公开(公告)号：US20190200457A1

公开(公告)日：2019-06-27

申请号：US16212156

申请日：2018-12-06

Applicant: KEMET Electronics Corporation

Inventor： James A. Burk ,  John Bultitude ,  Galen W. Miller

IPC: H05K1/18 ,  H01G4/30 ,  H03H7/01 ,  H05K1/02 ,  H05K3/30 ,  H01G4/228

CPC classification number: H05K1/18 ,  H01G4/228 ,  H01G4/232 ,  H01G4/30 ,  H01G4/38 ,  H03H7/0115 ,  H05K1/028 ,  H05K1/181 ,  H05K3/30 ,  H05K3/3442 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/1003 ,  H05K2201/10053 ,  H05K2201/1006 ,  H05K2201/10151 ,  H05K2201/10174 ,  H05K2201/10181 ,  H05K2201/10196 ,  H05K2201/10515 ,  H05K2201/10636

Abstract: A high density multi-component package is provided. The package has at least two electronic components wherein each electronic component comprises a first external termination and a second external termination. At least one first adhesive is between adjacent first external terminations of adjacent electronic components. At least one second adhesive is between the adjacent electronic component and at least two adjacent electronic components are connected serially. The first adhesive and second adhesive are independently selected from a high temperature conductive adhesive and a high temperature insulating adhesive

公开(公告)号：US11744018B2

公开(公告)日：2023-08-29

申请号：US17147908

申请日：2021-01-13

Applicant: KEMET Electronics Corporation

Inventor： John Bultitude ,  Peter Alexandre Blais ,  James A. Burk ,  Galen W. Miller ,  Hunter Hayes ,  Allen Templeton ,  Lonnie G. Jones ,  Mark R. Laps

IPC: H05K1/18 ,  H01G4/38 ,  H05K1/14 ,  H05K1/02 ,  H05K3/32 ,  H01L29/20 ,  H01G4/30 ,  H01L25/07 ,  H01L29/16

CPC classification number: H05K1/181 ,  H01G4/38 ,  H05K1/0272 ,  H05K1/145 ,  H05K3/328 ,  H01G4/30 ,  H01L25/072 ,  H01L29/1608 ,  H01L29/2003 ,  H05K2201/10015 ,  H05K2201/10166 ,  H05K2201/10545

Abstract: Provided is a high-density multi-component package comprising a first module interconnect pad and a second module interconnect pad. At least two electronic components are mounted to and between the first module interconnect pad and the second module interconnect pad wherein a first electronic component is vertically oriented relative to the first module interconnect pad. A second electronic component is vertically oriented relative to the second module interconnect pad.

公开(公告)号：US20210227693A1

公开(公告)日：2021-07-22

申请号：US17147908

申请日：2021-01-13

Applicant: KEMET Electronics Corporation

Inventor： John Bultitude ,  Peter Alexandre Blais ,  James A. Burk ,  Galen W. Miller ,  Hunter Hayes ,  Allen Templeton ,  Lonnie G. Jones ,  Mark R. Laps

IPC: H05K1/18 ,  H01G4/38 ,  H05K1/14 ,  H05K1/02 ,  H05K3/32

Abstract: Provided is a high-density multi-component package comprising a first module interconnect pad and a second module interconnect pad. At least two electronic components are mounted to and between the first module interconnect pad and the second module interconnect pad wherein a first electronic component is vertically oriented relative to the first module interconnect pad. A second electronic component is vertically oriented relative to the second module interconnect pad.

公开(公告)号：US10757811B2

公开(公告)日：2020-08-25

申请号：US16212156

申请日：2018-12-06

Applicant: KEMET Electronics Corporation

Inventor： James A. Burk ,  John Bultitude ,  Galen W. Miller

IPC: H05K3/00 ,  H05K1/18 ,  H01G4/30 ,  H03H7/01 ,  H05K1/02 ,  H05K3/30 ,  H01G4/228 ,  H01G4/232 ,  H01G4/38 ,  H05K3/34

Abstract: A high density multi-component package is provided. The package has at least two electronic components wherein each electronic component comprises a first external termination and a second external termination. At least one first adhesive is between adjacent first external terminations of adjacent electronic components. At least one second adhesive is between the adjacent electronic component and at least two adjacent electronic components are connected serially. The first adhesive and second adhesive are independently selected from a high temperature conductive adhesive and a high temperature insulating adhesive.