010-04-15

申请号：US12579127

申请日：2009-10-14

Applicant: Alexander Rieger ,  Hans Oelkrug ,  Josef Schuster

Inventor： Alexander Rieger ,  Hans Oelkrug ,  Josef Schuster

IPC: B28D5/00 ,  B26D7/27 ,  B32B3/00

CPC classification number: B28D5/0082 ,  B28D5/045 ,  Y10T83/0405 ,  Y10T156/1052 ,  Y10T428/192

Abstract: A method for simultaneously cutting a compound rod of semiconductor material into a multiplicity of wafers. The method includes selecting a first workpiece and a second workpiece, each having two end surfaces; grinding at least one of the two end surfaces of each workpiece so as to create a ground end surface on each workpiece; cementing the ground end surface of the first workpiece to the ground end surface of second workpiece using a fastener so as to produce a compound rod piece having a longitudinal axis, wherein the fastener is disposed between the workpieces so as create a distance between the workpieces; fixing the compound rod piece in a longitudinal direction on a mounting plate; clamping the mounting plate with the compound rod piece in a wire saw; and cutting the compound rod piece perpendicularly to the longitudinal axis using the wire saw.

Abstract translation: 一种同时将半导体材料的复合棒切割成多个晶片的方法。 该方法包括：选择具有两个端面的第一工件和第二工件; 研磨每个工件的两个端面中的至少一个，以在每个工件上形成接地端面; 使用紧固件将第一工件的接地端面固定到第二工件的接地端面，以便制造具有纵向轴线的复合杆件，其中紧固件设置在工件之间，以便在工件之间产生距离; 将复合杆件沿长度方向固定在安装板上; 将复合杆件的安装板夹在线锯中; 并使用线锯将复合杆件垂直于纵向轴线切割。